Die Bonder suits semiconductor/electronic packaging markets.
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Press Release Summary:
Able to provide assembly solutions for epoxy die attach, eutectic, and flip chip bonding, MRSI-605 AP Advanced Packaging Die Bonder is based on MRSI-505 platform. Machine includes 6-head, feather-touch tool turret that rotates through full 360° of orientation to align dies no matter how they are presented to system. It also provides feather touch force control with closed loop force feedback, Windows® GUI, XML formatted database, and various vision tools.
Original Press Release:
Newport Corporation Introduces MRSI-605 AP Die Bonder; Debuts at Semicon West 2003
North Billerica, Massachusetts, USA - Newport Corporation launches its next generation die bonding product offering with the introduction of the MRSI-605 AP Advanced Packaging Die Bonder. This system provides advanced assembly solutions for epoxy die attach, eutectic, and flip chip bonding. The MRSI-605 is targeted to end users in the semiconductor and electronic packaging markets, including manufacturers of MEMS, advanced semiconductor packages, multi-chip modules, military & defense hybrids, microwave & RF circuits, and photonics packages.
The MRSI-605 AP design is based on the high performance industry standard MRSI-505 platform. The solid granite platform supports the placement head from above, so that no mechanisms are cantilevered, providing optimal stability. The thermally and mechanically stable machine delivers 10 micron placement accuracy. Newport has taken the industry's production-proven MRSI 505 platform and enhanced its hardware and software to provide exciting new process capabilities.
The innovative six head "feather-touch" tool turret delivers increased cycle rates in die bonding and component assembly processes. This enhancement makes six separate tools always available on the robot head, thus allowing tool change to occur "on the fly" while moving from process point to process point, eliminating overhead time. The turret rotates through a full 360 degrees of orientation to align the die no matter how they are presented to the system. The combination of tool changes on the fly, and independence on die alignment reduces the overall processing time by as much as 40%.
The system's "feather touch" force control with closed loop force feedback provides the ability to handle fragile devices, such as GaAs and InP die without damage to internal features. Advanced vision provides the ability and flexibility to do local top surface alignments as well as alignment to bottom features. The MRSI 605 AP is compatible with all standard material presentation methods include waffle packs, Gel-Paks, and standard wafers
The Windows® graphical user interface drives the MRSI-605, providing extensive functionality and flexibility. The XML formatted database allows for simple manipulation and offline line programming. New vision tools such as a mouse-adjustable region of interest, enhanced gain control and filters, and pattern matching enable vision processing of the most challenging substrate and die materials. CAD download, automatic program selection based on the bar code of an incoming boat, full traceability and network connectivity mean that very little machine time is devoted to programming; thus, high productivity can be achieved.
Kevin Crofton, Vice President and General Manager of Newport's Advanced Packaging and Automation Systems Division, stated, "We are excited about the introduction of the Newport MRSI-605 AP and the advanced process capability we are able to offer our customers. Newport also offers its several programs for upgrade and trade-in of older MRSI products, such as the MRSI-505. For example, our 605 upgrade package for the MRSI 505 and other attractive equipment trade-in programs give our customers the opportunity to extend the useful life of their installed equipment - gaining line and device yields while preserving their capital investment."
Newport Corporation is a leading global supplier of advanced technology products and systems to the semiconductor, communications, electronics and research markets. The company provides components and integrated subsystems to manufacturers of semiconductor processing equipment, advanced automated assembly and test systems to manufacturers of communications and electronics devices, and a broad array of high-precision components and instruments to commercial, academic and government customers worldwide. Newport's innovative solutions leverage its expertise in precision robotics and automation, sub-micron positioning systems, vibration isolation and optical subsystems to enhance the capabilities and productivity of its customers' manufacturing, engineering and research applications. Newport is part of the Standard & Poor's Midcap 400 Index and the Russell 2000 Index. For more information, visit www.newport.com, or contact the company at 1791 Deere Avenue, Irvine, California, USA, 92606, Tel. (In U.S.) (800) 222-6440; Tel: (949) 863-3144; Fax: (949) 253-1680.
