Flip Chip Bonder offers 8 micron placement accuracy.
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Press Release Summary:
Mach FC Plus is based on parallel processing, gantry machine platform designed for high-speed bonding. Picking, flipping, fluxing, vision alignment, and controlled die placement are performed with asynchronous parallel motion. Automatic 300 mm wafer changer is compatible with wafer cassette docking carts. Bonder includes closed-loop placement force control, flux dipping station, up to 53 mm² die handling capability, and advanced vision and lighting.
Original Press Release:
Newport Introduces New Flip Chip Bonder at Semicon Taiwan; High Performance Platform for 300mm Wafers
North Billerica, Massachusetts, USA -- Newport Corporation announces the debut of the "Mach FC Plus" high speed, automated flip chip bonder at SEMICON Taiwan 2003. The "Mach FC Plus" is part of Newport's Advanced Assembly and Packaging Equipment portfolio and can be seen in the Jipal booth, its Taiwan distributor, booth 1038 in Exhibition Hall I, Taipei World Trade Center, Taipei, Taiwan, September 15-17, 2003.
The "Mach FC Plus" is based upon a unique, parallel processing gantry, machine platform designed specifically for high speed flip chip bonding. The patent pending machine platform is the result of a collaborative effort between various Newport Corporation divisions with expertise in die bonding, precision motion control and robotics. The "Mach FC Plus" performs parallel processing of flip chip devices to achieve high throughput. The various process steps of picking, flipping, fluxing, vision alignment and controlled die placement are performed with asynchronous parallel motion, thus maximizing throughput. Some of its many advanced features include 8 micron placement accuracy, an automatic 300mm wafer changer compatible with industry standard wafer cassette docking carts, state-of-the-art wafer picking with flipper, closed-loop placement force control, patent pending flux dipping station, up to 53mm square large die handling capability and advanced vision and lighting.
Kevin Crofton, Vice President And General Manager of Newport's APAS division, said, "The demand for Flip Chip technology is being driven by a number of factors including the need for smaller, lighter, more cost effective packaging with a larger number of interconnects. The "Mach FC Plus" features a revolutionary system design that allows multiple operations to be performed simultaneously, thus delivering the best performance in the industry. This further extends our product portfolio for assembly and dispensing systems used in the semiconductor and microelectronics industries. The "Mach FC Plus" flip chip die bonder and the MRSI 175 UF underfill dispenser are two of our key products focused on productivity gains in flip chip manufacturing."
Newport Corporation is a leading global supplier of advanced technology products and systems to the semiconductor, communications, electronics and research markets. The company provides components and integrated subsystems to manufacturers of semiconductor processing equipment, advanced automated assembly and test systems to manufacturers of communications and electronics devices, and a broad array of high-precision components and instruments to commercial, academic and government customers worldwide. Newport's innovative solutions leverage its expertise in precision robotics and automation, sub-micron positioning systems, vibration isolation and optical subsystems to enhance the capabilities and productivity of its customers' manufacturing, engineering and research applications. Newport is part of the Standard & Poor's Midcap 400 Index and the Russell 2000 Index. For more information, visit www.newport.com, or contact the company at 1791 Deere Avenue, Irvine, California, USA, 92606, Tel. (In U.S.) (800) 222-6440; Tel: (949) 863-3144; Fax: (949) 253-1680.
