Underfill Dispenser is suited for Flip Chip assembly.
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Press Release Summary:
Model MRSI-175UF is available with single or dual dispense heads, rotary or linear positive displacement pumps with typical Cpk performance in excess of 1.33, and single or dual conveyors that incorporate universal fixturing. System uses closed-loop, encoder-based control feedback and offers parallel processing conveyors that reduce time associated with preheat, load, unload, transfer, and underfill material flow.
Original Press Release:
Newport's MRSI-175UF Underfill Dispenser offers Highest Throughput for Flip Chip Underfill
North Billerica, Massachusetts, USA - Newport Corporation's MRSI-175UF Underfill Dispense System for Flip Chip assembly offers high throughput and performance to the flip chip packaging market. The system will be introduced at SEMICON Taiwan, and can be seen in the Jipal booth 1038, Newport's Taiwan distributor, in Exhibition Hall I, Taipei World Trade Center, Taipei, Taiwan, September, 15-17, 2003. The MRSI-175UF is a flexible platform that may be configured to meet application-specific customer requirements. The system is available with single or dual dispense heads, rotary or linear positive displacement pumps and single or dual conveyors depending on customer throughput and process requirements. The MRSI-175UF conveyors incorporate universal fixturing, which makes product changeovers fast and easy. These features make the system ideally suited for use in contact manufacturing environments, where platform flexibility and fast changeover times are a requisite.
The Positive Displacement Pump used in the MRSI--175UF offers tight process control, high dispense accuracy, and consistent repeatability needed for high volume production. Typical Cpk performance exceeds 1.33. Because the system uses closed- loop encoder based control feedback, the pump holds precise process control tolerance over extended periods of time, substantially reducing the frequency of calibrations compared to competitive pumps. The simple pump design keeps routine maintenance to a minimum.
The MRSI-175UF offers parallel processing conveyors that reduce time associated with preheat, load, unload, transfer, and underfill material flow. As substrates are being pre-heated on one conveyor, material is being dispensed on the second conveyor. As a result, the MRSI-175UF offers higher throughput and higher productivity at the lowest cost of ownership.
Kevin Crofton, Vice President and General Manager of Newport's Advanced Packaging and Automation Systems Division, said, "The MRSI-175UF takes Flip Chip assembly to a new level of efficiency, productivity, and cost-effectiveness. In addition to outperforming competing underfill systems, this machine promises to help advance Flip Chip manufacturing technology during the next wave of advanced packaging."
Newport Corporation is a leading global supplier of advanced technology products and systems to the semiconductor, communications, electronics and research markets. The company provides components and integrated subsystems to manufacturers of semiconductor processing equipment, advanced automated assembly and test systems to manufacturers of communications and electronics devices, and a broad array of high-precision components and instruments to commercial, academic and government customers worldwide. Newport's innovative solutions leverage its expertise in precision robotics and automation, sub-micron positioning systems, vibration isolation and optical subsystems to enhance the capabilities and productivity of its customers' manufacturing, engineering and research applications. Newport is part of the Standard & Poor's Midcap 400 Index and the Russell 2000 Index. For more information, visit www.newport.com, or contact the company at 1791 Deere Avenue, Irvine, California, USA, 92606, Tel. (In U.S.) (800) 222-6440; Tel: (949) 863-3144; Fax: (949) 253-1680.
