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Adhesives & Sealants -> Adhesives Products, Equipment & Services -> Adhesive Compounds


Adhesive Compounds




(Showing headlines 1 - 20)   more ....

Silicone Sealant/Adhesive carries NSF-51 certification.

Everkem Diversified Products    Winston Salem, NC 27106
Jul 23, 2014 With 100% silicone formulation that promotes adhesion as well as temperature resistance while minimizing shrinkage and application temperature, TruSil 100 comes in caulk tube with screw on nozzle that facilitates cleaning, storage, and reuse after product has been opened. Removable tip helps reduce waste by limiting open product's exposure to air and moisture between uses. Available in several colors and mildew resistant options product meets ASTM-C920 performance criteria.

Silicone Adhesive is flexible and electrically conductive.

Creative Materials, Inc.    Ayer, MA 01432
Jul 18, 2014 With optimized working life and dispensing characteristics, 102-32D is designed for high throughput and automated dispensing processes. Use results in no tailing or stringing and minimal bleeding. Conductivity is 0.0001 Ω-cm, and application methods include spraying, screen-printing, and syringe dispensing. Capable of room temperature and snap cure, elastic adhesive suits delicate and stress-sensitive substrates and adheres to PTFE, silicone, and other low-surface-energy substrates.

Light Curable Adhesives provide cure confirmation.

Light Curable Adhesives provide cure confirmation.

Dymax Corp.    Torrington, CT 06790
Jul 15, 2014 Based on Encompass™ technology, Light Curable Adhesives incorporate See-Cure color-change and Ultra-Red™ fluorescing technologies. While in uncured state, adhesive with See-Cure technology is blue in color for verification of placement. As product cures with exposure to UV light, blue transitions to colorless for visual confirmation of cure. Products formulated with Ultra-Red™ technology fluoresce bright red under low-intensity black light, contrasting on plastics that naturally fluoresce blue.

Soft Light-Curable Adhesive bonds COC/COP film laminates.

Soft Light-Curable Adhesive bonds COC/COP film laminates.

Dymax Corp.    Torrington, CT 06790
Jul 09, 2014 Soft and flexible with durometer of A58, 1072-M MD® will cure in less than 3 seconds after exposure to LED or broad-spectrum UV light. Adhesive has viscosity of 1,000 cP for optimized wetting, making it suitable for interfacial bonding requirements. Product is ISO 10993-5 Cytotoxicity approved and suitable for bonding cyclic olefin polymers/copolymers used in point-of-care device industry.

Flooring Solutions maximize safety for athletics and play.

MarChem Polyurethane Systems    Maryland Heights, MO 63043
Jul 03, 2014 Tru-Motion™ single-component, moisture cured binders are available for outdoor running tracks and poured-in-place playground safety surfaces, while Tru-Motion 2-component poured elastomer systems suit indoor multi-purpose flooring and outdoor running tracks. Other types of Tru-Motion flooring solutions include single- and 2-component coatings for running track structural sprays and indoor multi-purpose flooring topcoats and line paints.

Catheter Adhesive offers cure, post-cure inspection confirmations.

Catheter Adhesive offers cure, post-cure inspection confirmations.

Dymax Corp.    Torrington, CT 06790
Jul 01, 2014 Formulated with both Ultra-Red™ and See-Cure technologies, 212-CTH-UR-SC is designed for use in catheter assembly and bonds to various substrates, including platinum and polycarbonate. While in its uncured state, this adhesive is blue to facilitate placement verification. Upon curing with UV light (<3 sec), product transitions to colorless to provide visual confirmation that adhesive is fully cured and bond site secure. Adhesive also fluoresces bright red under 365 nm light.

Epoxy Resin Adhesive cures at temperatures as low as 60°C.

Epoxy Resin Adhesive cures at temperatures as low as 60°C.

DELO Industrial Adhesives    Windach   Germany
Jun 13, 2014 Suited for optical packaging applications where several temperature-sensitive materials are bound together, DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping. This multi-purpose, one-component adhesive can be processed within 48 hr at room temperature and adheres to various plastics as well as metals and FR4 composites. Dispensed through needles with diameter as small as 200 µm, product exhibits low thermal stress and moderate shrinkage during curing.

Prime Label Substrate Adhesive offers problem-free performance.

FLEXcon    Spencer, MA 01562
Jun 12, 2014 Running without buildup on converting or dispensing equipment, V-01 higher-shear, permanent acrylic adhesive maximizes performance for prime labeling applications. Product adheres to various container types, including low-surface energy HDPE, and offers open time for clean removability of misapplied labels. While compliant with FDA 175.105 for indirect food contact, adhesive also resists effects of moisture and exposure to product contents and passes soapy squeeze testing.

High Temperature Adhesive suits applications to 2,300°F.

High Temperature Adhesive suits applications to 2,300°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jun 09, 2014 Formulated for bonding and coating mica, glass-ceramics, and metals, Ceramabond™ 632 features dielectric strength of 150 V/mil at room temperature, coefficient of thermal expansion of 4.7 ppm/°F, and viscosity of 10,000–25,000 cp. Specific gravity is 1.45–1.50 g/cc and pH is 11.0. Applied using brush, syringe, or pneumatic dispenser, mica-filled adhesive sets rapidly at room temperature and step cures at 200°F and 500°F for 2 hours each. Cured material resists most acids, solvents, and fuels.

Silicone Sealant targets residential windows and doors.

Dow Corning Corporation    Midland, MI 48686 0994
Jun 04, 2014 Consisting of one-part RTV silicone material, Youjie™ Neutral Silicone Sealant cures upon contact with moisture in air to form flexible, silicone rubber seal. Product offers optimized adhesion to variety of construction materials and is suitable for use in wide range of window and door sealing and glazing applications. Available in translucent, black, gray, and white, sealant has neutral cure chemistry making it ideal for use on aluminum and steel windows and doors.

Potassium Silicate Binder produces high-temperature coatings.

Potassium Silicate Binder produces high-temperature coatings.

Aremco Products, Inc.    Valley Cottage, NY 10989
May 14, 2014 Inorganic, water-dispersed Ceramabind™ 643-1, resistant to temperatures to 3,000°F, mixes with range of oxide and metallic powders into inert, electrically, chemically, and wear-resistant material that will not outgas under ultra high vacuum (UHV). Typical uses include formulating corrosion protective coatings for high-temperature metal structures as well as producing chemically resistant adhesives and patching compounds. Viscosity is 50–60 cP, and solids content by weight is 30.0–35.0%.

Heat-Shrink Tubing, Adhesive Filler offer flexible options.

Alpha Wire Co.    Elizabeth, NJ 07207 0711
May 02, 2014 Flexible and flame retardant, FIT-221L low-smoke, zero-halogen (LSZH) tubing does not contain any lead or halogens, offers low-smoke generation, and does not produce any toxic fumes when burned. Tubing has shrink ratio of 2:1, can be used from -55 to +105°C, and comes in 10 sizes from 3/64–1 in. dia. As amber, bead-like balls of adhesive, FIT-FILL adhesive filler helps create better tubing-to-cable seal to prevent water entry while providing extra protection to maintain cable integrity.

UV Cure Adhesive suits microelectronic assembly applications.

UV Cure Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Apr 08, 2014 Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony.

Flexible Adhesives fixture to handling strength in 5 sec or less.

Flexible Adhesives fixture to handling strength in 5 sec or less.

Henkel Corporation    Rocky Hill, CT 06067
Apr 07, 2014 Cyanoacrylate adhesives Loctite® 4902™ and 4903™ bond reliably to plastics, rubbers, metals, and other substrates. Affording optimal flexibility, Loctite® 4902™ offers elongation of 155% and modulus of 57,900 psi. Loctite® 4903™ offers 85% elongation and modulus of 78,100 psi. Designed for use on close-fitting, flexible parts, these one-part instant adhesives can bond dissimilar substrates and offer ISO 10993 biocompatibility for use on disposable medical devices.

Copper-Filled Grease suits heat transfer applications.

Copper-Filled Grease suits heat transfer applications.

Aremco Products, Inc.    Valley Cottage, NY 10989
Mar 19, 2014 Consisting of single-part, 100% solids, thermally conductive, silicone grease, Heat-Away™ 640 is used in heat transfer applications from -60 to 550°F. Product is formulated as thick paste that will not flow after application and maintains stable viscosity over entire temperature range. With thermal conductivity of 4.68 W/m-K, grease optimizes thermal transfer between heaters and process vessels and various heat sinks used in heat exchangers in electrical and electronic applications.

Thermally Conductive Epoxy Adhesive complies with RoHS.

Thermally Conductive Epoxy Adhesive complies with RoHS.

Epoxyset, Inc.    Lincoln, RI 02865
Mar 10, 2014 Available in dual cartridges, EB-127TC exhibits lap shear strength of greater than 3,500 psi. Aluminum metal filled, 2-part adhesive also has low chloride ion content, low outgassing, and 60 minute work life, making it suitable for applications requiring thermal conductivity and high volume efficiency. Product complies with RoHS initiative as well as REACH regulations.

Conductive Adhesive targets die-attach applications.

Conductive Adhesive targets die-attach applications.

Engineered Material Systems    Delaware, OH 43015
Feb 19, 2014 Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules.

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jan 31, 2014 Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP.

Epoxy Adhesive suits microelectronic assembly applications.

Epoxy Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Jan 14, 2014 Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.

Conductive Adhesive suits die attach applications.

Conductive Adhesive suits die attach applications.

Engineered Material Systems    Delaware, OH 43015
Jan 10, 2014 Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces.




(Showing headlines 1 - 20)   more ....



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