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Adhesives & Sealants -> Adhesives Products, Equipment & Services -> Adhesive Compounds


Adhesive Compounds




(Showing headlines 1 - 20)   more ....
UV Cure Adhesive suits microelectronic assembly applications.

UV Cure Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Apr 08, 2014 Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony.

Flexible Adhesives fixture to handling strength in 5 sec or less.

Flexible Adhesives fixture to handling strength in 5 sec or less.

Henkel Corporation    Rocky Hill, CT 06067
Apr 07, 2014 Cyanoacrylate adhesives Loctite® 4902™ and 4903™ bond reliably to plastics, rubbers, metals, and other substrates. Affording optimal flexibility, Loctite® 4902™ offers elongation of 155% and modulus of 57,900 psi. Loctite® 4903™ offers 85% elongation and modulus of 78,100 psi. Designed for use on close-fitting, flexible parts, these one-part instant adhesives can bond dissimilar substrates and offer ISO 10993 biocompatibility for use on disposable medical devices.

Copper-Filled Grease suits heat transfer applications.

Copper-Filled Grease suits heat transfer applications.

Aremco Products, Inc.    Valley Cottage, NY 10989
Mar 19, 2014 Consisting of single-part, 100% solids, thermally conductive, silicone grease, Heat-Away™ 640 is used in heat transfer applications from -60 to 550°F. Product is formulated as thick paste that will not flow after application and maintains stable viscosity over entire temperature range. With thermal conductivity of 4.68 W/m-K, grease optimizes thermal transfer between heaters and process vessels and various heat sinks used in heat exchangers in electrical and electronic applications.

Thermally Conductive Epoxy Adhesive complies with RoHS.

Thermally Conductive Epoxy Adhesive complies with RoHS.

Epoxyset, Inc.    Lincoln, RI 02865
Mar 10, 2014 Available in dual cartridges, EB-127TC exhibits lap shear strength of greater than 3,500 psi. Aluminum metal filled, 2-part adhesive also has low chloride ion content, low outgassing, and 60 minute work life, making it suitable for applications requiring thermal conductivity and high volume efficiency. Product complies with RoHS initiative as well as REACH regulations.

Conductive Adhesive targets die-attach applications.

Conductive Adhesive targets die-attach applications.

Engineered Material Systems    Delaware, OH 43015
Feb 19, 2014 Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules.

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Jan 31, 2014 Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP.

Epoxy Adhesive suits microelectronic assembly applications.

Epoxy Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Jan 14, 2014 Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.

Conductive Adhesive suits die attach applications.

Conductive Adhesive suits die attach applications.

Engineered Material Systems    Delaware, OH 43015
Jan 10, 2014 Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces.

Silane-Modified Polymer Adhesives seal seams and joints.

Silane-Modified Polymer Adhesives seal seams and joints.

Henkel Corporation    Rocky Hill, CT 06067
Dec 27, 2013 Designed for elastic bonding, coating, and sealing of seams and joints on most metal, plastic, and composite substrates, Teroson® MS 930™ and Teroson® MS 939™ require no primers and offer both UV and weather resistance. Solvent- and isocyanate-free, one-part adhesives cure rapidly with exposure to ambient moisture. Supplied in sausage packs, products experience limited shrinkage on cure and are paintable, making them suitable for applications where aesthetics are important.

Oil-Tolerant Anaerobic Adhesives can cure through contaminants.

Oil-Tolerant Anaerobic Adhesives can cure through contaminants.

Henkel Corporation    Rocky Hill, CT 06067
Dec 18, 2013 Formulated as wax-like, semi-solid adhesives packaged in self-feeding stick applicator, Loctite® 248™ Medium Strength Blue and Loctite® 268™ High Strength Red Threadlocker Sticks securely lock and seal threaded assemblies, fill gaps between threads, and prevent corrosion. These anaerobic threadlocker sticks can be used on oil-contaminated surfaces without requiring primers or accelerators and will not leak or drip when carried in pocket, stored in toolbox, or used in overhead applications.

Thermally Conductive Epoxy serves applications up to 572°F.

Thermally Conductive Epoxy serves applications up to 572°F.

Aremco Products, Inc.    Valley Cottage, NY 10989
Nov 25, 2013 Used for bonding, potting, tooling, and molding, Aremco-Bond™ 805 adheres to high-temperature plastics, glass, ceramic, and high-expansion metals. This 2-component, 100% solids, aluminum-filled epoxy cures at room temperature in 24 hr with final cure at 200°F in 2 hr. Cured material exhibits thermal conductivity of 12.5 Btu-in/hr-ft²-°F and dielectric strength of 50 V/mil. Respective tensile shear and flexural strengths are 1,800 and 15,500 psi, and Shore D Hardness is 87.

Assembly Adhesive suits edgebonding applications.

Assembly Adhesive suits edgebonding applications.

Dymax Corp.    Torrington, CT 06790
Nov 07, 2013 Designed for rapid ruggedization of circuit board components, Ultra Light-Weld® 9309-SC cures upon exposure to UV/visible light. Adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Formulated with patented See-Cure technology, 9309-SC is bright blue in uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure. As product cures, blue color transitions to colorless.

Conductive Adhesive suits die attach applications.

Conductive Adhesive suits die attach applications.

Engineered Materials Systems Inc.    Delaware, OH 43015
Oct 29, 2013 Designed for chip-on-board or general die attach applications in circuit assembly, photonics, or camera modules, CA-165 is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement, and conductive adhesive features both moderate glass transition temperature (Tg) and modulus.

Thermally Conductive Epoxy is also electrically insulative.

Thermally Conductive Epoxy is also electrically insulative.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 29, 2013 Used for such applications as bonding, sealing, glob top, and die attach, Supreme 3HTND-2GT is thermally stable, with service range of -100 to +400°F; dimensionally stable; and capable of withstanding thermal cycling and shocks. Single-component system does not require mixing and bonds to various substrates used in electronics, including metals, composites, ceramics, and plastics. Able to be readily applied to defined area, system cures in 20–30 min at 250°F or in 5–10 min at 300°F.

Spray-On Adhesive optimizes filter media performance.

Franklin International    Columbus, OH 43207
Oct 24, 2013 Intended for media used in residential and commercial air-filtration systems, FilterFAB 3000 is sprayed directly on filter media, making it sticky and enabling it to entrap more particulates from air stream. Cross-linked, vinyl acrylic polymer is formaldehyde-free with low VOCs. As pressure-sensitive adhesive, product is suited for laminating multiple layers of media to achieve desired performance level. Formulation dries quickly in oven and is water-based, minimizing clean-up time.

Anaerobic Retaining Compounds cure through contaminants.

Anaerobic Retaining Compounds cure through contaminants.

Henkel Corporation    Rocky Hill, CT 06067
Oct 17, 2013 Allowing primerless performance on oily or contaminated surfaces, Loctite® 638™/648™/680™ make joints stronger, distribute stress evenly, and prevent corrosion/fretting. General-purpose Loctite 638 resists temperatures to 175°C and can be used in applications with gaps to 0.25 mm. Used in temperatures to 180°C, general-purpose Loctite 648 fixtures in 5 min with full cure in 24 hr and fills gaps to 0.15 mm. High-strength, low-viscosity Loctite 680 supports use on parts with gaps to 0.38 mm.

Ultrapure Precision Silicone Film broadens application range.

Ultrapure Precision Silicone Film broadens application range.

Wacker Chemical Corp.    Adrian, MI 49221
Oct 07, 2013 Available as roll stock, ELASTOSIL® Film is made, in cleanroom conditions and without use of solvents, entirely from silicone elastomers and comes in thicknesses down to 20 microns. Intermediate backing allows film to be peeled off intact, and film thickness across entire width and length of film web deviates from specification by ±5% at most. Film is permeable to water vapor and certain gases, such as oxygen, nitrogen, and carbon dioxide but not to water.

Non-Drip Epoxy can be used in indirect food applications.

Non-Drip Epoxy can be used in indirect food applications.

Master Bond, Inc.    Hackensack, NJ 07601
Oct 03, 2013 With thick paste consistency, Master Bond® EP21NDFG bonds to diverse substrates – metals, composites, glass, ceramics, rubbers, plastics – and will not run or sag even when applied to vertical surfaces. Bonds resist thermal cycling as well as chemicals, including water, oils, fuels, acids, bases, and salts. This 2-component, room temperature cure epoxy has non-critical one to one mix ratio by weight or volume, and properties of cured system can be adjusted by altering mix ratio.

Conductive Adhesive bonds components to circuit boards.

Conductive Adhesive bonds components to circuit boards.

Engineered Materials Systems Inc.    Delaware, OH 43015
Oct 01, 2013 Suited for solder replacement applications, CA-102 electrically conductive adhesive has moderate glass transition temperature (Tg) and modulus, exhibits optimized rheology for screen printing, and can be needle dispensed by time-pressure, auger, or positive displacement. Modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces, product suits applications requiring lower stress, lower temperature processing, or elimination of Pb in solder.

Hot Melt Adhesive suits case and carton sealing. .

H.B. Fuller Company    Oakdale, MN 55128
Sep 30, 2013 Specifically designed for optimized bonding on broad range of substrates including coated stocks and high recycled-content board, Advantra Encore™ 4000 polymer technology provides aggressive hot tack, grabbing and holding quickly to prevent pop-opens. From deep freeze to hot fill, product performs across broad service temperatures ranging from -40 to 160°F.




(Showing headlines 1 - 20)   more ....



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