Formulated to adhere ceramic components in material handling, power generation, mining and petroleum industries, SCProbond™ Epoxy Adhesives are available in low (LV-1) and high viscosity (HV-1) versions. SCProbond™ LV-1 is used in installing components in horizontal applications whereas SCProbond™ HV-1 is designed for vertical and overhead tilting applications. Product features good... Read More
Suitable for small gauge needle applications, MD® 1406-M Needle Bonding Adhesive reduces chance of cannula substrate failure. Allowing tighter standard deviations, product is optimized for 385 nm LED curing. Product helps manufacturers with use of LED curing without affecting speed and cured mechanical properties.Read More
EP29LPHE is a low viscosity epoxy system that features a long working life, reliable electrical insulation and low exotherm suitable for large potting and encapsulation applications. Read more about Master Bond’s low exotherm adhesives at http://www.masterbond.com/properties/low-exothermic-epoxy-systems or... Read More
A series of fast curing thixotropic Epoxy Assembly Adhesives was developed by Epoxies, Etc. These non-sag epoxy adhesives offer manufacturers the ability to improve productivity due to their quick 5-46 minute set times.
10-3005 NS 5 Minute Set Epoxy
10-3020 NS 20 Minute Set Epoxy
10-3046 NS 46 Minute Set Epoxy
In addition to providing rapid assembly they also offer... Read More
EP41S-5: Chemical Resistant Epoxy Withstands Methylene Chloride
EP41S-5 has exemplary resistance to a wide array of chemicals, such as acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing and coating, as well as encapsulating. This system combines formidable physical strength properties and electrical insulation values. EP41S-5 offers... Read More
Suitable for use in bonding, coating, sealing and encapsulating for aerospace and OEM industries, EP30TC Epoxy provides 2.60-2.88 W/(m.K) thermal conductivity. Having 5,000-6,000 psi tensile strength with 24,000-26,000 psi compressive strength, epoxy is used in -100°F to +300°F temperature range. Available in ½ pint, pint, quart, gallon and 5 gallon container kits, EP30TC offers over 1014... Read More
(Albany, NY) January 13, 2017 - BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace... Read More
Torrington, Connecticut - January 16, 2017 - Dymax Corporation, a leading manufacturer of adhesives to the disposable medical device industry, will exhibit in Booth #2139 at MD&M West, scheduled to take place February 7-9, 2017 at the Anaheim Convention Center in Anaheim, CA. Their newest products and technologies - including solvent free, USP Class VI, and ISO 10993 biocompatible... Read More
Available in ½ pints, pints, quarts, gallons and 5 gallon containers, EP3HTND-2Med Black Curing Epoxy features 5,000-6,000 psi tensile strength. Having 1,600-1,800 psi tensile lap shear strength at room temperature, product bonds to glass, metals and ceramics. Used in -60°F to +400°F temperature, material provides resistance to sterilization methods such as chemical sterilants, EtO,... Read More
Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This one part system delivers superior resistance to a variety of sterilization methods such as chemical sterilants, EtO, radiation and especially autoclaving.
As a one component system, EP3HTND-2Med Black does not require any... Read More
Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications.
EP46HT-2AO Black combines superior thermal... Read More
Ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive, 40-3907 Epoxy Resins are electrically conductive room temperature curing adhesives. Used as repair material for electrical traces, device includes thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78). Film is used for applications like solder... Read More
Master Bond X5TC is an elastomeric system that has a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining solid electrical insulation properties. This one part, no mix adhesive/sealant has a paste-like consistency and is very easy to use. It readily cures in 8-12 hours at room temperature or in 60-90 minutes at 150°F.
X5TC bonds well to many... Read More
Available in 301K Moisture-Tolerant Epoxy and 301W Low-Temperature Cure Moisture-Tolerant Epoxy, Dura-Plate 301 series coatings are good surface and moisture tolerant high solid epoxies for marginally prepared surfaces. Delivering performance over power tool cleaning, abrasive blasting and water jetting, coating are engineered to provide adhesion and anti corrosion and are suitable for oil and... Read More
Used to bond dissimilar substrates without requiring primers, Plexus Galvanized Bonder Adhesives cure instantly at room temperature. After curing, adhesives are strong and tough with resistance to sheer, peel and impact. Materials doesnot require external fasteners once cured. Product bonds galvanized metals like G60 and G90, plastics, composites, steel and aluminum.Read More
Polyset, a leading manufacturer of polymer materials, offers a lightweight epoxy paste patching material. Designed for overhead and vertical applications, Ply-Seal® Epoxy Paste has excellent adhesion to most construction materials.
Ply-Seal® Epoxy Paste is a 100% solids, two-component, moisture insensitive, lightweight, thixotropic, waterproof, epoxy paste patching material that meets... Read More
Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100 to 50 ratio by weight. The mixed system is a malleable paste, with an... Read More
Eliminating the need for a safety fence, MGS Machine's robotic collaborative palletizer is an automated solution for reducing injuries caused from heavy lifting and repetitive motion. Useful in packers of pharmaceuticals and medical devices, palletizer can lift up to 6 cases per minute weighing up to 77 lb. Unit can fully serialize an integrated packaging line, and can be fitted with various... Read More
Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicone can be used in the aerospace, electronic, opto-electronic and specialty OEM industries. Featuring a low volume resistivity of 0.004 ohm-cm, MasterSil 973S-LO is a silver filled compound that has a... Read More
Suitable for lining tanks and pipes, ChemlokÂ® Film Adhesive requires a single application to bond rubber-to-metal. Eliminating use of SCBA equipment during application, Adhesive can be safely applied in confined spaces without fear of explosion or asphyxiation. The option to pre-laminate uncured rubber substrates, reduces the steps needed to complete the rubber lining... Read More