Gore, W. L., & Associates, Inc., Industrial Filtration Technologies    Elkton, MD 21921
Nov 17, 2003 GORE-TEX® creep-resistant, form-in-place gasketing material is made from GORE-TEX® expanded PTFE, which is impervious to most chemicals, suitable for use from -450 to +600°F, and able to withstand pressures to 3,000 psig. Tight-sealing product, suited for most types of sealing applications, is also suited for use in chemical processing plants.

MACtac, Technical Products Division    Stow, OH 44224 1888
Nov 13, 2003 MACbond® IR Series double-coated tapes offer high tack for solid bond. Moisture-stable liner keeps adhesive layer clean and flat, protecting against dust, dirt, and other particles. MACfilm® IF Series rubber and acrylic free films provide edge-to-edge bonding to variety of substrates. MACmount® IM Series double-coated, polyethylene foams are highly conformable and compressible, providing contact between uneven, irregular, or contoured surfaces.

Aremco Products, Inc.    Valley Cottage, NY 10989
Nov 13, 2003 Pyro-Ductâ„¢ 597-A electrically and thermally conductive adhesive is formulated using high-purity silver powders combined with conductive binder system. It exhibits volume resistivity of 0.0002 ohm-cm at room temperature and tensile shear strength of 450 psi. Single component, water-dispersible system contains no organic resins or solvents. It sets at room temperature in 1–2 hr and heat cures in 1–2 hr at 200°F.

Henkel Loctite Corporation    Rocky Hill, CT 06067
Nov 13, 2003 Hysol® QMI 519HT02 silver-filled, die attach adhesive is formulated for use on die with high power densities. Hydrophobic and stable at temperatures to 260°C, it delivers void-free bond lines and adheres to ceramic, laminate, and metal or plated substrates. Product is JEDEC Level 1 capable and cures in-line using SkipCure(TM) in 10 sec at 150°C. It can also be converted to controlled collapse spacer paste.

Henkel Loctite Corporation    Rocky Hill, CT 06067
Nov 05, 2003 Semi-solid Loctite® 248 and 268 offer performance characteristics of liquid threadlockers, yet will not leak or drip and can be easily transported and stored. Medium-strength Loctite 248 Blue is suited for threaded metal fasteners, especially those with diameters from ¼ to ¾ in. High-strength Loctite 268 Red is suited for applications where resistance to heavy shock, vibration, and stress is required. Both come in 19 and 9 g self-feeding stick applicators.

Scapa North America    Windsor, CT 06095
Nov 04, 2003 Scapa 1433 consists of conformable, self-wound, clear polyethylene film single-coated with acrylic pressure sensitive adhesive. All-weather tape adheres to rigid plastics, flexible films, glass, wood, and metal. Suited for indoor/outdoor assembly, construction, and repair applications, film allows light penetration and is stabilized against UV rays. It is also formulated to provide resistance to humidity, plasticizers, oil, water, and salt water.

Scapa North America    Windsor, CT 06095
Oct 28, 2003 Double-coated, woven-cotton Dubifilm® 274 is coated on liner side with aggressive rubber adhesive and on exposed side with rubber adhesive that leaves no residue upon removal. Tape handles carpet installation applications, print-plate mounting, and temporary mounting in assembly or machining operations. It is supplied on easy-release polyethylene liner.

Tra-Con, Inc.    Bedford, MA 01730
Oct 23, 2003 Medium-viscosity Tra-Bond 816H04 maintains thermal conductivity even at high temperatures. It bonds to metals, silica, alumina, sapphire, and other ceramics, glass, and plastics. Adhesive is recommended for chip bonding applications, along with staking transistors, diodes, resistors, integrated circuits, and other heat sensitive components to circuit boards.

Tra-Con, Inc.    Bedford, MA 01730
Oct 22, 2003 Tra-Bond 2103 2-part, medium viscosity, near transparent adhesive provides rigid sealing, laminating, and bonding. It bonds well to ceramics, metals, glass, composites, and most rigid plastics. Able to cure in 24 hr at room temperature, epoxy cures faster at elevated temperatures.

Huntsman Advanced Materials    Los Angeles, CA 90039
Oct 21, 2003 Agomet™ adhesives consist of 6 adhesives and 4 hardeners that bond substrates via surface activation. This allows application of hardener/lacquer to substrate up to 30 days before resin is added to bond assembly. Able to join materials, thermoplastics, and composites, adhesives can be hand- and meter-mixed. Work lives range from 1–20 min, lap shear strengths vary from 3,000–4,000 psi, and tensile strengths are rated up to 4,785 psi.

Tra-Con, Inc.    Bedford, MA 01730
Oct 20, 2003 Tra-Bond 970-1N1 sag resistant epoxy adhesive develops aluminum-to-aluminum lab shear strength of 3,000 psi, can reach glass transition temperature of 83°C, and cures to 75 shore D hardness. Available in sizes and packaging to match unique application needs, product is offered in pre-mixed and frozen syringes or in Bipax for room temperature storage.

Tra-Con, Inc.    Bedford, MA 01730
Oct 20, 2003 Heat-resistant, one-part, solvent-free TRA-BOND 77-1S has glass-transition temperature of 200°C and withstands 1,000 hr at 100°C and 95% RH. It has working life of 3 months at 25°C and smooth consistency. Dispensed through fine-diameter needles, adhesive does not sag or tail. Cured product has lap shear strength of 2,400 psi and 94 Shore D hardness. Applications include attaching surface-mounted devices to circuit boards or other electronic devices.

Henkel Loctite Corporation    Rocky Hill, CT 06067
Oct 20, 2003 Hysol® QMI 550SI low-CTE, silica-filled, dielectric die attach adhesive is hydrophobic and produces void-free bond lines that adhere to organic and metal surfaces. Product allows SkipPrebake(TM) and can be cured in-line using SkipCure(TM) processing 10 sec after bond line reaches 150°C. Adhesive is JEDEC Level 3 capable for 260°C reflow in tape array BGAs and may be converted to controlled collapse spacer paste that employs proprietary patented organic spacers.

Devcon    Danvers, MA 01923
Oct 17, 2003 Self-leveling, 100% solids 10 Minuteâ„¢ Epoxy adhesive is formulated for bonding, potting, and cosmetic repairs in various OEM applications. Able to adhere to varied substrates, it is available in clear and black and has fixture time of 20 min. Functional cure is attained in 90 min. Cured product has 2,400 psi tensile shear strength, 20–25 pli peel strength, and 10 lb-ft/in² impact resistance. Bonds withstand service temperatures from -67 to 200°F.

Tra-Con, Inc.    Bedford, MA 01730
Oct 16, 2003 TRA-BOND F253M two-part, low viscosity epoxy minimizes fiber pistoning and moisture absorption while maintaining long pot life and high temperature performance. Unmixed components are yellow and turn greenish blue upon mixing. With full cure, epoxy turns deep reddish-amber. Material develops strong bonds to fiber optic and optical materials that include most metals, ceramics, glass, and plastics.

Aremco Products, Inc.    Valley Cottage, NY 10989
Oct 03, 2003 Ceramacoatâ„¢ 512N high-temperature adhesive and ceramic coating system is used in assembly of ceramic, metal, and plastic electrical components and as coating of high temperature structures requiring corrosion protection. Single part, water-based, silica-filled system offers volume resistivity of 10⁹ ohm-cm and dielectric strength of 250 V/mil at room temperature. Odorless product contains no VOCs, and no outgassing will occur upon cure or during operation.

Henkel Loctite Corporation    Rocky Hill, CT 06067
Oct 03, 2003 SPEEDBONDER(TM) H8000 delivers impact- and peel-resistant bonds on various surfaces including metals and composites. Product consists of 100% reactive, 2-component gel that cures at room temperature and bonds to materials with little or no surface preparation. Capable of filling gaps as large as 0.5 in., adhesive also offers environmental resistance. Product is packaged in 490 ml EPS cartridges, 5 gal pails, and 55 gal drums.

Tesa Tape, Inc.    Charlotte, NC 28209
Oct 01, 2003 SteelMaster LT adhesive holds photopolymer plates .067 in. and thinner onto steel cylinders. Able to hold during print run, it removes with ease upon job completion. Non-building adhesive maintains initial level of holding power over time. Suited for combination printing, medium-density 52121 Softprint SteelMaster foam tape is coated with SteelMaster LT and allows for fine dot reproduction of less than 5% without sacrificing pin holing on solid areas.

Henkel Loctite Corporation    Rocky Hill, CT 06067
Sep 25, 2003 Hysol® FP4580 low stress liquid epoxy prevents cracking and delamination of chip's inner layers. It works on copper/low k flip chip laminate packages up to 50 x 50 mm with over 4,000 solder bumps. When fully cured, product forms rigid, low warp seal that dissipates stress on solder joints and extends thermal cycling performance. Hysol® FP4580 underfills devices with gaps as small as 12 microns and meets JEDEC Level 3 245°C preconditioning requirements.

Dymax Corp.    Torrington, CT 06790
Sep 23, 2003 UV/visible light curing Ultra Light-Weld® 3094 Series forms clear bonds and does not cause crazing or blooming on plastics. Bonds have gap filling capability and maintain strength through thermal cycling as well as shock, vibration, and impact. Material, available in viscosities of 1,000 cp, 8,000 cp, and 25,000 cp non-flowing gel, cures upon exposure to wavelengths ranging from 300-500 nm. Adhesive is 100% solvent and ODC free.