Adhesives & Sealants

Adhesives & Sealants

High-Temperature Adhesive bonds dissimilar materials.

October 17, 2014

Resistant to corrosion, chemicals, thermal shock, and electricity, Resbond™ S5H13 suits adhesive applications up to 500°F. Epoxy bonds heavy plastic to stainless steel; seals and insulates Bi-Polar, Electro-Cauterizers; and withstands thousands of steam sterilization cycles at 375°F. Adhering to metals, plastics, composites, glass, and ceramics, paste cures at room temperature and exhibits 1.9 gms/cc density, 80 Shore D hardness, and 10,000 psi tensile strength. Read More

Adhesives & Sealants

Light-Curable Adhesive targets medical catheters.

October 16, 2014

Formulated with Encompass™ technology that combines See-Cure color change and Ultra-Red™ fluorescing technologies with LED-curing capabilities, 215-CTH-UR-SC Adhesive is suitable for bonding variety of substrates, including Nylon 12 and PEBA. Product provides secure bonds with added benefits of cure confirmation and post-cure bond-line inspection. Read More

Adhesives & Sealants

Muntin Bar Tape suits low surface energy materials.

October 16, 2014

Developed for Kynar®500 flouropolymer, Vitrasil® acrylic polyester, and powder-coated finishes, LSE SDL Series eliminates need for liquid silane adhesion promoters. System provides long-term indoor/outdoor adhesion to variety of window substrates, including easy-to-clean and self-cleaning glass. It also bonds to cellular PVC, vinyl, primed/unprimed wood, plastic, and painted aluminum muntin bars. Available in .032 in. black, LSE SDL Series resists air, water, detergents, moisture, UV, and dust. Read More

Adhesives & Sealants

LED-Curable Adhesive facilitates catheter assembly, inspection.

October 10, 2014

Used for bonding and assembly of catheter designs featuring Nylon 12 and PEBA, MD® 215-CTH-UR-SC provides secure bonds with facilitated cure confirmation and post-cure, bond-line inspection. Adhesive is blue to facilitate verification of placement in uncured state, and color transitions to colorless upon UV cure. Cured adhesive fluoresces bright red under low-intensity black light (365 nm). Uses include bonding lumen to balloon or hub, marker band assembly, and manifold bond joints. Read More

Adhesives & Sealants

Metallocene Hot Melt Adhesives offer pot life stability.

October 7, 2014

Designed for case, tray, and carton sealing, Metallocene Hot Melt Adhesives are clear in color and are not prone to charring or odor. Heat resistant products are formulated for operation across temperature range of -40 to 165°F. Adhesives bond to wide range of packaging substrates including coated stocks and high recycled-content board. With optimized hot tack, Metallocene hot melts can grab quickly to avoid pop-opens with high-memory boards. Read More

Adhesives & Sealants, Labels, Tags, Signage & Equipment

High-Tack PSA Dot is sourced from biodegradable materials.

October 1, 2014

ECO-Squares™ are biodegradable hot melt pressure-sensitive adhesive (PSA) dots that provide instant adhesion and aggressive tack to help increase production and reduce adhesive failures. Able to be customized to meet specifications, these pre-engineered adhesive patches do not require heat during application. This reduces risk of burns, increases employee safety, and reduces energy demands. During 34 days of bio-methane potential testing, 35% biodegradation occurs in anaerobic environment. Read More

Adhesives & Sealants, Green & Clean

Hybrid Adhesive features structural cyanoacrylate technology.

October 1, 2014

Combining bond strength of structural epoxy with speed of instant adhesive, Loctite® 4090™ offers rapid, high-strength bonding to range of substrates, including metals, most plastics, and rubbers. Product offers impact, moisture, and UV resistance, as well as temperature resistance to 300°F. Available as 50 ml cartridge packaged with 5 mix nozzles, gel adhesive fixtures in 3-5 min when used to fill gaps up to 0.2 in. Low blooming product is suited for appearance-sensitive applications. Read More

Adhesives & Sealants

Conductive Adhesive targets HIT silicon solar modules.

September 23, 2014

Designed to be used in modified ribbon stringer, EMS 561-147 Conductive Adhesive will snap cure and fixture ribbons in seconds at 180°C with enough strength to withstand module manufacturing processes until adhesive cure is completed during encapsulant lamination. Product can be dispensed by time pressure, auger, or jetting. More stress absorbing than solder, adhesive withstands rigors of thermal cycling and processes at low temperatures. Read More