RF Sockets suit devices with pitches as low as 0.40 mm.

High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mmÂ-², 14-27 mmÂ-², 28-40 mmÂ-², and 41-55 mmÂ-². With -55 to +150Â-

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Impact Hex Bit Sockets resist wear and corrosion.

Impact Hex Bit Sockets resist wear and corrosion.

Available individually or in sets, impact hex bit sockets come in 3/8 and Â-½ in. drive versions that cover 1/8-5/8 in. standard and 2-17 mm metric sizes. Each is made from 8650 steel and precision heat-treated. Black oxide finish lends to corrosion resistance, and bits are secured by setscrew in heavy-duty, screw-type holders. Available sets include 7-piece 3/8 in. drive set, 7-piece Â-½...

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Multi-Tech Shows Embedded Products in Birmingham

MINNEAPOLIS, October 11// -- Featuring New Cost Effective Serial-to-Ethernet Module Embedded Systems Show, National Exhibit Center, Birmingham, Stand # 451 Multi-TechÂ-® Systems, Inc., a leading data communications technology company, based in suburban Minneapolis, is showcasing its full line of embedded device networking solutions at this year's Embedded Systems show in Birmingham, United...

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M12 Connectors minimize surface area needed for mounting.

M12 Connectors minimize surface area needed for mounting.

Featuring M12 rear thread, Series 713 Connectors can be mounted to panels up to 3 mm thick. Units are fixed from rear of panel with hexagonal nut. Male sockets with a-coding are offered in 4-, 5-, and 8-pin versions, while b-coded version is available with 4 pins. Solder-cup contacts allow wires of any length to be terminated.

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Test Socket suits devices from 28 to 40 mm-².

Test Socket suits devices from 28 to 40 mm-².

Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25...

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Micro Card Interfaces require minimal board area.

Micro Card Interfaces require minimal board area.

Surface-mount, 0.025 in. pitch MEC6 Series features double row of phosphor bronze contacts to mate with standard double-sided .062 in. thick cards. Designed with vertical orientation, 7 sizes offer 10, 20, 30, 40, and 50 I/Os per side non-polarized and 50, 60, and 70 I/Os per side with keying feature to assure proper card insertion. Five right-angle styles are available with 10-40 I/Os...

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IC Sockets support dense pitch QFP devices.

IC Sockets support dense pitch QFP devices.

With 10 GHz bandwidth, Model SG-QFE-7000 accommodates 128-pin, 14 mm, 0.4 mm pitch TI Power Pad ICs without performance loss. Unit dissipates up to several watts without extra heatsinking and can handle up to 100 W with custom heatsink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, sockets feature temperature range of -35 to +85Â-

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Spline Sockets are made from aircraft quality steel.

Spline Sockets are made from aircraft quality steel.

Suitable for use on spline fasteners and 4, 6, and 12 point fasteners, spline sockets line includes 55 SKUs, in Â-¼, 3/8, Â-½, Â-¾, and 1 in. drive models. Geometric profile of socket's 12 teeth offers large contact area between tool and spline fastener that allows user to apply more torque without damaging tool or fastener head. Sockets loosen partially rounded hex fasteners and meet...

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Piper Plastics Manufactures Microprocessor Test Sockets Using a Ceramic-Filled Victrex-® Peek-® Polymer

Greenville, SC (July 18, 2006) The Semiconductor industry's demand for smaller, tight tolerance IC packages that operate at higher frequencies is making it increasingly difficult for traditional materials previously used for test socket applications. New, high performance test socket components made from a ceramic-filled VICTREXÂ-® PEEK polymer are available from Piper Plastics Inc., a...

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BGA Socket accommodates 1.0 mm pitch ICs.

Intended for 23 mm, 22X22 array ICs, 10 GHz Model SS-BGA324J-02-01 dissipates up to 7 W without extra heatsinking and can handle up to 60 W with custom heatsink. Contact resistance is typically 30 mOhm per ball. Constructed with spring pins rated at 500,000 actuations, socket operates from -40 to +150Â-

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Precision Machining Solutions with Over 25 Years of Experience
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Precision Machining Solutions with Over 25 Years of Experience

Quality, customer service, and unbeatable value are the hallmarks of Hogge Precision. Since 1989 we have built a reputation as the go-to precision machining source, servicing many demanding industries. For CNC machining and screw machining, there are few manufacturers that can match our capabilities and expertise. See our video to learn more.

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