RF Sockets suit devices with pitches as low as 0.40 mm.

Press Release Summary:



High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mm², 14-27 mm², 28-40 mm², and 41-55 mm². With -55 to +150°C operating temperature range, products are used in applications such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with speeds from 1 to more than 10 GHz.



Original Press Release:



New RF Sockets from Aries Electronics Accept Devices with Pitches as Low as 0.40mm



FRENCHTOWN, N.J., April 2007 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its entire line of high-frequency center probe test sockets can now be used with devices requiring pitches as low as 0.40 mm. The sockets are used in applications such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices with speeds from 1 GHz to more than 10 GHz.

These high-frequency center probe test sockets can be easily mounted to, and removed from, the test board because of their solderless, pressure-mount compression spring probes. The 4-point spring probe crown on these sockets ensures "scrub" on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other socket types. Single point probes are available, if needed, for small land area contact pads for LGAs, QFNs, MLFs, etc. The socket's gold-over-nickel plated compression spring probes leave very small witness marks on the bottom of the device solder balls.

Four socket sizes are offered: for device packages up to 13mm², from 14mm² to 27mm², from 28 mm² to 40mm², and from 41 mm² to 55mm². Each socket's small overall profile allows the maximum number of sockets per board, and boards per oven, while at the same time being operator friendly. In addition, these sockets provide minimal signal loss for higher bandwidth capability via a signal path of only .077" (1.92mm).

The compression spring probes in Aries' new RF sockets are heat-treated beryllium copper alloy, plated with 30 µ" min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per SAE-AMS-QQ-N-290. Their molded components are UL94V-0 PEEK and/or Ultem, and all hardware is stainless steel. Contact forces of the sockets are 16 g per contact for 0.40mm pitch and 25 g per contact for 0.50mm pitches and larger. Operating temperature is -55°C to +150°C (-67°F to +302°F) and estimated contact life is more than 500,000 cycles.

Pricing for these sockets start at $500.00 each for 10 pieces of a 50 lead socket. Delivery is 20 working days ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Web: www.arieselec.com. Europe contact Tel: +44 870 240 0249; Email: europe@arieselec.com.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-ChipT product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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