New Sockets Products

Processor Socket enables PCI Express-® signaling.

Lead-free, 775-position Model LGA775 enables use of microprocessors that support PCI Express signaling in desktop PCs. Utilizing BGA technology for motherboard attachment and LGA interface to microprocessor, socket performs with less than 4 nH inductance and less than 1 pF capacitance pin-to-pin. Pickup cover facilitates placement using pick-and-place equipment, while BGA termination allows...

Socket is available for 0.50-0.80 mm pitch packages.

Suited for applications using BGA, LGA, CSP, and other devices on 0.50 mm or larger pitch, PinBall(TM) Socket can be soldered side-by-side, directly to existing footprint of PC board. Clearances range from 0.5-2.0 mm, depending on pitch. Constructed of FR-4 material, socket features 63/37 tin-lead solderballs on PCB mating side and male spring probe on device mating side, which offers contact...

IC Socket tests high-speed devices.

Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125Ã-

FB-DIMM Memory Socket enables server memory expansion.

Vertical memory module connectors accept DDR2 FB-DIMM (Fully Buffered Dual In-Line Memory Module) assemblies and have card-edge contact design that protects against stubbing. Enabling data rates to 4.8 Gbps, interface utilizes serial differential signaling. Sockets provide mechanical voltage keying and end latches for module retention and ejection. Designed to JEDEC Socket Outline SO-003,...

Epoxy Crusher Backing Solutions for Construction Aggregate & Ore Mining Applications

This white paper provides a guide to epoxy crusher backing solutions for construction aggregates and ore mining applications.

Magnetic Sockets feature bushing-free design.

Designed for automated assembly operations, ProtoGrip(TM) Magnetic Sockets utilize rare earth/nylon magnetic material. By eliminating bushing, sockets maximize amount of space available for magnetic material, which provides extra strength needed to lift bolts and fasteners. Power version suits fast-moving assembly operations, while lower surface hardness of impact configuration is suited for...

Automotive Relay Socket features sealed construction.

Used anywhere waterproof socket is needed, ST9721-U4 is designed to fit AZ973 shrouded relay, which includes relay gasket and uses push to seat terminations. Wire seals are also available, and all components are of UL-recognized materials with chemical- and V2 or better flame-resistance. Offering universal fit for most sealed terminals, 1 socket and 2 sizes of wire seals fit all wire ranges. This...

Impact Sockets work in tight spaces.

Measuring 2-3.5 in. long, Deep Thin Wall Impact Sockets are available in variety of metric sizes for 3/8 in. drives and are suited for hard-to-reach fasteners that require low impact force. Each features TorquePlus(TM) design in which socket's curved points contact fastener away from corners, and spread force of turning over larger area of fastener. All include one through-hole and groove to...

Test Socket suits devices from 28-40 mm-².

Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for...

Test and Burn-In Socket suits applications up to 1 GHz.

Test and Burn-In Socket accommodates devices from 41-55 mmÃ-² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM,...

BGA/LGA Socket includes customized heat sink.

Suited for high-end graphics processors, 1,400-contact Pin-Ball Socket can be soldered directly to existing footprint of PC board. Aluminum heatsink provides thermal dissipation of excess heat generated by graphics processors. BGA/LGA socket provides 2 mm of clearance for end components and can be used for 0.80, 1.00, and 1.27 mm pitch packages up to 50 mm. It incorporates spring probe technology...