Electronic Sockets

Center Probe Test Socket has floating guide plate.

Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over...

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Electronic Sockets

Test/Burn-In Socket accommodates devices up to 13 mm².

Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact...

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Socket/Ratchet Sets deliver SuperTorque® fastening power.
Ratchets

Socket/Ratchet Sets deliver SuperTorque® fastening power.

With low profile design, socket and ratchet sets engage fastener flats for higher torque application. Configurations include: 14-piece, Â-¼ in. drive set; 12-piece, 3/8 in. drive set; 21-piece, 3/8 in. drive set; 12-piece, ½ in. drive set; and 17-piece, ½ in. drive set. Detents on all socket inner walls ensure tight, positive engagement with drive tool in any orientation....

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Electronic Sockets

BGA Socket is side stackable to increase packaging density.

Offered in 2- and 4-bolt hold-down styles, Pin-Ball Socket may be soldered side-by-side, directly to existing footprint of PC board. Surface-mount BGA and LGA socket provides 2 mm clearance for end components. It can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint, on any size board. Socket incorporates spring-probe technology with spring force of 17 g at .025 in....

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Dome Sockets are spark proof.
Tool Sockets

Dome Sockets are spark proof.

Deep tank-car dome sockets, constructed of manganese bronze, have 1 in. square drive and 4 in. internal depth. Weighing 6 lb each, sockets come in 8-point and hex sizes from 1 7/16 to 1 11/16 in. T-handle wrench is available, and sockets can be used with air impact wrenches.

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Electronic Sockets

RF Test Sockets feature conduction-cooled system.

Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is...

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Cable Assemblies/Sockets meet IDB/IEEE 1394 standards.
Electrical Connectors

Cable Assemblies/Sockets meet IDB/IEEE 1394 standards.

IDB IEEE1394 Consumer Convenience Port Connectors are offered in lengths up to 10 m and in 4 different versions: bilingual plug to bilingual plug, bilingual plug to beta plug, bilingual plug to IEEE 1394 AV plug, and bilingual to IEEE 1394-95 plug. Hot-pluggable units have positive locking feature and audible click. Copper-based system supports transmission speeds up to 1,600 Mbits/sec. Right...

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Electronic Sockets

Adapter is offered in 28-pin version.

Correct-A-Chip® allows SSOP devices to be used on boards designed for older SOWIC packages without board rework or redesign. It is offered in 20- and 28-pin versions. SSOP 0.65 mm pitch package can be hand soldered or attached by standard SMT soldering on adapter's top side. Pins are hardened brass alloy with tin-lead plating. Operating temperature range is -67 to 257°F.

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Socket offers high-density BGA packaging.
Electronic Sockets

Socket offers high-density BGA packaging.

Micro PGA socket is available in 478 circuits and can be used with Intel® Mobile Pentium® 4 Processor-M Series and Celeron® processors. Self-centering BGA solder balls help prevent bent leads. Socket is 3.30 mm high and based on 1.27 mm grid array. Chamfered-contact design provides low insertion force. LCP housing and cover withstand high-temperature soldering environments,...

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