Semiconductor Firms Collaborate with Synopsys to Validate New ATPG Technology
Significant Improvement in the Quality of At-Speed Testing Expected from Test Pattern Generation Based on Precise Timing MOUNTAIN VIEW, Calif., Oct. 17 // -- Synopsys, Inc. (NASDAQ:SNPS), a world leader in semiconductor design software, today announced that it has collaborated with several semiconductor firms to test a new automatic test pattern generation (ATPG) technology designed to increase...
Read More »austriamicrosystems' Design for Manufacturability (DFM) / Design for Yield (DFY) Services Boost Yield of Your High-Performance Analog Products
First foundry worldwide offering comprehensive DMY/DFM reference design flow for its specialty technologies Unterpremstaetten, Austria (October 11, 2006) - austriamicrosystems' business unit Full Service Foundry announced today at the Fabless Semiconductor Association (FSA) Supplier Expo in San Jose the availability of its comprehensive DFM/DFY reference design flow for its advanced CMOS, High...
Read More »FlipChip International Announces Enhanced Lead Free (ELF(TM)) Technology for Major Improvements in WLCSP Drop Test Performance
PHOENIX, Oct. 6 // -- FlipChip International LLC announced today that it has demonstrated a near 10x breakthrough in reliability relative to the JEDEC JESD22-B111 Drop Test Specification for Wafer Level Chip Scale Packaging (WLCSP) products utilizing a new lead-free technology called Enhanced Lead Free(TM) (ELF(TM)). This major achievement was first realized in FCI's Advanced Reliability...
Read More »Field Programmable Object Arrays operate up to 1 GHz.
Re-programmable Arrix FPOAs support 400 independent, configurable objects linked via programmable 1 GHz interconnect fabric. Units operate in industrial temperature ranges and are available in both standard eutectic and RoHS-compliant packaging. Products are suited for performance-demanding applications in industries such as machine vision, professional video, medical imaging, and...
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Vertical Integration vs. Outsourcing
This white paper gives an overview into key industry trends and insights regarding vertical integration vs. outsourcing and understanding how they differ.
Read More »Quellan Announces Q:ACTIVE(TM) Intelligent Cable Technology for Today's Mega Data Centers
Quellan Collaborates with Gore Industries to Integrate Smart Silicon into GORE(TM) EYE-OPENERÃ-® Cable to Improve Reach, Speed, Airflow and Latency NEW YORK, Sept. 18 /- Quellan, a leader in analog signal integrity devices, today announced its ability to transform data center cable interconnects from passive, non-active devices to intelligent roadways for use in today's mega data centers. In...
Read More »Transmitter and Receiver deliver deep color to HDTV.
VastLane SiI 9133 consists of dual-input HDMI receiver that enables HDTVs to display deep color content transmitted by consumer products, such as Sony PlayStation 3 and high-definition DVD players. VastLane SiI 9134 transmitter may be integrated into HD DVD and Blu-ray Disc DVD players and recorders to transmit deep color content for optimal image quality. Both deliver 6.75 Gbps bandwidth and...
Read More »Broadcom Demonstrates the Industry's First 2.5 Gigabit End-to-End Networking Infrastructure Solution Optimized for Blade Servers
Combination of Broadcom-® NetXtreme-® II C-NICs and New StrataXGS-® III Switches More Than Doubles Networking Throughput Using Existing Blade Infrastructure In a Separate Demonstration, Broadcom Provides Sneak Peak of 10 Gigabit Ethernet C-NIC Prototype GARDEN GROVE, Calif., April 19 / -- (Server Blade Summit), Broadcom Corporation (NASDAQ:BRCM), a global leader in semiconductors for wired and...
Read More »CEVA to Demonstrate Industry's Lowest Cost-Per-Channel Voice over IP Platform at Spring VON 2006
SAN JOSE, Calif., Spring VON 2006, March 14 / -- CEVA, Inc. (NASDAQ:CEVA), the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry, today announced it will showcase the Industry's lowest cost-per-channel Voice over IP (VoIP) platform at Spring VON, San Jose, California, 14-17 March 2006, at Booth #1638. At the show, CEVA...
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Fairchild Semiconductor's -µSerDes(TM) Selected by LG Electronics for its New Line of Ultra-Sleek 'Chocolate' Cell Phones
FIN24AC offers the smallest, lowest EMI, lowest power consumption serialization device for ultra-portable applications South Portland, Maine--March 8, 2006--Fairchild Semiconductor (NYSE: FCS), the leader in serialization solutions for the ultra-portable market, announces that its FIN24AC -µSerDes(TM) (micro-SerDes) has been selected for use in LG Electronics' new Chocolate phones, the first...
Read More »Fairchild Semiconductor to Exhibit Power-Efficient Products at IIC-China 2006
South Portland, Maine--February 23, 2006--Fairchild Semiconductor (NYSE: FCS), the leading global supplier of high-performance products that optimize system power, today announced that the company will highlight its power product portfolio and Global Power Resource(TM) design centers at the International IC-China Conference & Exhibition (IIC-China), beginning in Shanghai, March 6. Through...
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Innovative Dampney Coating Systems Suit Even the Most Specialized Applications
Dampney's high performance coating systems provide protection against extreme weather, chemicals, and corrosive environments for atmospheric, immersion, and underground applications. Check out the video to learn more.
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