Semiconductors

IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging

BILLERICA, Mass. - TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now...

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M/A-COM Technology Solutions Inc. Showcases New Products at MTT-S 2012

What: M/A-COM Technology Solutions (M/A-COM Tech), a leading supplier of high performance analog semiconductor solutions, is showcasing a broad portfolio of new products for wireless backhaul, CATV, optical communications, and aerospace and defense applications at the IEEE/MTT-S International Microwave Symposium tradeshow in MontrÃ-©al, Canada. New product solutions on display in M/A-COM...

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Altair's TD-LTE Chipset Selected by Olive Telecom, India's Leading Convergence Solutions Device Developer

HOD HASHARON, Israel - Altair Semiconductor (http://www.altair-semi.com), a leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets [http://altair-semi.com/products/fourgee-31006200 ], today announced that its 'Hornet' TD-LTE chipset, recently introduced to the Indian market, has been selected by Olive Telecom to power Olive's line of LTE enabled products. Olive...

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Altair Semiconductor Launches TD-LTE Chipset Optimized for Indian Market

HOD HASHARON, Israel -- Altair Semiconductor (http://www.altair-semi.com), a leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets [http://altair-semi.com/products/fourgee-31006200 ], today announced that it has released a cost and feature-optimized chipset tailored for the Indian TD-LTE market, which is expected to become one of the fastest-growing LTE...

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Open-Silicon Expands Semiconductor Design Solutions

Solutions Expertise in Pune, India, Meets Customer Demands for Complete SoC Solutions MILPITAS, Calif. - Open-Silicon, Inc., a leading semiconductor design and manufacturing company, announced today that the company has further expanded its comprehensive solutions offering for semiconductor and system companies to include architectural analysis and modeling, pre-silicon prototyping, embedded...

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Innovasic Celebrates 20 Years Supplying Embedded Semiconductor Solutions

ALBUQUERQUE, NM, USA - Innovasic is pleased to announce that 2012 marks the company's 20th anniversary as a business dedicated to providing embedded semiconductor solutions in the industrial and military markets. The company has grown from ASIC design services to a supplier of semiconductor solutions and software for embedded communication and control. Serving over 500 customers worldwide, the...

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Triple Gate Oxide CMOS Process suits mixed signal applications.

Able to support wide voltage ranges, 0.13 Â-µm triple gate oxide CMOS process is fully compatible with standard CMOS process and designed to keep all device parameters unchanged within process variation ranges. Additional layer of gate oxide introduces 1.8 V CMOS into standard 1.2/3.3 V CMOS array on 0.13 Â-µm technology. Using modular characteristic for IC design provides flexibility,...

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TI Introduces World's First Configurable NDIR Gas Sensing and PH Sensing AFEs

Single-chip solutions simplify design & accelerate time-to-market DALLAS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two configurable analog front ends (AFE) that provide an easy-to-use, modular solution for bridging the gap between the microprocessor and sensor. Design engineers can dramatically reduce their development time by using a single AFE across multiple...

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VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC

SHANGHAI, -- VeriSilicon Holdings Co., Ltd. (VeriSilicon), a world-class, custom silicon solutions and semiconductor IP provider, announces immediate availability of Hantro G1v5 Multi-format Decoder and Hantro H1v5 Multi-format Encoder semiconductor IPs which support 4K x 4K video, achieved through core enhancements and improved memory latency resiliency up to 600 cycles. Both products are...

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Broadcom Completes World's First Microsoft-® Mediaroom(TM) Client Integration with New Embedded Wireless High Definition Set-Top Box Solution

Broadcom Delivers Production-Ready, Carrier-Grade Wi-Fi for Whole-Home High Definition Video Distribution IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its BroadcomÂ-® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the MicrosoftÂ-® Mediaroom(TM)...

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