ESD Protection Device is designed for cell phone USB ports.
Featuring separate 28 V transient voltage suppressor (TVS) diode, RClamp3654P protects VBus against fault conditions when standard USB port is used for charging battery. It offers transient ESD protection for high-speed data lines to IEC 61000-4-2 15 KV (air) and 8kV (contact), EFT protection to IEC 61000-4-4 40A, and protects USB DP, DM, and ID pin up to 5.5 V. Device comes in leadless 6-pin...
Read More »Toshiba Develops Cost-Effective 32 nm CMOS Platform Technology by Advanced Single Exposure Lithography
TOKYO - Toshiba Corporation (TOKYO: 6502) today announced a cost-effective 32nm CMOS platform technology that offers higher density and improved performance while halving the cost per function from 45nm technology. The platform was achieved by application of advanced single exposure lithography and gate-first metal gate/high-K process technology. This technology enables a 0.124 Ã-µm2 SRAM...
Read More »Sandbridge Technologies Demos LTE at Mobile World Congress 08 in Barcelona
Advanced mobile chip innovator showcases 4G Software Modem form-factor UE TARRYTOWN, N.Y., Feb. 7 -- Sandbridge Technologies, a cutting edge fabless semiconductor company developing multi-mode baseband/multimedia processors for low-cost advanced mobile data devices, announced today that it will showcase an LTE UE implementation based on it's SB3000Ã-® series SOC platform during the Mobile...
Read More »NEC Electronics Announces Agreement to Develop Power Management IC Solution for Mobile Internet Devices
NEC Electronics Applies Mobile Market Expertise to Highly Integrated MID Solution KAWASAKI, Japan and SANTA CLARA, Calif., Feb. 4 -- NEC Electronics Corporation and its subsidiary in the United States, NEC Electronics America, Inc., today announced that they have teamed with Intel Corporation to develop a power management IC (PMIC) solution optimized for mobile Internet devices (MIDs). The highly...
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The Ultimate Guide To UV Disinfection Lighting
This white paper provides a guide to UV disinfection lighting and their benefits over alternative disinfection methods.
Read More »IBM Alliances Deliver Easier Path to Next Generation Semiconductor Products
Smaller, faster more power-efficient* 32 nanometer semiconductors span low-power consumer devices, high-performance computing ARMONK, NY - 10 Dec 2007: IBM (NYSE: IBM) and its joint development partners -- AMD, Chartered Semiconductor Manufacturing Ltd., Freescale, Infineon, and Samsung -- today announced an innovative approach to speed the implementation of a breakthrough material known as...
Read More »STMicroelectronics Introduces World's First 24-Bit Audio DAC with Playback Time Extender Technology for Mobile Music Applications
Single-chip solution includes ST's innovative PTE(TM) (Playback Time Extender) function, reducing system power consumption for longer music playback time, plus on-chip power management enabling direct connection to battery GENEVA, Jan. 30 -- STMicroelectronics (NYSE:STM) today announced a very high performance 24-bit audio DAC (digital to analog converter) that is intended for the mobile music...
Read More »Power Technology, Inc. Expands Selection with Opnext, Powered by Hitachi Products
October 30 , 2007 LITTLE ROCK, AR - October 30, 2007 - Photonic Components Group, a division of Power Technology, Inc., a leading force in the laser industry for almost 40 years, has been appointed as a reseller of Opnext, powered by Hitachi laser diode products. Opnext is the former Hitachi laser diode and photonics division. Opnext, powered by Hitachi offers laser diodes in the 635nm to 852nm...
Read More »Sequans Provides Chips to USI to Develop Mobile Wimax End User Devices and System-In-Package (SIP) Modules
CUPERTINO, Calif. and PARIS - November 26, 2007 -- Sequans Communications, leading WiMAX chipmaker, announced today that USI (Universal Scientific Industrial), a leading global networking and communications equipment manufacturer based in Taiwan, is using Sequans chips as some of its solutions to manufacture Mobile WiMAX end user devices and SIP-based (system-in-package) modules. USI has been...
Read More »MOSBDs target DC-DC converters in portable devices.
Model TPCA8A02-H MOSBD(TM) devices feature drain-source voltage of 30 V, drain current of 34 A maximum, and RDS(ON) of 4.8 mW typ, in 5 x 6 x 0.95 mm SOP Advance package. Measuring 5 x 6 x 1.6 mm, TPC8A03-H offers drain-source voltage of 30 V, drain current of 15 A, and RDS(ON) of 5.1 mW. Both products integrate power MOSFET and Schottky Barrier Diode onto single die and utilize aluminum strap...
Read More »Parvus Selects DDC's New MIL-STD-1553 PC/104-Plus Card for US Navy Aircraft Upgrade Program
DDC's 1553 Card Qualified by Parvus as Integration Option for DuraCOR 810 Mission Processor BOHEMIA, NEW YORK - January 7, 2008 - Data Device Corporation (DDC), an international leading supplier of high-reliability MIL-STD-1553 and ARINC 429 data bus products, is pleased to announce a new partnership with Parvus Corporation. Parvus has selected DDC's MIL-STD-1553 PC/104-Plus card for use in...
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560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
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