Services offer semiconductor testing and conversion.
Independent RoHS compliance service center, E-Certa, converts semiconductors that contain lead to lead-free, RoHS-compliant devices. Service provides customers with X-ray fluorescence test results, certificate of compliance, new package labeling, and Material Composition Declaration form to ensure due diligence. Other services include conversion of no-lead to leaded components for military and...
Read More »Semiconductor Wafer addresses classic heat problems.
Available in 10 x 10 mm square pieces, GaN-on-diamond Xero Wafer(TM) consists of gallium nitride layer atomically attached to freestanding, polycrystalline chemical-vapor-deposited diamond substrate measuring 25 microns thick. GaN that is exposed offers atomically smooth surface finish that is epi-ready for further epitaxial deposition. Sub-nanometer proximity of chip's active region to diamond...
Read More »Samsung's First Symbian OS and Series 60-Based Smartphones Powered byTexas Instruments Wireless Technology
TI's OMAP(TM) Processor and Bluetooth(R) Technology Drive Symbian OS(TM), Entertainment and Productivity Applications in New Samsung Smartphones DALLAS, Oct. 6 -- Texas Instruments Incorporated (NYSE:TXN) (TI) today announced that Samsung Electronics has selected technology from TI's OMAP(TM) platform and Bluetooth(R) solutions for its first Symbian OS(TM) and Series 60-based smartphones, the...
Read More »System-on-Chip facilitates wireless networking.
Based on CC2420 ZigBee(TM) radio transceiver, Series CC2430 combines radio, programmable microcontroller, flash memory, and both IEEE 802.15.4 and ZigBee(TM) software, all on single silicon die. Three different models offer 32, 64, and 128 kByte flash configurations, each with 8 kBytes of RAM. Units are based on SmartRFÃ-®03 platform in 0.18 Ã-µm CMOS and are available in 7-7 mm 48-pin...
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A Guide to Custom Water Manifold Assemblies
This white paper provides a guide to custom water manifold assemblies.
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Power Serialization Solutions come in 3.5 x 4.5 BGA chip.
Configurable as serializer or deserializer, Ã-µSerDes(TM) FIN12 and FIN24 devices reduce parallel paths of data to 780 MB/s max data rate serial link. Interface solutions can be implemented across multiple display platforms. Devices, which reduce EMI by 30-40 dB at fundamental frequency, also reduce harmonics to less than -100 dBm. They offer low power LVDS or Current Transfer Logic(TM)...
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CMOS Bus Switches suit hot-plugging applications.
Pin-compatible with existing TTL parts, 20 bit, dual-port switches operate from supply voltages of 4-5.5 V. They have power-down protection on inputs and outputs and offer latch-up immunity and ESD protection to 2 kV. Off resistance and On resistance, typically rated at 2-25 ohm, maximize isolation when Off and minimize loading when On. Power dissipation is typically 1 Ã-µA. Devices are...
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Semiconductor Assemblies can be panel or DIN-rail mounted.
Power Semiconductor Assemblies, suited for applications requiring up to 400 A, combine Power Semiconductors with heat sinks and other components to provide pre-engineered solutions specifically designed to work within predetermined ambient operating environments. Resulting assemblies are offered with transistors, including MOSFET and IGBT; thyristors, including triacs; and diodes. Assemblies are...
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Innovative Dampney Coating Systems Suit Even the Most Specialized Applications
Dampney's high performance coating systems provide protection against extreme weather, chemicals, and corrosive environments for atmospheric, immersion, and underground applications. Check out the video to learn more.
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