Semiconductors

Altera Showcasing Transceiver Innovations that Enable CFP4 Interoperability and 25G Backplane Interfaces at DesignCon 2014

Technology Demonstrations, Panel Discussions and Paper Presentations Provide Further Details into Altera Generation 10 FPGAs and SoCs SAN JOSE, Calif.Â- – Altera Corporation (Nasdaq: ALTR) will discuss how its innovations in semiconductor design are paving the way for its Generation 10 products to enable the evolution of next-generation networks at DesignCon 2014.Â-  Altera experts in...

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Digi Adds Android Support for the ConnectCard for i.MX28 Wireless Module

-iDigi Device Cloud enables rapid development of cloud-connected Android devices- MINNETONKA, Minn.Â- -Â- Digi InternationalÂ- (NASDAQ: DGII) today announced it will offer Android support for the ConnectCard™ for i.MX28 module, a compact wireless system-on-module for developing connected devices based on Freescale™ Semiconductor technology.Â-  Embedded application development...

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STMicroelectronics and Soundchip Introduce Components to Create Smart High-Definition Audio Accessories that Dazzle

Powerful new audio engines combined with high-performance MEMS microphones enable feature-rich, software-controlled headsets that take personal audio to the next level Geneva, Switzerland – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance audio ICs, together with Soundchip,...

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Triple Gate Oxide CMOS Process suits mixed signal applications.

Able to support wide voltage ranges, 0.13 Â-µm triple gate oxide CMOS process is fully compatible with standard CMOS process and designed to keep all device parameters unchanged within process variation ranges. Additional layer of gate oxide introduces 1.8 V CMOS into standard 1.2/3.3 V CMOS array on 0.13 Â-µm technology. Using modular characteristic for IC design provides flexibility,...

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TI Introduces World's First Configurable NDIR Gas Sensing and PH Sensing AFEs

Single-chip solutions simplify design & accelerate time-to-market DALLAS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced two configurable analog front ends (AFE) that provide an easy-to-use, modular solution for bridging the gap between the microprocessor and sensor. Design engineers can dramatically reduce their development time by using a single AFE across multiple...

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VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC

SHANGHAI, -- VeriSilicon Holdings Co., Ltd. (VeriSilicon), a world-class, custom silicon solutions and semiconductor IP provider, announces immediate availability of Hantro G1v5 Multi-format Decoder and Hantro H1v5 Multi-format Encoder semiconductor IPs which support 4K x 4K video, achieved through core enhancements and improved memory latency resiliency up to 600 cycles. Both products are...

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ECG/EEG Analog Front Ends offer on-chip respiration measurement.

By integrating 44 discrete components, 24-bit ADS1298R Series facilitates implementation of respiration detection in portable ECG equipment. Devices provide respiration impedance at resolution of 20 mW, enabling accurate monitoring and correlation of patient respiration to ECG abnormalities. Housed in 8 x 8 mm BGA package with 4, 6, or 8 channels, AFEs use only 750 Â-µW/channel with multiple...

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Broadcom Completes World's First Microsoft-® Mediaroom(TM) Client Integration with New Embedded Wireless High Definition Set-Top Box Solution

Broadcom Delivers Production-Ready, Carrier-Grade Wi-Fi for Whole-Home High Definition Video Distribution IRVINE, Calif. - Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that its BroadcomÂ-® BCM4717V wireless system-on-a-chip (SoC) solution is the world's first to complete the MicrosoftÂ-® Mediaroom(TM)...

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Low-Power Semiconductor Technology promotes energy efficiency.

Combining SOI (Silicon-on-Insulator) substrate technology with 0.16 micron lithography, next-generation variation of BCD (Bipolar-CMOS-DMOS) smart power semiconductor technology aims to reduce power consumption of electronic systems. It will enable chip designers to combine high-density logic circuitry (1.8 and 3.3 V CMOS) with full dielectric isolation and component portfolio, including power...

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