Wireless Sensors Push Smart Machines into Green Revolution
STMicroelectronics, ARaymond and Micropelt to Demonstrate Thermal-Energy Harvesting Solutions at Hannover Fair - Hall 8, D26 GENEVA, GRENOBLE, France and FREIBURG, Germany - STMicroelectronics (NYSE: STM), ARaymond and Micropelt today announced that they are jointly presenting thermal-energy harvesting-based solutions to power 'smart sensors' and 'smart microsystems' at the Hannover Fair under...
Read More »SPiDCOM Successfully Demonstrates Omega's 1Gbps PLC Technology
PARIS-- SPiDCOM Technologies, Leader of the PLC (Powerline Communication) Work Package of the OMEGA European Research Project, is Paving the way for its Future Gigabit Class SoC Starting in January 2008, OMEGA is a European research project whose aim is to develop the next generation of home networking. Its innovation dwells in the creation of a multiple-technology gigabit network based on...
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New Isolated DC-DC Converter Development Tools Increase Power Density of Modular and Embedded Power Supplies
National Semiconductor, Silicon Labs Offer Reference Design and Evaluation Board for Networking and Communications Applications SANTA CLARA, Calif. and AUSTIN, Texas -National Semiconductor Corp. (NYSE:NSM) and Silicon Laboratories Inc. (Nasdaq:SLAB) today announced a new quarter-brick isolated DC-DC converter evaluation board and reference design to help power supply designers get higher power...
Read More »RF Micro Devices-® Features Ember ZigBee-® Technology in New Family of High Performance Front End Modules for Smart Energy Applications
GREENSBORO, N.C., and BOSTON, - RF Micro Devices, Inc. (Nasdaq: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced today it is teaming with Ember Corporation to introduce ZigBee-® front end modules (FEMs) for smart grid applications that give utilities and consumers more control over how they...
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Manufacturing 101 for Rubber Molding
Rubber molding is the process of converting uncured rubber into a stable final product.
Read More »RFMD-® Achieves Milestone in Commercialization of High-Performance Photovoltaic Cells
GREENSBORO, N.C., Mar 15, 2010 - RF Micro Devices, Inc. (Nasdaq:RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced it has successfully manufactured the industry's first photovoltaic cell using high-volume six-inch gallium arsenide (GaAs) machinery. The photovoltaic (PV) cell was manufactured...
Read More »Hall-Effect Sensor Interface offers analog and digital outputs.
Available in 3 x 5 mm, 10-pin Â-µMAXÂ-® package, dual 2-wire Model MAX9621 enables microprocessor to monitor status of Hall-effect sensors either through analog output by mirroring sensor current for linear information or through filtered digital output. Device protects sensors from supply transients up to 60 V and short-to-ground conditions. Operating from 5.5-18 V supply, MAX9621...
Read More »Thermal Test Chip meets JEDEC standards.
TTC-1002 Thermal Test Chips deliver precise thermal loads to specific geographic areas of semiconductor package or PCB to simulate thermal performance characteristics of subsystem. Cell, which measures 2.5 x 2.5 mm, may be used individually or combined in matrix of up to 40 x 40. There is always periphery access for all heating and Kelvin enabled measurement connections, and strategically placed...
Read More »Front End Modules target mobile Wi-Fi applications.
Housed in 3.0 x 3.0 x 0.5 mm package, Models RF5325, RF5345, and RF5725 each contain 2.4 GHz power amplifier, output power coupler, transmit low pass filtering, and SP3T switch capable of switching between Wi-Fi Rx, Wi-Fi Tx, and BluetoothÂ-® Rx/Tx operations. Models RF5345 and RF5725 also integrate low noise amplifier for RF architectures requiring additional Rx gain. Featuring 3.3% error...
Read More »Cellular Front End Platform provides 9-band coverage.
Featuring converged, multimode architecture, Model RF6460 simultaneously supports implementation of up to 5 WCDMA/HSPA+/LTE bands and all 4 bands of GSM/GPRS/EDGE in 3G/4G multimode mobile devices. Unit is comprised of RF6260 multi-band, multimode power amplifier module; RF6360 antenna switch module; and RF6560 front end power management IC. Platform utilizes 2 quadrature amplification paths...
Read More »Transmit Modules target emerging market handsets.
Class 12-compliant RF716x dual-band GSM/GPRS transmit modules feature 2 symmetrical, interchangeable receive ports for optimized routing during implementation. They utilize GaAs pHEMT as well as PowerStarÂ-® integrated power control technology, also integrating transmit filtering to maximize harmonic performance. At 6.63 x 5.24 x 1.00 mm and with mirrored footprints, modules incorporate ESD...
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Simple Connection – MGB with EtherNet/IP
The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.
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