New Placement Equipment Products

Universal Instruments AdVantis-Lightning Chip Placement Solution on Display at NEPCON

At Nepcon 2006 Universal Instruments will be displaying the AdVantis Lightning, a high speed modular system featuring Universal's acclaimed Lightning head. The AdVantis Lightning Platform combines the throughput of Universal's revolutionary rotary Lightning head with the flexibility and value driven performance of the acclaimed AdVantis platform. With its ability to deliver high utilization for...

Universal Instruments at Productronica 2005

Industry-leading component placement specialist Universal Instruments will use Productronica 2005 to showcase its innovative Lightning(TM) rotary placement head - an enabling technology that makes all-platform lines a reality for medium to high volume assembly applications. The Lightning head features 30 independently-controlled spindles with touchdown sense, auto Z update at pickup, and board...

Placement Machine offers 100 ppm performance.

Featuring built-in turret technology, 4-gantry Quadris-S(TM) combines 80,000 cph placement performance, size 0201 to 44 x 44 mm component range, and support for tape and tray feeders. It provides motion controls and productivity optimizers such as automatic board centering between feeder banks and on-the-fly gang recognition. Fine pitch capabilities support BGA or leaded packages of 0.5 mm pitch....

Assembly/Placement System utilizes VRM linear motors.

Delivering accuracies of Ã-

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Die Feeder is optimized for handling small flip chips.

Able to feed variety of bare die and flip chips, DDf Ultra can be mounted on most placement machines. It is capable of feeding die down to 0.5 x 0.5 mm, with throughput exceeding 6,000 die/hr. By combining DDf Ultra with SMT chip shooter, users can create die shooter or flip chip shooter for complete die assembly solution.

Placement Platforms address various assembly tasks.

Platform AC-30L utilizes rotary Lightning head with radial array of 30 modular, individually controlled spindles. It drives placement rates up to 30,000 cph and addresses component range from 0201s to 30 x 30 mm. Multi-Function AX-72 deploys up to 2 heads on one beam, offering combination head capability. Component range is from 0201s to 55 x 55 mm devices at placement rates to 16,500 cph. It...

SMT Placement System runs multiple jobs without pause.

Advantage autoplacer, with 324-feeder capacity, is configured so that when first job is finished, feeders for second job are already waiting. System can place entire range of components, from 0201's up to 55 x 55 mm, with speeds up to 21,600 c/hr without need for fine pitch placer or chip shooter. It has modular design that incorporates integration software package.

Placement Machine delivers high-volume chip placement.

Quadris(TM) hybrid quad-beam SMT chip-placement system, configured with Lightning(TM) heads and turret-style HSP, achieves 62,000 cph placement speed due to integration of dual-drive linear motors. Features include automatic placement-height optimization, Productivity Shift(TM) board transfer system, on-the-fly gang recognition, and bank feeder change and splicing capabilities.

Placement Machine suits flip chip industry.

Featuring single-beam positioning system, AdVantis(TM) AFC-42 employs dual-drive lead screws as well as 1 Ã-µm linear encoders. It includes high-magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, and several feeder types. Up-front configurability and future scalability make machine suited for high-mix and high-volume manufacturers.

Placement Machine offers placement rates to 54,000 cph.

Platform-based Genesis Lightning features dual heads, each with radial array of 30 modular, individually controlled spindles. Each plug-in spindle module contains tiny venturi vacuum generator to maintain very short vacuum path. Dual on-the-head optics allow machine to address components from 01005 to 30 x 30 mm. Machine supports component preorientation as well as on-the-head rejection for small...

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