Die Feeder is optimized for handling small flip chips.
Press Release Summary:
Able to feed variety of bare die and flip chips, DDf Ultra can be mounted on most placement machines. It is capable of feeding die down to 0.5 x 0.5 mm, with throughput exceeding 6,000 die/hr. By combining DDf Ultra with SMT chip shooter, users can create die shooter or flip chip shooter for complete die assembly solution.
Original Press Release:
Hover-Davis Releases the DDf Ultra
April 19, 2005. Hover-Davis, Inc., Rochester, NY. Hover-Davis's Semiconductor Feeding Solutions Group is proud to announce the release of the latest addition of its Direct Die Feeding product line; the DDf Ultra. The DDf Ultra is capable of feeding a wide range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine.
As a complement to the DDf, which has been an industry leading die feeding solution for the past 4 years, the performance of DDf Ultra is optimized around the handling of small flip chips. Upon release, the DDf Ultra is capable of feeding die down to 0.5 mm sq. with a throughput exceeding 6,000 die/hour - with smaller die sizes, and higher throughputs planned.
Roland Heitmann, Director of the Semiconductor Feeding Solutions Group states, "We have seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining our DDf Ultra with a state of the art SMT chip shooter, we can create a "die shooter" or "flip chip shooter", which is essentially new class of die assembly solution. We believe these solutions have the capability of offering our customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies."
Hover-Davis is recognized as a world leader in the design and manufacture of component delivery systems for the electronics assembly industry. We provide feeding solutions for Fuji, Panasonic, Universal Instruments, Siemens, Assembleon, Samsung, Mydata, Juki, Yamaha, Alphasem, and numerous custom automation manufacturers. Our products include electronic multi-pitch tape feeders, label feeders, print-on-demand label feeders, and bare die feeders. In order to provide world class solutions to our customers today and tomorrow, we continue to invest heavily in new product development, operations, applications, and after-sales support. Located in Rochester, NY, Hover-Davis was founded in 1989, and is now a subsidiary of Dover Corporation.
www.hoverdavis.com
Hover-Davis prime contact:
Roland Heitmann
Director, Semiconductor Feeding Solutions Group
rheitmann@hoverdavis.com
+49 (7127) 8878100
