Placement Equipment

Placement Machine offers speeds of up to 48,000 cph.

Placement Machine offers speeds of up to 48,000 cph.

Model 4797R HSP measures 3,100 x 2,155 mm and can handle boards up to 610 mm x 460 mm. It includes twelve 5-spindle, direct-drive placement heads and UCT53 software for offline programming. Three-sigma accuracy is 0.08 mm for MELFs and small chips, and 0.05 mm for leaded components. Machine accepts up to 72 unique components on standard 8 mm tape feeders, or 96 unique components with dual-track...

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Feeder System suits pick-and-place process.

Feeder System suits pick-and-place process.

Triligent Triple Intelligence Feeders, available in tape and stick configurations, maintain uninterrupted high-speed communication with pick-and-place machine. Multiple-LED status indicator and operator signaling display are provided on each unit. Data transmission between Feeder and pick and place system is accomplished via optical interface. Closed-loop servo tape-advance mechanism can be...

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Placement Machine targets small- to mid-size manufacturers.

Placement Machine targets small- to mid-size manufacturers.

Vantis(TM) placement platform, for circuit board manufacturing, incorporates single-beam positioning system and supports limited number of heads, cameras, and configurations. Choice of 7-spindle high-speed, or 4-spindle flexible heads accommodates wide component range. Asian language application support, networking capabilities, and intuitive GUI simplify use. Vantis is suitable for manufacturers...

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Assembly Station produces to IPC Class 3 specifications.

Expert FPSA-BGA semi-automatic assembly station has 2 heads and 2 vision systems, 1 with glass prism for fine pitch parts and 1 with split vision for ball grid array packages. After alignment has been achieved, automatic mounting of component guarantees exact placements. Reality-based graphics allow operator to double-check placement programming prior to assembly. Program sequence is shown...

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