Inspection Equipment

ASC International to Exhibit 3D SPI/AOI at SMTA Michigan

ASC International to Exhibit 3D SPI/AOI at SMTA Michigan

MEDINA, MINNESOTA - ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit at the SMTA Michigan Expo Tech Forum, scheduled to take place Thursday, May 19, 2016 at Laurel Manor. ASC International will offer live demonstrations of the VisionPro M500 during the expo. Designed with...

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Hi-Res 3D Scanning Arm aids modeling, engineering applications.

Hi-Res 3D Scanning Arm aids modeling, engineering applications.

FAROÂ-® Design ScanArmÂ- provides users withÂ- portable 3D scanning solution for 3D modeling, reverse engineering, and CAD-based design applications across PLM process. While lightweight and maneuverable design allows for desktop mounting, UI facilitates operation regardless of skill level or 3D scanning experience. Blue laser technology delivers Hi-Res point cloud data and seamlessly...

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Gearing Up for Quality at Forest City

Keyence IM Series Instant Measurement system saves time and eliminates errors for this Illinois gear manufacturer. Quality inspector, Amy Sovina, says she's not a big fan of turning the knobs on an optical comparator. Not only is it time consuming and tedious, but measurement results are often subjective as well. So when she learned that her employer, Forest City Gear, was purchasing an IM Series...

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Stable Measurement of Polished Targets Now Possible for ENR PWT

Stable Measurement of Polished Targets Now Possible for ENR PWT

Photowatt, a pioneer in the solar-energy industry since 1979, uses Keyence's LK-G displacement sensor for high-precision detection of wafer thicknesses. In March 2012 the company was acquired by French utility EDF, via its EDF ENR subsidiary, now known as EDF ENR PWT.A wafer is a thin slice of semiconductor material, such as silicon, which generally measures between 200 and 300 microns in...

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Wafer Inspection Systems support warped wafer scanning.

C-SAMÂ-® systems are available with Quantitative Dynamic Z™ (Q-DZ) surface tracking feature, which allowsÂ- for scanning of warped silicon wafers. All devices are imaged at depth of interest, all internal features remain in focus and within gate, and all rejects are identified without any false rejects due to warpage. Additionally, Q-DZ outputs contour coefficients/parameters, such as...

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ASC International Offering Live 3D SPI Demos at ACI Technologies' Tech Expo

ASC International Offering Live 3D SPI Demos at ACI Technologies' Tech Expo

MEDINA, MINNESOTA - ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will participate in ACI Technologies’ Third Annual Tech Expo, scheduled to take place April 27-28th at its facility in Philadelphia, Pa.Â-  ASC International will offer live demonstrations of the VisionPro M500 during the...

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Pipe Inspection Robot suits pipes from 4-20 in. in diameter.

Pipe Inspection Robot suits pipes from 4-20 in. in diameter.

Offered in 2 configurations, GECKO 9050 is suited for inspecting wide range of pipes, duct work, and industrial sites. Standard version features- 3 in. auto-leveling, pan and tilt camera head and 394 ft Kevlar reinforced cable as well as Sony CCD chip for clear images. Self-leveling function allows waterproof camera head to remain right side up while navigating pipe. Able to reach speeds up to...

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PRISYM ID to Attend 4th Annual Medical Device and Diagnostic Labeling Conference

PRISYM ID, the leading provider of labeling solutions for the medical device and life sciences industries, is to exhibit and sponsor at the 4th Annual Medical Device and Diagnostic Labeling Conference. The conference takes place on the 25th and 26th April 2016 at the Crowne Plaza Hotel, Alexandria in Virginia, USA. PRISYM ID will be exhibiting its central labeling platform, PRISYM 360, as well as...

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