Aries Electronics, Inc.
Bristol, PA 19007
Adapter is offered in 28-pin version.
Correct-A-ChipÃ-® allows SSOP devices to be used on boards designed for older SOWIC packages without board rework or redesign. It is offered in 20- and 28-pin versions. SSOP 0.65 mm pitch package can be hand soldered or attached by standard SMT soldering on adapter's top side. Pins are hardened brass alloy with tin-lead plating. Operating temperature range is -67 to 257Ã-
Read More »
Test Socket handles device types up to 27 mm.
Integra 27 has molded PPS plastic components designed to minimize space without sacrificing repeatability and durability. Device-specific spring probe insert can be machined to match testing needs. Socket's contacts are IDI spring probes, some which are electrically characterized to 10 GHz. Contacts are durable enough to handle burn-in and HAST testing. User replaceable contacts have current...
Read More »Correct-A-Chip Adapter operates up to 210-
Series 350000-HT lead-free Correct-A-Chip adapter enables users to upgrade from DIP devices to SOJ or SOIC devices with no PCB rework or redesign. It is offered on .300, .400, and .600 in. centers with 14, 16, 18, 20, or 24 pins. PCB is .062 in. Polyimid, rated at 260Ã-
Read More »
Test Socket has probe self-inductance as low as 0.5 nH.
High frequency test socket has replaceable spring probe interposer, which enables users to accommodate two separate interposers with same base socket. Features include solderless, single-ended spring probes; four locating posts; and hinged lid, double-latched lid, or CAM-style lid options. Pitches are available from 0.5 to 0.8 mm, signal path lengths are 0.095 in., and contact resistance is less...
Read More »
Socket suits BGA/CSP testing.
Interposer socket provides signal paths from 0.008 to 0.015 in. Able to work above 10 GHz, Interposer's contact system has dielectric material with etched pads on top and bottom. Socket offers pressure mount plunge-to-board interposer and pitches down to 0.3 mm. Contacts have self-inductance of 0.1 nH and resistance of less than 20 milliohms. Required contact force is 15 and 28 g (minimum) per...
Read More »
IC Pin Straightener causes no static.
DIP-R-SIZER(R) provides static protection while straightening pins on 0.300 or 0.600 in. center DIP ICs. Tool eliminates need for anti-static devices or complex pin straightening equipment. In use, device to be straightened is placed inside tool and squeeze brings leads into tolerance of 0.320 or 0.620 in.
Read More »LGA/BGA Socket offers optional built-in bias springs.
Land grid array/ball grid array (LGA/BGA) socket, suitable for ASIC applications, offers pressure mount contacts on top and bottom. Made from beryllium-copper alloy, with 30 micro in. gold per MIL-G-45204 over 50 micro in. nickel per QQ-N-290, socket also incorporates liquid crystal polymer (LCP). LGA/BGA socket is available in custom materials, plating, sizes, and configurations.
Read More »Circuit Bridge Adapter allows testing and upgrade without redesign.
Adapter internally bridges BGA device's circuitry without need for board redesign or rework, and allows PCB to change function while keeping same layout. User can probe circuit during debugging. Board material is 0.062 in. thick FR-4 with 10 layers. Solder balls are 0.020 in. dia Sn/Pb 90/10, and operating temperature is 221Ã-
Read More »BGA Sockets come with pitches of 1.00 or 1.27 mm.
Model BGA adapter has 3 polarizing locating pins for alignment of adapter with socket and 3-finger female contacts that provide wiping action. Socket has stamped and formed contact pins. When mated together, socket and adapter measure only 0.125 in. high. Extremely low insertion and withdrawal forces provided by gold-plated mating contact system, make socket and adapter suitable for high I/O or...
Read More »