Circuit Bridge Adapter allows testing and upgrade without redesign.
Press Release Summary:
Adapter internally bridges BGA device's circuitry without need for board redesign or rework, and allows PCB to change function while keeping same layout. User can probe circuit during debugging. Board material is 0.062 in. thick FR-4 with 10 layers. Solder balls are 0.020 in. dia Sn/Pb 90/10, and operating temperature is 221°F. Adapter is available in various materials, platings, sizes and configurations.
Original Press Release:
Aries' New BGA Circuit Bridge Adapter Provides Testing And Upgrade Capability Without Board Redesign
Frenchtown, NJ, February 2002 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a unique BGA circuit bridge adapter. The new adapter is a cost-effective means of both upgrading to higher performance devices as well as testing boards and devices without changing PCB layouts.
This adapter internally bridges the BGA device's circuitry without any need for board redesign or rework. High circuit density allows the PCB to change function while keeping the same layout and is able to probe the circuit during debugging.
The new adapter's board material is .062" (1.575 mm) thick FR-4 with 10 layers, which allows more circuitry to be contained in a smaller space, and the solder balls are .020" (.508 mm) in diameter, Sn/Pb 90/10. Operating temperature is 221°F (105°C).
As with all Aries test sockets, the BGA circuit bridge adapter is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a 399-ball BGA circuit bridge adapter starts at $29.50 in quantities of 150. Delivery is 2-4 weeks ARO.
