Aries Electronics, Inc.
Bristol, PA 19007
Test Plug suits standard PLCC sockets.
Model 44-301695-XX can debug and test circuit board prototypes as well as interface additional circuitry to existing design. It is available with cable soldered directly to plug, or socket or header on topside of plug. UL94V-0 rated body is 0.62 in. thick, glass-filled FR-4 material with 1 oz of copper traces. Male pins are brass alloy 360 with 200 Ã-µin. tin over 100 Ã-µin. nickel....
Read More »SOIC Adapters upgrade older relays.
Offered with 8 leads, SOIC Adapters are .062 in. thick FR-4 with 1 oz of copper traces on both sides. They are available on .300 in. DIP centers and can be mounted on PCBs with hole diameter of .028 in. Pins are 360 Ã-½ hard brass alloy, and pin plating is 5.08 Ã-µm minimum tin/lead 93/7 over 2.54 Ã-µm minimum nickel. Adapters provide upgrade from older Aromat HB2E relays to...
Read More »Adapter upgrades existing PLCC devices to SOJ or SOIC.
Existing PLCC devices can be upgraded to SOJ or SOIC without need for new PBC layout. Pins of these adapters butt solder to PLCC pads and are available in .09 or .03 in. lengths. Board material of surface mountable adapter is .062 in. thick FR-4 with 1 oz. of copper traces on both sides. Operating temperature is 221Ã-
Read More »Test Socket tests devices from 14 to 27 mm-² wide.
RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4...
Read More »Test and Burn-In Socket suits applications under 1 GHz.
Designed for use with devices from 14-27 mmÃ-², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302Ã-
Read More »Center Probe Test Socket suits devices to 13 mm-².
RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per...
Read More »Center Probe Test Socket has floating guide plate.
Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over...
Read More »Test/Burn-In Socket accommodates devices up to 13 mm-².
Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact...
Read More »BGA Socket is side stackable to increase packaging density.
Offered in 2- and 4-bolt hold-down styles, Pin-Ball Socket may be soldered side-by-side, directly to existing footprint of PC board. Surface-mount BGA and LGA socket provides 2 mm clearance for end components. It can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint, on any size board. Socket incorporates spring-probe technology with spring force of 17 g at .025 in....
Read More »RF Test Sockets feature conduction-cooled system.
Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is 5-194Ã-
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