Press Release Summary:
Land grid array/ball grid array (LGA/BGA) socket, suitable for ASIC applications, offers pressure mount contacts on top and bottom. Made from beryllium-copper alloy, with 30 micro in. gold per MIL-G-45204 over 50 micro in. nickel per QQ-N-290, socket also incorporates liquid crystal polymer (LCP). LGA/BGA socket is available in custom materials, plating, sizes, and configurations.
Original Press Release:
New LGA/BGA Socket From Aries Designed For High Performance ASIC Applications
Frenchtown, NJ, February 2002 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a land grid array/ball grid array (LGA/BGA) socket for high performance ASIC applications.
The new socket features pressure mount contacts on the top and bottom to prevent overstress on the socket. Offset radial contact with the device's solder balls will not alter the solder ball bottom surface. Optional bias springs can be built into the socket to provide accurate device registration.
Made from beryllium copper alloy with 30 microinch gold per MIL-G-45204 over 50 microinch nickel per QQ-N-290, the socket also incorporates high temperature liquid crystal polymer (LCP).
As with all Aries sockets, the LGA/BGA socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for the LGA/BGA sockets start at $10.00 in quantities of 500. Delivery is 6 weeks ARO.