Aries Electronics, Inc.
Bristol, PA 19007
BGA-to-BGA Adapter solves RoHS-related soldering problems.
BGA-to-BGA adapter solves solder joint reliability problems that occur when RoHS-compliant solder balls are assembled with devices whose connections are not lead-free. Adapter body is made from high-temperature glass reinforced material that allows lead-free components to be mounted at higher temperatures, while eutectic tin-lead ball terminations, which have standard reflow temperatures...
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Socket is available for 0.50-0.80 mm pitch packages.
Suited for applications using BGA, LGA, CSP, and other devices on 0.50 mm or larger pitch, PinBall(TM) Socket can be soldered side-by-side, directly to existing footprint of PC board. Clearances range from 0.5-2.0 mm, depending on pitch. Constructed of FR-4 material, socket features 63/37 tin-lead solderballs on PCB mating side and male spring probe on device mating side, which offers contact...
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MicroBGA to DIP Adapter preserves existing PCB layouts.
Adapter model 14-307799-11 enables designers to test or bread board 12-ball microBGA device on existing PCB with 0.300 in. holes. Top accepts 12-ball microBGA on 0.5 mm pitch, while bottom features 14 DIP pins. Adapter body, rated to UL 94V-0, is constructed of 0.062 in. thick, glass-filled, FR-406 material with 1 oz copper traces and electroless nickel immersion gold plating. Male pins are brass...
Read More »Adapters allow SOIC interchange.
Correct-A-Chip(TM) Adapters permit use of SOIC D package, 150 mil body chips to be used on boards designed for SOIC DW package, 300 mil body chips and vice-versa. Constructed of .062 in. FR-4 board manufactured to IPC-600E Class 2 standards, units are available in pin counts from 8-24 pins. Glass-filled FR-4 material is UL94V-0 rated with 1 oz of copper traces. Male pins are brass with 200...
Read More »Test Socket suits devices from 28-40 mm-².
Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for...
Read More »Test and Burn-In Socket suits applications up to 1 GHz.
Test and Burn-In Socket accommodates devices from 41-55 mmÃ-² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM,...
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PCB Adapter suits space-restricted applications.
Correct-A-Chip Adapter converts 160-pin QFP package with .65 mm pin-to-pin spacing into 16-pin through-hole array. UL94V-0 rated unit is constructed with .062 in. thick, glass-filled FR-4 material with 1 oz copper traces. Male pins are brass alloy 360 per ASTM-B-16, plated with 200 Ã-µin. tin over 100 Ã-µin. nickel per QQ-N-290, and are both soldered and pressed into body.
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BGA/LGA Socket includes customized heat sink.
Suited for high-end graphics processors, 1,400-contact Pin-Ball Socket can be soldered directly to existing footprint of PC board. Aluminum heatsink provides thermal dissipation of excess heat generated by graphics processors. BGA/LGA socket provides 2 mm of clearance for end components and can be used for 0.80, 1.00, and 1.27 mm pitch packages up to 50 mm. It incorporates spring probe technology...
Read More »TQFP to PQFP Adapter does not require board rework.
Aries 7484-117-18 adapter enables designers to replace 132-pin PQFP package IC with 144-pin TQFP without requiring board redesign. Top reroutes pinout of 144-pin device to make it compatible with 132-pin device footprint on existing PCBs. Gold-plated bump achieves SMT connection, providing rigid, non-slumping standoff for solder connection. Constructed of .062 in. thick, glass-filled FR-4...
Read More »Center Probe Socket debugs range of package types.
Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for...
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