Aries Electronics, Inc.

Architectural & Civil Engineering Products

Bump Adapters allow SMT adaptation of fine pitch devices.

Mounted to existing PCB via raised pads up to 0.010 in. on adapter bottom, Fine Pitch Bump Adapters feature pads on component side, designed to accept any device on any pitch 0.5 mm or greater, and route signals for packages including TSSOP, QFP, and other fine-pitch devices down to 0.40 mm. Boards are 0.032 in. thick FR4 or Rogers 370 HR with -½ oz copper traces on both sizes. Non-solder mask...

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Architectural & Civil Engineering Products

Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.

Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with -½ oz copper traces on both sides. Operating...

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Test Sockets handle small and fragile devices.
Electrical Equipment & Systems

Test Sockets handle small and fragile devices.

Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on...

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Construction Equipment and Supplies

Adapters connect small pitch devices to large pitch boards.

Offered in panelized form, as adapter only, or with mounted devices, Switch-A-Pitch Adapters have tops where BGA landing pads are on 0.5 mm, and bottoms with BGA balls on 1.27 mm pitch. Units are 0.062 in. thick FR4 or Rogers 370 HR, with -½ oz copper traces on both sides. Non-solder mask defined pads are finished with electroless nickel immersion gold and have solder spheres of 63/37 lead/tin...

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Electrical Equipment & Systems

Hybrid Socket provides test or burn-in down to 0.30 mm pitch.

CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...

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Company News

Aries Electronics Names Intech Electronics 2011 Representative of the Year

Bristol, Pa. April 2012 - Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, announced that Intech Electronics has been named Aries' 2011 Representative of the Year. This is the third time that Intech Electronics has received the designation, having previously won in 2004 and 2008. Intech Electronics, an Aries representative for nearly...

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People in the News

Roy Larsen of Larsen Associates Receives Aries Electronics' 2010 Rep of the Year Award

Bristol, Pa. March 2011 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently named Roy Larsen of Larsen Associates Aries' 2010 Representative of the Year Award. Larsen, an Aries representative for more than a quarter of a century, doubled his sales over 2009 and led all representative groups in both dollars sold and percentage...

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Architectural & Civil Engineering Products

Bump Adapters allow SMT adaptation of fine pitch devices.

Mounted to existing PCB via raised pads up to 0.010 in. on adapter bottom, Fine Pitch Bump Adapters feature pads on component side, designed to accept any device on any pitch 0.5 mm or greater, and route signals for packages including TSSOP, QFP, and other fine-pitch devices down to 0.40 mm. Boards are 0.032 in. thick FR4 or Rogers 370 HR with -½ oz copper traces on both sizes. Non-solder mask...

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People in the News

Aries Electronics Honors Joe Midili of JMA Inc. as 2009 Representative of the Year

Bristol, Pa. May 2010 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently awarded Joe Midili of JMA Inc. the 2009 Representative of the Year award after nearly doubling his 2008 sales. With a 99% increase in sales over 2008, Midili and company outperformed other members of Aries' representative network for overall sales. Midili,...

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Architectural & Civil Engineering Products

Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.

Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with -½ oz copper traces on both sides. Operating...

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