Aries Electronics, Inc.
Bristol, PA 19007
Hi-Temp CSP Sockets enable testing of any area-array device.
Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with...
Read More »Bump Adapters allow SMT adaptation of fine pitch devices.
Mounted to existing PCB via raised pads up to 0.010 in. on adapter bottom, Fine Pitch Bump Adapters feature pads on component side, designed to accept any device on any pitch 0.5 mm or greater, and route signals for packages including TSSOP, QFP, and other fine-pitch devices down to 0.40 mm. Boards are 0.032 in. thick FR4 or Rogers 370 HR with Â-½ oz copper traces on both sizes. Non-solder...
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BGA Adapters link devices/boards with different pitches.
BGA Switch-A-Pitch adapters connect 0.40 mm pitch devices to boards with 1.00 mm pitch. Adapters have tops with BGA landing pads on 0.40 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch, with open space around adapter tops to allow for additional components. Operating in temperatures up to 221°F for FR4 and up to 266°F for lead-free, units allow for different termination...
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Bump Adapters fit any BGA device on 0.40 mm pitch board.
Fine Pitch Bump Adapters allow use of higher pitch devices on boards with pitches down to 0.40 mm. While tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints, bottom has raised connection pads up to 0.010 in. that facilitate mounting of adapter to target board. Adapters, which can operate up to 221°F (FR4) and 266°F...
Read More »BGA Adapters connect 0.50 mm devices to 1.00 mm boards.
Designed to adapt smaller pitch devices to larger footprints, Switch-A-Pitch Adapters eliminate need for laser-drilled microvias on motherboards while enabling use of standard line and trace spacing down to 0.003 in. Adapters have tops with BGA landing pads on 0.50 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch. Operating up to 221°F for FR4 or up to 266°F for lead-free,...
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Adapters provide smaller pitch pads for larger pitch boards.
Facilitating high density interconnect (HDI) construction, BGA Switch-A-Pitch Adapters allow tighter pitch devices to be placed on existing larger pitch designs. Series includes models with tops where BGA landing pads are on 0.40 mm pitch and adapter bottoms are populated with BGA balls on 1.27 mm pitch. Measuring 0.062 in. thick, design eliminates need for laser-drilled microvias on...
Read More »Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.
Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Operating...
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Test Sockets handle small and fragile devices.
Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on...
Read More »Adapters connect small pitch devices to large pitch boards.
Offered in panelized form, as adapter only, or with mounted devices, Switch-A-Pitch Adapters have tops where BGA landing pads are on 0.5 mm, and bottoms with BGA balls on 1.27 mm pitch. Units are 0.062 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Non-solder mask defined pads are finished with electroless nickel immersion gold and have solder spheres of 63/37...
Read More »Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...
Read More »Aries Electronics Names Intech Electronics 2011 Representative of the Year
Bristol, Pa. April 2012 - Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, announced that Intech Electronics has been named Aries' 2011 Representative of the Year. This is the third time that Intech Electronics has received the designation, having previously won in 2004 and 2008. Intech Electronics, an Aries representative for nearly...
Read More »Hi-Temp CSP Sockets enable testing of any area-array device.
Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with...
Read More »Roy Larsen of Larsen Associates Receives Aries Electronics' 2010 Rep of the Year Award
Bristol, Pa. March 2011 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently named Roy Larsen of Larsen Associates Aries' 2010 Representative of the Year Award. Larsen, an Aries representative for more than a quarter of a century, doubled his sales over 2009 and led all representative groups in both dollars sold and percentage...
Read More »Bump Adapters allow SMT adaptation of fine pitch devices.
Mounted to existing PCB via raised pads up to 0.010 in. on adapter bottom, Fine Pitch Bump Adapters feature pads on component side, designed to accept any device on any pitch 0.5 mm or greater, and route signals for packages including TSSOP, QFP, and other fine-pitch devices down to 0.40 mm. Boards are 0.032 in. thick FR4 or Rogers 370 HR with Â-½ oz copper traces on both sizes. Non-solder...
Read More »Aries Electronics Honors Joe Midili of JMA Inc. as 2009 Representative of the Year
Bristol, Pa. May 2010 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently awarded Joe Midili of JMA Inc. the 2009 Representative of the Year award after nearly doubling his 2008 sales. With a 99% increase in sales over 2008, Midili and company outperformed other members of Aries' representative network for overall sales. Midili,...
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BGA Adapters link devices/boards with different pitches.
BGA Switch-A-Pitch adapters connect 0.40 mm pitch devices to boards with 1.00 mm pitch. Adapters have tops with BGA landing pads on 0.40 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch, with open space around adapter tops to allow for additional components. Operating in temperatures up to 221°F for FR4 and up to 266°F for lead-free, units allow for different termination...
Read More »
Bump Adapters fit any BGA device on 0.40 mm pitch board.
Fine Pitch Bump Adapters allow use of higher pitch devices on boards with pitches down to 0.40 mm. While tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints, bottom has raised connection pads up to 0.010 in. that facilitate mounting of adapter to target board. Adapters, which can operate up to 221°F (FR4) and 266°F...
Read More »BGA Adapters connect 0.50 mm devices to 1.00 mm boards.
Designed to adapt smaller pitch devices to larger footprints, Switch-A-Pitch Adapters eliminate need for laser-drilled microvias on motherboards while enabling use of standard line and trace spacing down to 0.003 in. Adapters have tops with BGA landing pads on 0.50 mm pitch and bottoms fitted with BGA balls on 1.00 mm pitch. Operating up to 221°F for FR4 or up to 266°F for lead-free,...
Read More »
Adapters provide smaller pitch pads for larger pitch boards.
Facilitating high density interconnect (HDI) construction, BGA Switch-A-Pitch Adapters allow tighter pitch devices to be placed on existing larger pitch designs. Series includes models with tops where BGA landing pads are on 0.40 mm pitch and adapter bottoms are populated with BGA balls on 1.27 mm pitch. Measuring 0.062 in. thick, design eliminates need for laser-drilled microvias on...
Read More »Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.
Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Operating...
Read More »
