Aries Electronics, Inc.

Architectural & Civil Engineering Products

Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.

Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Operating...

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Test Sockets handle small and fragile devices.
Electrical Equipment & Systems

Test Sockets handle small and fragile devices.

Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on...

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Construction Equipment and Supplies

Adapters connect small pitch devices to large pitch boards.

Offered in panelized form, as adapter only, or with mounted devices, Switch-A-Pitch Adapters have tops where BGA landing pads are on 0.5 mm, and bottoms with BGA balls on 1.27 mm pitch. Units are 0.062 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Non-solder mask defined pads are finished with electroless nickel immersion gold and have solder spheres of 63/37...

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Electrical Equipment & Systems

Hybrid Socket provides test or burn-in down to 0.30 mm pitch.

CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...

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Electrical Equipment & Systems

Center Probe Test Socket handles devices up to 13 mm-².

Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, socket is suited for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40 mm. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch. Measuring 1.200 x .840 x .440 in., unit...

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Company News

Aries Electronics Names Intech Electronics 2011 Representative of the Year

Bristol, Pa. April 2012 - Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, announced that Intech Electronics has been named Aries' 2011 Representative of the Year. This is the third time that Intech Electronics has received the designation, having previously won in 2004 and 2008. Intech Electronics, an Aries representative for nearly...

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People in the News

Roy Larsen of Larsen Associates Receives Aries Electronics' 2010 Rep of the Year Award

Bristol, Pa. March 2011 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently named Roy Larsen of Larsen Associates Aries' 2010 Representative of the Year Award. Larsen, an Aries representative for more than a quarter of a century, doubled his sales over 2009 and led all representative groups in both dollars sold and percentage...

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People in the News

Aries Electronics Honors Joe Midili of JMA Inc. as 2009 Representative of the Year

Bristol, Pa. May 2010 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently awarded Joe Midili of JMA Inc. the 2009 Representative of the Year award after nearly doubling his 2008 sales. With a 99% increase in sales over 2008, Midili and company outperformed other members of Aries' representative network for overall sales. Midili,...

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Architectural & Civil Engineering Products

Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.

Offering standard pin 1-to-pin 1 routing connection scheme, which can be customized to accommodate any connection requirement, Fine Pitch Bump Adapters enable use of any SMT IC device on pitch of 0.4 mm or higher to 0.5 mm pitch PCBs designed for TSSOP and QFP packages. Adapter boards are fabricated from 0.032 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Operating...

Read More »
Test Sockets handle small and fragile devices.
Electrical Equipment & Systems

Test Sockets handle small and fragile devices.

Available with optional adjustable pressure pad, 27 mm CSP/MicroBGA Test and Burn-In Sockets enable 0.010 in. displacement per revolution of screw, suited for testing thin or ceramic chips without damage. Each pressure pad comes with user-adjustable washer stack in 0.001 and 0.010 in. increments that serves as hard stop to eliminate device over-compression. Contact forces are 15 g/contact on...

Read More »
Construction Equipment and Supplies

Adapters connect small pitch devices to large pitch boards.

Offered in panelized form, as adapter only, or with mounted devices, Switch-A-Pitch Adapters have tops where BGA landing pads are on 0.5 mm, and bottoms with BGA balls on 1.27 mm pitch. Units are 0.062 in. thick FR4 or Rogers 370 HR, with Â-½ oz copper traces on both sides. Non-solder mask defined pads are finished with electroless nickel immersion gold and have solder spheres of 63/37...

Read More »

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