Adapters connect small pitch devices to large pitch boards.
Press Release Summary:
Offered in panelized form, as adapter only, or with mounted devices, Switch-A-Pitch Adapters have tops where BGA landing pads are on 0.5 mm, and bottoms with BGA balls on 1.27 mm pitch. Units are 0.062 in. thick FR4 or Rogers 370 HR, with ½ oz copper traces on both sides. Non-solder mask defined pads are finished with electroless nickel immersion gold and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. Devices operate up to 221°F for FR4 or 226°F for lead-free.
Original Press Release:
New Switch-A-Pitch Adapters from Aries Electronics Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards
Bristol, Pa. March 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has added a unique adapter series to its extensive line of Correct-a-Chip adapters that save end users both time and money. The new BGA Switch-A-Pitch Adapters enable the use of smaller pitch devices with larger pitch boards.
The first Switch-A-Pitch adapters in the series have tops where the BGA "landing pads" (on the top of the adapter) are on a 0.5 mm, while the adapter bottoms are populated with BGA balls on a 1.27 mm pitch.
These innovative adapters can reduce high density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints. In essence, the adapters allow the use of new, tighter pitch devices on existing larger pitch designs - which vastly lowers the PCB cost, since larger pitch boards are readily available and therefore more economical.
Since the top of the adapter board can leave open space around the small device, adapter manufacturers can add components to the design at a very low cost. The need for laser-drilled microvias on motherboards is eliminated. Standard line and trace spacing down to 0.003" (0.75 mm) can be used.
Switch-A-Pitch boards are 0.062" (1.57 mm) thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. The device can operate up to 221°F (105°C) for FR4 or up to 226°F (130°C) for lead-free. Suggested PCB pad sizes include 0.022" (0.55 mm) for a 1.27 mm pitch.
Switch-A-Pitch adapters are available in panelized form, as an adapter only or as a turn key solution with mounted devices. Specializing in custom design and production, Aries offers standard products as well as special materials, platings, sizes and configurations upon request.
Switch-A-Pitch adapters are custom made to customer requirements. A typical adapter with 64 positions is priced at $25 each for a quantity of 300 adapters.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: www.arieselec.com, Data sheet #18106: www.arieselec.com/Web_Data_Sheets/18106/18106.htm
Europe Email: europe@arieselec.com.
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UPCOMING TRADESHOW: SEMICON West; Booth # 7751 West Level 1; July 14-16, 2009; San Francisco, CA
Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
