Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
Press Release Summary:
CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact on 0.80 mm pitch or larger. Operating temperature is from -67 to +302Â°F.
Original Press Release:
Aries Electronics Patented CSP/BallNest Hybrid Socket Provides Reliable, Consistent Test and Burn-in Down to 0.30 mm Pitch
Bristol, Pa. January 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0.30 mm pitch or larger.
The ZIF-style (zero insertion force) socket uses Aries solderless, gold-plated pressure mount spring probes, allowing for easy mounting and removal from the PCB (printed circuit board). The design maintains constant force throughout the entire test and burn-in cycle as well as on the surface mount PCB when no chip is engaged.
The socket solders down onto the target PCB in the same footprint as the socketed device. This process also enables the socket to be mounted to an adapter board terminated with male thru-pins effectively creating a thru-hole solder tail socket for BGA devices. The socket cover can also incorporate heat sinks for added test and burn-in flexibility.
A four-point crown ensures "scrub" on solder oxides. The gold-over-nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls, further increasing reliability.
With a signal path of only 0.077 inches (1.96 mm), Aries' new socket provides minimal signal loss for higher bandwidth capability. Special lid designs and materials are available upon request.
The compression spring probes in the Aries CSP/BallNest hybrid sockets are constructed from heat-treated beryllium-copper with 30 micron inches min (0.75 micron mm) gold per Mil-G-45204 over 30 micron min (0.75 micron mm) minimum. The socket body is PEEK or Torlon, while screws and alignment pins are stainless steel and all inserts are tin-plated brass alloy per QQ-B-626.
The socket's contact forces are 15 g per contact on a 0.30 mm to 0.35 mm pitch, 16 g per contact on a 0.40 mm to 0.45 mm pitch, 25 g per contact on a 0.50 mm to 0.75 mm pitch and 25 g per contact on a 0.80 mm pitch or larger. Operating temperature is -55°C to 150°C (-67°F to 302°F) and estimated contact life is 500,000 cycles.
As with all Aries sockets, the new test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
A BallNest socket for a typical 50 lead BGA device with 0.3 mm pitch is $500 each at quantity 2 pieces. Delivery is 5 - 6 weeks ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: email@example.com; Web: www.arieselec.com, Data sheet #23016-arieselec.com/Web_Data_Sheets/23016/23016.htm;
Europe Email: firstname.lastname@example.org.
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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.
UPCOMING TRADESHOW: BiTS, Phoenix, AZ, March 8-11 2009
Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-ChipT product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.