Aprima Medical Software, Inc

Dynamic Checkweigher Series uses wide area networking connectivity.
Test & Measurement

Dynamic Checkweigher Series uses wide area networking connectivity.

Dynamic Checkweigher Series features Rockwell Automation® platform and HI4050CW controller. Unit is used to weigh items automatically and is integrated with Rockwell Automation CompactLogix® PLC. Product is capable of processing up to 350 pieces per minute and suitable to weigh boxes, cans, bottles, rigid shrink-wrapped or flexible packages. Checkweigher is compatible with items such as sugars,...

Read More »
Dynamic Checkweigher Series uses wide area networking connectivity.
Test & Measurement

Dynamic Checkweigher Series uses wide area networking connectivity.

Dynamic Checkweigher Series features Rockwell Automation® platform and HI4050CW controller. Unit is used to weigh items automatically and is integrated with Rockwell Automation CompactLogix® PLC. Product is capable of processing up to 350 pieces per minute and suitable to weigh boxes, cans, bottles, rigid shrink-wrapped or flexible packages. Checkweigher is compatible with items such as sugars,...

Read More »
Experimental Silflake 608 Powder features residual lubricant.

Experimental Silflake 608 Powder features residual lubricant.

Experimental Silflake 608 Powder offers tap density of greater than 5.0 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and comes with high packaging density. Product comes in D50 particle size of 5.0 to 8.0 micron and is suitable for conductive adhesives, die attach polymeric and thermal conductive applications.

Read More »
Experimental Silflake 608 Powder features residual lubricant.

Experimental Silflake 608 Powder features residual lubricant.

Experimental Silflake 608 Powder offers tap density of greater than 5.0 g/cm³ with a surface area of 0.1 to 0.3 m²/g. Unit provides weight loss at 538ºC and comes with high packaging density. Product comes in D50 particle size of 5.0 to 8.0 micron and is suitable for conductive adhesives, die attach polymeric and thermal conductive applications.

Read More »

All Topics