Electronic Chips

THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset
Electronic Chips

THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset

Provides Designers the ability to extend and aggregate images from Dual HD cameras for greater than 15 meters Enables new high-performance video capabilities for 3D visualization & recognition, autonomous cars, robotics, medical equipment, gaming, XR devices, etc. Tokyo, Japan (August 1, 2019), Santa Clara, CA (July 31, 2019) – THine®, the leader in high-speed serial interfaces and image...

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New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Electronic Chips

New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments

Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.

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Electronic Chips

Newly Licensed AI Chip Technology Accelerates Time-to-Market for Customized SoC Solutions

Gyrfalcon Technology Inc. (GTI) is offering the technology powering the company's Lightspeeur® 2801 and 2803 AI accelerators for use in custom SoC designs through a new IP licensing model. . The accelerator chips' architecture features AI cores that are ultra-small and low-power, enabling AI Processing in Memory (APiM) with those cores configured in a proprietary Matrix Processing...

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Latest 112 Gbps SerDes Validation Chip is Fabricated on 7nm FinFET Process Technology
Electronic Chips

Latest 112 Gbps SerDes Validation Chip is Fabricated on 7nm FinFET Process Technology

Provide support for range of digital serial communications standards with 1 Gbps to 112 Gbps data rates. Designed for AI/ML, HPC, high-performance network switching for cloud-scale and telco data centers, 5G cellular base stations and edge networking. SerDes receivers are embedded with advanced DSP techniques such as constant modulus algorithm, adaptive equalization and decision-based adaptation.

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SiLC Technologies Silicon Photonics LiDAR Chip Demonstrates Best in Class Energy Efficiency and Camera Safety
Electronic Chips

SiLC Technologies Silicon Photonics LiDAR Chip Demonstrates Best in Class Energy Efficiency and Camera Safety

Greater than 1,000x lower peak power compared to conventional "Time of Flight" LiDARs in an integrated interference free solution enabling a broad range of applications MONROVIA, Calif., Feb. 28, 2019 /PRNewswire/ -- SiLC Technologies, Inc., a silicon photonics-based provider of integrated 4D vision LiDAR solutions, today announced initial performance results for its integrated FMCW LiDAR...

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New Wireless Chipsets Can Drive Simultaneous 4K Monitors
Electronic Chips

New Wireless Chipsets Can Drive Simultaneous 4K Monitors

The Wireless Video Products are offered with MA-USB protocol (wireless docking solution). The WiGig wireless technology is suitable for video conferencing applications where near real-time response between participant is required. The WiGig is used in wireless displays and productivity applications in which near-zero latency is needed. This 60 GHz WiGig technology offers latency levels in the...

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Dodge® Raptor Coupling Now Available in Three Larger Sizes
Sponsored

Dodge® Raptor Coupling Now Available in Three Larger Sizes

The Dodge Raptor coupling epitomizes the innovation and value that has made Baldor a world leader in industrial electric motors. For almost 100 years Baldor has been the go-to source for industries across the globe. The Raptor coupling is just one example of our dedication to engineered excellence and commitment to providing value and performance. See our video to learn more.

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