THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset
Provides Designers the ability to extend and aggregate images from Dual HD cameras for greater than 15 meters Enables new high-performance video capabilities for 3D visualization & recognition, autonomous cars, robotics, medical equipment, gaming, XR devices, etc. Tokyo, Japan (August 1, 2019), Santa Clara, CA (July 31, 2019) – THine®, the leader in high-speed serial interfaces and image...
Read More »
New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.
Read More »Renesas Showcases MPU and MCU Solutions for Changing Real-time, Security and Convenience Demands
Real-time industrial IoT gateway solution collects sensor data from the factory floor and sends it to the cloud for real-time analysis. Secure Chip-to-cloud connectivity over cellular using Synergy™ platform. Also to demonstrate end-to-end solution for next-generation, cloud-based asset tracking with the RX-based LoRa network solution.
Read More »Newly Licensed AI Chip Technology Accelerates Time-to-Market for Customized SoC Solutions
Gyrfalcon Technology Inc. (GTI) is offering the technology powering the company's Lightspeeur® 2801 and 2803 AI accelerators for use in custom SoC designs through a new IP licensing model. . The accelerator chips' architecture features AI cores that are ultra-small and low-power, enabling AI Processing in Memory (APiM) with those cores configured in a proprietary Matrix Processing...
Read More »
An Operations Manager's Guide To The Mobile Connected Factory of Tomorrow
This white paper provides an overview of mobile technology for managing your manufacturing facility, while also discussing the advantages of being an early adopter.
Read More »
Latest 112 Gbps SerDes Validation Chip is Fabricated on 7nm FinFET Process Technology
Provide support for range of digital serial communications standards with 1 Gbps to 112 Gbps data rates. Designed for AI/ML, HPC, high-performance network switching for cloud-scale and telco data centers, 5G cellular base stations and edge networking. SerDes receivers are embedded with advanced DSP techniques such as constant modulus algorithm, adaptive equalization and decision-based adaptation.
Read More »
SiLC Technologies Silicon Photonics LiDAR Chip Demonstrates Best in Class Energy Efficiency and Camera Safety
Greater than 1,000x lower peak power compared to conventional "Time of Flight" LiDARs in an integrated interference free solution enabling a broad range of applications MONROVIA, Calif., Feb. 28, 2019 /PRNewswire/ -- SiLC Technologies, Inc., a silicon photonics-based provider of integrated 4D vision LiDAR solutions, today announced initial performance results for its integrated FMCW LiDAR...
Read More »
New RZ/G2 64-Bit MPUs Designed to Meet Needs of Developers Using Embedded Controllers in Industrial Automation and Building Automation Applications
Will serve as the first reference hardware for Arm64 for the certification and release of CIP Linux packages. Delivers up to 36 percent higher performance than any other embedded 64-bit MPU in the market. Support for the latest high-speed protocols for external memories including LPDDR4 or DDR3L up to 3200 MT/s.
Read More »Latest NK6010 3GPP Rel.14 eNB-IoT System-on-Chip Supports NB-IoT Frequency Bands and Major Global Carriers
Integrates RF front-end, RF transceiver, cellular baseband, power management unit and application processor. Designed for enabling narrowband connectivity in massive IoT devices like smart meters, wearable, asset trackers and industrial sensors. Features low-power multi-GNSS subsystem to support GPS/Beidou/Galileo/GLONASS global navigation systems.
Read More »
Qualcomm Introduces RF Front End Solutions That Allow Multi-Gigabit Speeds
The RF Front End Solutions from Qualcomm are used for development of commercial 5G mobile device. The Snapdragon 855 Mobile Platform used in mobile devices supports both sub-6 and mmWave spectrum for transformative 5G experiences. The 5G technology offers near-instant access to cloud services, multiplayer VR gaming, shopping with AR, and real-time video collaboration.
Read More »
New Wireless Chipsets Can Drive Simultaneous 4K Monitors
The Wireless Video Products are offered with MA-USB protocol (wireless docking solution). The WiGig wireless technology is suitable for video conferencing applications where near real-time response between participant is required. The WiGig is used in wireless displays and productivity applications in which near-zero latency is needed. This 60 GHz WiGig technology offers latency levels in the...
Read More »
Precision Machining Solutions with Over 25 Years of Experience
Quality, customer service, and unbeatable value are the hallmarks of Hogge Precision. Since 1989 we have built a reputation as the go-to precision machining source, servicing many demanding industries. For CNC machining and screw machining, there are few manufacturers that can match our capabilities and expertise. See our video to learn more.
Read More »
