Electronic Chips

Electronic Chips

Popular Development Tools from IAR Systems Support Complete Atmel | SMART MCU and MPU Portfolio

With Over 1,400 Example Projects Supporting Atmel's Broad Portfolio of MCUs and MPUs, IAR Embedded Workbench Enables Developers to Bring Their Atmel Designs Faster Time to Market SAN JOSE, Calif.Â- – Atmel® Corporation (NASDAQ: ATML), a global leader in microcontroller (MCU) and touch technology solutions, and IAR Systems®, the world-leading provider of development tools...

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Evaluation Module enables HD projection in compact electronics.
Electronic Chips

Evaluation Module enables HD projection in compact electronics.

To accelerate development cycle, DLP® LightCrafter™ Display 3010 Module allows assessment of DLP 0.3 in. TRP HD 720p video and data display chipset, which consists of DLP3010 digital micromirror device, DLPC3433/DLPC3438 display controller, and DLPA2005 LED driver. Evaluation module includes HDMI-input interface offering plug-and-play functionality, USB-based GUI for real-time chipset...

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Electronic Chips

TI Makes Programming in Real Time as Easy as 1-2-3

Introducing expanded PRU software support and the first PRU cape plug-in board for BeagleBone Black from TI DALLASÂ- – The programmable real-time unit (PRU) on Sitara™ processors from Texas Instruments (TI) (NASDAQ: TXN) enables customers to differentiate their products by offloading real-time processing from the ARM® core. The PRU is a 200MHz low-latency multicore co-processor...

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Electronic Chips

Microprocessor Units support 720p video playback.

Based on ARM® Cortex®-A5 processor, Atmel® SMART™ SAMA5D4 Series offers H264, VP8, and MPEG4 720p video playback capability at 30 fps. Devices leverage ARM® TrustZone technology to protect system against counterfeiting and allow safe storage of critical data. Featuring ARM NEON™ engine for accelerated signal processing for multimedia and graphics, SAMA5D4 Series runs...

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CMAA Crane Buyer's Guide
Sponsored

CMAA Crane Buyer's Guide

CMAA has organized this Buyer's Guide to promote standardization and to assist prospective buyer's of electric overhead traveling cranes in selection of equipment most suitable for their applications.

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Electronic Chips

DSP Group's VoIP SoC's Power Obihai's Advanced IP Phones

Obihai's OBi1032 and OBi1062 IP Phones Leverage DSP Group's DVF99 to Offer Cloud Integration, Superior Quality and Advanced Features LOS ALTOS, Calif. –Â- DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that Obihai, an innovative manufacturer of VoIP solutions, has chosen DSP Group's...

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Electronic Chips

HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform

SHANGHAIÂ- — Semiconductor Manufacturing International Corporation ( SMIC"; NYSE: SMI; SEHK: 981) and CEC Huada Electronic Design Co., Ltd. ("HED") jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster performance,...

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Dual-Core MCUs suit functional safety applications.
Electronic Chips

Dual-Core MCUs suit functional safety applications.

Based on 32-bit lockstep ARM® Cortex®-R5 cores in cached memory architecture, Hercules™ RM57Lx and TMS570LCx support speeds up to 330 MHz, delivering 550 peak DMIPS, 660 peak MIPS, and up to 330 MFLOPS. RM57Lx models help developers meet IEC 61508 functional safety standards, while TMS570LCx MCUs help meet ISO 26262 functional safety standard. Floating point devices support up to 4...

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Electronic Chips

Cadence and GLOBALFOUNDRIES Announce First Test Chip Featuring ARM Cortex-A12 Processor in 28nm-SLP Process

Highlights: - Test chip designed to demonstrate performance and power characteristics of ARM® Cortex®-A12 processor on GLOBALFOUNDRIES' 28nm-SLP process - Achieved maximum frequency of 2.0GHz in 15 weeks using the full Cadence RTL-to-GDSII digital implementation and signoff solutions - Full suite of Cadence signoff tools used, including QRC Extraction, Tempus Timing Signoff Solution...

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Electronic Chips

Texas Instruments and PureWave Networks Develop Industry-Leading Solutions Platform for Enterprise and Pico Small Cell Base Stations

Single-board platform provides OEMs with the fastest way to demonstrate, evaluate and develop small cell base stations BARCELONA, SpainÂ- – MOBILE WORLD CONGRESS – Texas Instruments (TI) (NASDAQ: TXN) and PureWave Networks, Inc., an innovative provider of advanced, cost-effective wireless base stations, announced their collaboration on a first-of-its-kind single-board, end-to-end...

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Electronic Chips

Micro Mirror Array delivers bright images, extends battery life.

Based on DLP Cinema® technology, 0.3 in.Â- HD Tilt & Roll Pixel (TRP) DLP® Pico™ chipset can generate high-definition (HD) displays from compact electronics. This micro-mirror array leverages TRP DLP architecture and adaptive IntelliBright™ suite of algorithms. Switching speeds of up to thousands of times per second enables compact, true-color RGB engines with 120 Hz video...

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