Mobile WiMAX Baseband IC reduces power consumption to 0.5 mA.

Press Release Summary:

Manufactured using 65 nm low-leakage CMOS process and CoolAdjust power-gating technology, Fujitsu MB86K23 mobile WiMAX baseband IC supports channel bandwidths including 3.5, 5, 7, 10, and 20 MHz, along with 64 QAM, 16 QAM, and QPSK adaptive modulation schemes. WiMAX Forum Wave 2 mobile device certified unit provides wireless access using 512/1024/2048 FFT OFDMA with integrated MAC processors, and supports antenna diversity and beamforming. It also incorporates USB, SPI, and SDIO interfaces.

Original Press Release:

New WiMAX Baseband SoC from Fujitsu Microelectronics Enables Smallest USB Adapters and Embedded Mini Cards for Mobile WiMAX Designs

Delivers Low Power, Small Footprint Required for Innovative Netbooks, Handheld Devices

Sunnyvale, CA, and Barcelona, February 16, 2009 - Fujitsu Microelectronics America, Inc. (FMA), a global leader in WiMAX SoC technology, today introduced its newest Mobile WiMAX baseband IC, a low-power, small-footprint device designed for the expanding mobile PC market.

The new Fujitsu MB86K23 mobile WiMAX baseband IC supports a wide range of channel bandwidths including 3.5MHz, 5MHz, 7MHz, 10MHz, and 20MHz, along with 64QAM, 16QAM, and QPSK adaptive modulation schemes. It provides wireless access using 512/1024/2048 FFT OFDMA with integrated MAC processors, supports antenna diversity and beamforming, and includes all the features required for WiMAX Forum Wave 2 mobile device certification.

The MB86K23 is being manufactured using Fujitsu's 65nm low-leakage CMOS process and CoolAdjust power-gating technology, which reduces power consumption during operation by switching off power to circuit blocks that are not in use. Standby current for an entire WiMAX module can be reduced to 0.5mA, enabling significantly longer battery life in mobile devices. The new WiMAX baseband IC also incorporates a USB interface, so designers can develop WiMAX USB adapters in ultra-small-form factors. SPI and SDIO interfaces also are included.

"We expect mobile WiMAX to become a key broadband wireless access technology in many portable devices like Mobile Internet Device (MID), Ultra Mobile PC (netbooks), Tablets, and even low-cost handsets for emerging markets. This new baseband IC delivers the low power and small footprint required for these exciting applications," said George Wu, Director of the Embedded Platform Solutions business group of Fujitsu Microelectronics America. "We continue to apply Fujitsu's leading-edge process technology and expertise to maximize performance. The new MB86K23 represents an excellent design choice to serve the fast-growing global market for WiMAX-equipped systems."

Features 36 Percent Power Reduction, 60 Percent Space Reduction from Original Version

The MB86K23 is the successor to the Fujitsu mobile WiMAX baseband IC, the MB86K21, which targeted embedded WiMAX in mobile PCs and PC cards. The new IC is 60 percent smaller than the MB86K21, which was certified by the WiMAX Forum and sampled in summer 2007. (See the May 21, 2007, press release:

When combined into a chipset with the Fujitsu MB86K52 RF IC and MB39C316 power-management IC, the MB86K23 enables developers to realize the industry's most compact form factors - just 20mm x 40mm for WiMAX USB adapters, and 30mm x 26.8mm for PCI Express half-mini cards that incorporate both WiMAX and Wi-Fi functionality.

ODM vendors are now planning to release these kinds of products using this WiMAX baseband IC. In addition to its low power requirements and small footprint, the Fujitsu MB86K23 can use software that was developed for the MB86K21, which has passed compatibility testing with many base stations.

Pricing and Availability
The new MB86K23 will be available in 10 mm x 10 mm FBGA packages in April. Pricing is available upon request.

Fujitsu Microelectronics will exhibit WiMAX devices and products at the Mobile World Congress 2009 to be held in Barcelona, Spain, from February 16-19. Fujitsu Microelectronics will be located at Hall/Stand 2C126 (2-0), 1.1HS52 (1-1).

About Fujitsu Microelectronics America, Inc.
Fujitsu Microelectronics America, Inc. (FMA) leads the industry in innovation. FMA provides high-quality, reliable semiconductor products and services for the automotive, wireless, industrial, consumer, and other markets throughout North and South America. As a founding member and current board member of the WiMAX Forum(TM), Fujitsu supports the standards development and compliance programs that are essential to successful Broadband Wireless deployment. Fujitsu provides performance-driven WiMAX solutions by leveraging the company's experience and expertise in the networking and communications markets. Fujitsu offers flexible WiMAX SoC and reference designs for WiMAX-certifiable systems to equipment vendors. For more product information, please visit the company's web site at or address e-mail to

More from Packaging Products & Equipment

All Topics