Electronic Chips

Electronic Chips

Qualcomm Atheros Demonstrates Portfolio of 802.11ac Solutions for Mobile Computing Platforms

Company Enables Gigabit-capable Wi-Fi with Integrated Bluetooth for New Generation of Connected Tablets and Notebooks TAIPEI, Taiwan, - Qualcomm Atheros Inc., the networking and connectivity subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today at COMPUTEX TAIPEI demonstrated the industry's first solutions that integrate 802.11ac Wi-Fi® and Bluetooth(TM) 4.0 connectivity for tablets and...

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Electronic Chips

The First Toshiba ARM Cortex®-M0 Microcontroller Optimized for Smart Meters

Low-power 32-bit Device Combines Cortex-M0 Core with On-board Peripherals Dedicated to Smart Meter Designs SAN JOSE, Calif. - Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new 32-bit RISC microcontroller built around the ARM Cortex®-M0 processor core. The new TMPM061 is...

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Electronic Chips

Altair's TD-LTE Chipset Selected by Olive Telecom, India's Leading Convergence Solutions Device Developer

HOD HASHARON, Israel - Altair Semiconductor (http://www.altair-semi.com), a leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets [http://altair-semi.com/products/fourgee-31006200 ], today announced that its 'Hornet' TD-LTE chipset, recently introduced to the Indian market, has been selected by Olive Telecom to power Olive's line of LTE enabled products. Olive...

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Electronic Chips

Integrated Audio Codec features 5 amplifies and 2 miniDSP cores.

TLV320AIC3262 integrated audio codec features embedded miniDSP cores, providing echo and noise cancellation at wideband voice sampling rates up to 16 kHz. It integrates 5 amplifiers and 2 miniDSP cores, and gives designers ability to interface to up to 3 devices simultaneously, such as application, Bluetooth, and baseband processors. Audio and voice samples can be received, mixed and processed...

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Electronic Chips

TowerJazz and UCSD Demonstrate First Silicon Wafer-Scale 110 GHz Phased Array Transmitter with Record Performance

Targets applications for automotive radar, aerospace and defense, passive imaging, security, and mmWave imaging SAN DIEGO and NEWPORT BEACH, Calif. - TowerJazz, the global specialty foundry leader, and The University of California, San Diego (UCSD), provider of a leading program in microwave, millimeter-wave and mixed-signal RFICs, today announced they have collaborated to demonstrate the first...

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Electronic Chips

TI Unveils Clock Buffers with Ultra-low Noise Floor and Additive Jitter

DALLAS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) today expanded its high-performance clock buffer portfolio with the introduction of two new universal clock buffer families. The CDCLVC1310 LVCMOS clock buffer delivers an industry-leading phase noise floor of -169 dBc/Hz in crystal mode. The LMK00101/05 complements the family with flexible output voltage level configurations. The...

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Electronic Chips

Electro-Optics Chip supports 400 Gbps data transmission.

Designed for optical communications networks, PSE Photonic Service Engine can be deployed in range of configurations - from metro to regional to ultra-long haul - and transmit wavelengths over existing or new photonic lines. Intended specifically for use with 1830 Photonic Service Switch, chip enables more than 23 Tb of traffic to be transmitted along single optical fiber. Configurable design let...

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Electronic Chips

Xilinx Breakthrough 2.5-D Virtex-7 2000T Device Named China ACE Awards 2012 FPGA of the Year

SAN JOSE, Calif., -- Xilinx Inc. (NASDAQ: XLNX) today announced its breakthrough 28nm Virtex®-7 2000T device was named FPGA Product of the Year in the Digital Processor/DSP/FPGA category at the China Annual Creativity in Electronics (ACE) Awards2012. Product award winners were selected through public online voting from a shortlist of finalists chosen by a panel of senior industry analysts...

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Electronic Chips

Texas Instruments and Aricent Collaborate on Small Cell Protocol Stack Optimized for TI's KeyStone Multicore Processors

BARCELONA, Spain, Feb. 27, 2012 -- MOBILE WORLD CONGRESS - Texas Instruments Incorporated (TI) (NASDAQ: TXN) and Aricent®, a global technology innovation technology and services company focused exclusively on communications, today announced their collaboration on a small cell protocol stack optimized for TI's KeyStone-based multicore System-on-Chips (SoCs). With this integrated solution...

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Electronic Chips

HARMAN and Texas Instruments Collaborate to Redefine Premium Automotive Infotainment Experiences

Integration of TI's OMAP(TM) 5 processors transforms head unit consoles into centralized multimedia command centers in the most sophisticated cars BARCELONA, Spain, Feb. 27, 2012 -- HARMAN (NYSE:HAR), the global audio and infotainment group, and Texas Instruments Incorporated (TI) (NASDAQ:TXN) today announced a collaboration to bring TI's OMAP(TM) 5 processors to HARMAN's premium automotive...

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