Mobile WiMAX Chip integrates baseband and triple-band RF.
Incorporating baseband/triple-band RF in 65 nm die, SQN1210 delivers maximum throughput of greater than 40 Mbps with power consumption of less than 350 mW with fully loaded MIMO traffic and less than 0.5 mW in standby. Chip RF supports TDD and half-duplex FDD and covers 2.3, 2.5, and 3.5 GHz global WiMAX bands. Unit also supports 2 Tx, enabling uplink MIMO, as well as H-ARQ up to category 4....
Read More »Interconnects enable ultra-thin cables for consumer devices.
Model QLx4270-DP Q:Active Media Interconnect delivers 10.4 Gbps DisplayPort connectivity in 4 x 7 mm package, while QLx3300-16B, also 4 x 7 mm, delivers HDMI for active cables and media switch devices. At 3 x 3 mm, QLx1600 is suited for SuperSpeed USB. Units can run up to 5 m on active copper cabling and up to 10 m for USB 3.0, providing 10.2 Gbps full bandwidth DisplayPort over 40 ga copper....
Read More »Qualcomm to Ship Industry's First Multi-Mode LTE Chipsets in 2009
New Family of Multi-mode LTE Device Solutions to Deliver Backward Compatibility to Existing UMTS and CDMA2000 Networks SAN DIEGO, Feb. 7 - Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it has expanded both its device and base station chipset roadmaps to include Long Term Evolution (LTE). The new...
Read More »Qualcomm Announces Multiple HSPA+ Trials to Take Place in 2008
Evolution of UMTS Technology Gains Momentum as Multiple Network Operators Commit to Trials SAN DIEGO, Feb. 7 - Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that multiple network operators have committed to trialing HSPA+ technology this year. To be conducted with operators including Hutchison 3G,...
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The Ultimate Guide to Enclosed Tubular Drag Cable and Disc Conveyors
This whitepaper provides a comprehensive overview of enclosed tubular drag cable and disc conveyors.
Read More »Dblur Announces the Availability of a Software Lens(TM) Enabled Chip
Sample Chips Now Available From Pantek Technologies Corp. With Mass Production Starting in May, 2008 HERZLIYA, Israel, February 7 / / - Dblur, the developer of Software Lens(TM) Technology, today announced the availability of a stand-alone chip that integrates Dblur's groundbreaking Software Lens(TM) Technology. The PA-DB3615SA chip, produced by SMIC, enables Software Lens(TM) camera modules of...
Read More »Intel Unveils 16 Next-Generation Processors, Including First Notebook Chips Built on 45nm Technology
New Transistor Design, Manufacturing Capabilities will Also Power Mobile Internet Devices INTERNATIONAL 2008 CONSUMER ELECTRONICS SHOW, Las Vegas, Jan. 7, 2008 - Intel Corporation unveiled 16 products today, including the company's first 45 nanometer (nm) processors for IntelÃ-® CentrinoÃ-® Processor Technology based laptops. All of these new chips include the company's new transistor...
Read More »JDSU Enters GPON Market with New Low-Cost Optical Detector Chip
Combines APD Chip Expertise with Streamlined Development to Provide Affordable Solution for Fiber-to-the-Home Networks MILPITAS, Calif., Jan. 29 / -- JDSU (Nasdaq: JDSU; TSX: JDU) today announced that it is now shipping an avalanche photo detector (APD) chip designed for gigabit passive optical networks (GPONs) that enable data transmissions for fiber-to-the-home (FTTH) offerings. The new APD...
Read More »Trango Virtual Processors Provides Embedded Virtualization Technology Cavium OCTEON Processors
SANTA CLARA, JANUARY 21ST, 2008- TRANGO Virtual Processors, a leading provider of embedded virtualization IP, announced today that they are providing their feature-rich embedded virtualization technology for Cavium Networks' (NASDAQ: CAVM) OCTEON Multi-core MIPS64-® processor family. Networking, Wireless, Storage and Security system vendors are adding multiple services into intelligent hardware...
Read More »Freescale Motherboard-on-Chip Processor Powers LimePC's Web 2.0-Enabled Ultra-Mobile PCs
MPC5121e processor's triple-core architecture and rich peripheral set provide versatile, cost-effective platform for ultra-mobile PCs LAS VEGAS (Consumer Electronics Show) - Jan. 7, 2008 - The personal computing world is going ultra mobile. And Web 2.0 applications and services are redefining the Internet. Freescale Semiconductor is addressing the convergence of these two trends with a highly...
Read More »Coronis Systems and Essensium N.V. Join Forces to Develop the Next Generation Ultra-Low-Power, Long Range Wavenis System-on-Chip Solution
November 12, 2007 Coronis Systems a provider of ultra-low power wireless OEM solutions for both short range and long range wireless sensor, control and metering networks and Essensium N.V., a fabless semiconductor provider of low power System-on-Chip ASIC solutions, today announced an agreement to collaborate on the next generation Wavenis technology transceiver chip. Wavenis technology is the...
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Fresh Air Intake Designed to Meet ASHRAE 62.2 standards
Alan Manufacturing has a long history of developing innovative solutions for HVAC applications. With over 1,000 product designs under our belt, we have gained a reputation as the go-to source for HVAC dampers, hardware, duct supports, zone control systems, and much more. Adding to this extensive list of achievements we now announce the release of our new line of Fresh Air Intake products. Designed to meet ASHRAE 62.2 standards, they are the most robust and high-performance product of their kind. See our video to learn more.
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