THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset
Provides Designers the ability to extend and aggregate images from Dual HD cameras for greater than 15 meters Enables new high-performance video capabilities for 3D visualization & recognition, autonomous cars, robotics, medical equipment, gaming, XR devices, etc. Tokyo, Japan (August 1, 2019), Santa Clara, CA (July 31, 2019) – THine®, the leader in high-speed serial interfaces and image...
Read More »
THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset
Provides Designers the ability to extend and aggregate images from Dual HD cameras for greater than 15 meters Enables new high-performance video capabilities for 3D visualization & recognition, autonomous cars, robotics, medical equipment, gaming, XR devices, etc. Tokyo, Japan (August 1, 2019), Santa Clara, CA (July 31, 2019) – THine®, the leader in high-speed serial interfaces and image...
Read More »
New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.
Read More »
New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.
Read More »
EMI/RFI Shielding Considerations for Electric Vehicles
This white paper provides an overview into EMI/RFI shielding considerations for electric vehicles.
Read More »Renesas Showcases MPU and MCU Solutions for Changing Real-time, Security and Convenience Demands
Real-time industrial IoT gateway solution collects sensor data from the factory floor and sends it to the cloud for real-time analysis. Secure Chip-to-cloud connectivity over cellular using Synergy™ platform. Also to demonstrate end-to-end solution for next-generation, cloud-based asset tracking with the RX-based LoRa network solution.
Read More »Renesas Showcases MPU and MCU Solutions for Changing Real-time, Security and Convenience Demands
Real-time industrial IoT gateway solution collects sensor data from the factory floor and sends it to the cloud for real-time analysis. Secure Chip-to-cloud connectivity over cellular using Synergy™ platform. Also to demonstrate end-to-end solution for next-generation, cloud-based asset tracking with the RX-based LoRa network solution.
Read More »Newly Licensed AI Chip Technology Accelerates Time-to-Market for Customized SoC Solutions
Gyrfalcon Technology Inc. (GTI) is offering the technology powering the company's Lightspeeur® 2801 and 2803 AI accelerators for use in custom SoC designs through a new IP licensing model. . The accelerator chips' architecture features AI cores that are ultra-small and low-power, enabling AI Processing in Memory (APiM) with those cores configured in a proprietary Matrix Processing Engine...
Read More »Newly Licensed AI Chip Technology Accelerates Time-to-Market for Customized SoC Solutions
Gyrfalcon Technology Inc. (GTI) is offering the technology powering the company's Lightspeeur® 2801 and 2803 AI accelerators for use in custom SoC designs through a new IP licensing model. . The accelerator chips' architecture features AI cores that are ultra-small and low-power, enabling AI Processing in Memory (APiM) with those cores configured in a proprietary Matrix Processing Engine...
Read More »
Latest 112 Gbps SerDes Validation Chip is Fabricated on 7nm FinFET Process Technology
Provide support for range of digital serial communications standards with 1 Gbps to 112 Gbps data rates. Designed for AI/ML, HPC, high-performance network switching for cloud-scale and telco data centers, 5G cellular base stations and edge networking. SerDes receivers are embedded with advanced DSP techniques such as constant modulus algorithm, adaptive equalization and decision-based adaptation.
Read More »
Latest 112 Gbps SerDes Validation Chip is Fabricated on 7nm FinFET Process Technology
Provide support for range of digital serial communications standards with 1 Gbps to 112 Gbps data rates. Designed for AI/ML, HPC, high-performance network switching for cloud-scale and telco data centers, 5G cellular base stations and edge networking. SerDes receivers are embedded with advanced DSP techniques such as constant modulus algorithm, adaptive equalization and decision-based adaptation.
Read More »
DoorKing's 1601 Lane Barrier Provides a Higher Level of Traffic Control for Less
DoorKing is proud to introduce an easy add-on to its 1601 Barrier Gate Operator: The 1601 Traffic Lane Barrier. The barrier gate provides greater traffic control while eliminating the need for bollards or crash beams. Check out this video to learn more.
Read More »
