Blu-Castle Selects Marvell's Award-Winning G.hn Silicon to Power Connectivity in the Home
Marvell's robust G.hn chipset enables high-speed and powerful connectivity to multimedia HD content SANTA CLARA, Calif. and LAS VEGAS – Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced that Blu-Castle has selected Marvell's award-winning and HomeGrid Forum-certified G.hn chipset to power its products for the Connected Home. Blu-Castle, a leading...
Read More »Everspring's New Sensors Leverage DSP Group's ULE Chipset, Deliver Smart Home Services
Everspring's Advanced and Reliable New Sensors Integrate DSP Group's DHX91 SoC, Supporting State-of-the-Art Home Automation Capabilities Based on ULE (Ultra Low Energy) Technology SAN JOSE, Calif.Â- — DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, and Everspring, a global company that provides home security and...
Read More »DSP Group's DVF99 VoIP SoC Powers Panasonic's New IP Phones
DSP Group's Latest VoIP System-on-a-Chip (SoC) Provides Panasonic's IP Terminals the Benefits of Rich VoIP Business Features SAN JOSE, Calif.Â- — DSP Group® (Nasdaq:DSPG), a leading global provider of chipset solutions for converged communications, announced today that its highly-integrated and recently-launched DVF99 VoIP SoC solution has been selected to power Panasonic's KX-NT550...
Read More »ZTE's Flagship Grand Memo LTE Smartphone Achieves China Mobile TD-LTE Certification with Marvell's Industry Leading 4G LTE Solution
Marvell's ARMADA Mobile PXA1802 4G LTE modem enables ZTE's first TD-LTE smartphone now widely available for China Mobile's nearly 760 million subscribers SANTA CLARA, Calif. and LAS VEGASÂ- – Marvell (Nasdaq: MRVL) today announced that ZTE's flagship Grand Memo LTE smartphone has achieved China Mobile TD-LTE certification with Marvell's industry leading 4G LTE solution. Marvell's...
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Read More »MediaTek Announces the Availability of Multimode LTE Modem Chipset
MT6290 supports LTE R9, DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS LAS VEGAS - MediaTek is demonstrating its first LTE modem platform in its booth at CES 2014 located inside the Venetian Hotel, Las Vegas. Summary of key points: -Â- LTE Release 9 Category 4 modem in 28nm process - Baseband processor based on the Coresonic SIMT architecture - Proven LTE protocol stack...
Read More »MediaTek Adds CDMA2000 and Unveils Plans for Worldmode(TM) Mobile Chipsets
Collaboration with VIA Telecom enables a System-on-a-Chip design that supports voice and data services across mobile networks globally LAS VEGASÂ- – MediaTek today announced a collaboration with VIA Telecom to integrate its proven CDMA2000 technology into the upcoming Worldmode™ mobile platforms. The collaboration is part of MediaTek's strategy to address global markets with its...
Read More »Dual-Core MCUs offer 800 MIPS of floating point performance.
Providing dual-core C28x processing capabilities and dual real-time control accelerators, C2000™ Delfino™ 32-bit F2837xD Series enables designers to develop low-latency systems in computationally demanding control applications. Designers can also consolidate multiple embedded processors into single MCU for applications requiring real-time signal analysis, such as high-end servo drives and...
Read More »CameraChip(TM) Sensors (2 MP) enhance tablets and mobile devices.
Leveraging 1.75 micron OmniPixel3-HS™ pixel technology, OV2680 and OV2685 deliver 2 MP images and video at 30 fps or cropped 720p HD video at 60 fps. Sensitivity and low-dark current featuresÂ- lend to optimal image and video quality, even in low-light conditions, while system design facilitates and accelerates integration with smartphone and tablet basebands. OV2680 RAW sensor fits into...
Read More »Processor-Based MPU combines power, energy efficiency.
Promoting processing power, SAMA5D3 delivers up to 850 DMIPS at 536 MHz while offering 1,328 MBps at 166 MHz bus speed. Power consumption is
Read More »IC-LOGIC Debuts "First Time Right" Chip with Arteris FlexNoC and C2C Interconnect IP for Automotive and Industrial Applications
Network-on-Chip (NoC) interconnect IP enables shorter design time with increased quality SUNNYVALE, Calif.Â- – Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, and IC-LOGIC GmbH today announced that the IC-LOGIC IO HUB chip will be deployed into automobiles beginning 2015. The first time right" device will move into...
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More performance and functionality for Sinumerik 828D CNC
Siemens new SINUMERIK 828D ADVANCED, SINUMERIK 828D and SINUMERIK 828D BASIC sets the standard for productivity enhancements of turning and milling operations on standardized machines and simplify the automation of grinding machines. See our video to learn all about it.
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