Electronic Chips

Electronic Chips

Blu-Castle Selects Marvell's Award-Winning G.hn Silicon to Power Connectivity in the Home

Marvell's robust G.hn chipset enables high-speed and powerful connectivity to multimedia HD content SANTA CLARA, Calif. and LAS VEGAS – Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced that Blu-Castle has selected Marvell's award-winning and HomeGrid Forum-certified G.hn chipset to power its products for the Connected Home. Blu-Castle, a leading...

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Electronic Chips

Everspring's New Sensors Leverage DSP Group's ULE Chipset, Deliver Smart Home Services

Everspring's Advanced and Reliable New Sensors Integrate DSP Group's DHX91 SoC, Supporting State-of-the-Art Home Automation Capabilities Based on ULE (Ultra Low Energy) Technology SAN JOSE, Calif.Â- — DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, and Everspring, a global company that provides home security and...

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Electronic Chips

DSP Group's DVF99 VoIP SoC Powers Panasonic's New IP Phones

DSP Group's Latest VoIP System-on-a-Chip (SoC) Provides Panasonic's IP Terminals the Benefits of Rich VoIP Business Features SAN JOSE, Calif.Â- — DSP Group® (Nasdaq:DSPG), a leading global provider of chipset solutions for converged communications, announced today that its highly-integrated and recently-launched DVF99 VoIP SoC solution has been selected to power Panasonic's KX-NT550...

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Electronic Chips

ZTE's Flagship Grand Memo LTE Smartphone Achieves China Mobile TD-LTE Certification with Marvell's Industry Leading 4G LTE Solution

Marvell's ARMADA Mobile PXA1802 4G LTE modem enables ZTE's first TD-LTE smartphone now widely available for China Mobile's nearly 760 million subscribers SANTA CLARA, Calif. and LAS VEGASÂ- – Marvell (Nasdaq: MRVL) today announced that ZTE's flagship Grand Memo LTE smartphone has achieved China Mobile TD-LTE certification with Marvell's industry leading 4G LTE solution. Marvell's...

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Electronic Chips

MediaTek Announces the Availability of Multimode LTE Modem Chipset

MT6290 supports LTE R9, DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS LAS VEGAS - MediaTek is demonstrating its first LTE modem platform in its booth at CES 2014 located inside the Venetian Hotel, Las Vegas. Summary of key points: -Â-  LTE Release 9 Category 4 modem in 28nm process -  Baseband processor based on the Coresonic SIMT architecture -  Proven LTE protocol stack...

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Electronic Chips

Dual-Core MCUs offer 800 MIPS of floating point performance.

Providing dual-core C28x processing capabilities and dual real-time control accelerators, C2000™ Delfino™ 32-bit F2837xD Series enables designers to develop low-latency systems in computationally demanding control applications. Designers can also consolidate multiple embedded processors into single MCU for applications requiring real-time signal analysis, such as high-end servo drives and...

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Electronic Chips

CameraChip(TM) Sensors (2 MP) enhance tablets and mobile devices.

Leveraging 1.75 micron OmniPixel3-HS™ pixel technology, OV2680 and OV2685 deliver 2 MP images and video at 30 fps or cropped 720p HD video at 60 fps. Sensitivity and low-dark current featuresÂ- lend to optimal image and video quality, even in low-light conditions, while system design facilitates and accelerates integration with smartphone and tablet basebands. OV2680 RAW sensor fits into...

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Electronic Chips

IC-LOGIC Debuts "First Time Right" Chip with Arteris FlexNoC and C2C Interconnect IP for Automotive and Industrial Applications

Network-on-Chip (NoC) interconnect IP enables shorter design time with increased quality SUNNYVALE, Calif.Â- – Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, and IC-LOGIC GmbH today announced that the IC-LOGIC IO HUB chip will be deployed into automobiles beginning 2015. The first time right" device will move into...

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