Cores

Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process

Multi-protocol PHY supports PCI Express 2.0, PCI Express 3.0, USB 3.0 and SGMII specifications SAN JOSE, Calif.- – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its multi-protocol Serializer/Deserializer (SerDes) PHY IP for PCI Express-® (PCIe-®) 2.0 and PCIe 3.0 technology for TSMC's 16nm FinFET Plus (16FF+) process have passed PCI-SIG-® compliance testing. The complete...

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EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM® Processor Optimized for High-Performance Networking Applications

Offering Best Application Density, Scalability and Power Efficiency for Data-Center and Carrier Networks YOKNEAM, Israel – Introducing the TILE-Mx, a new family of multicore processors featuring an unmatched combination of high-performance processing, throughput and efficiency: - - - - - - -  - One hundred 64bit ARM CPU cores in one chip for highest compute power - - - - - - -  -...

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Mindtree Enables Next Generation Bluetooth® Low Energy Chips at Cypress

WARREN, N.J. and BANGALORE Provides High-Performance, Low-Power Connectivity to Programmable SoC Solutions Mindtree , a global technology services company, today announced that its BlueLitE Bluetooth-® intellectual property (IP) has been incorporated into the newPSoC-® 4 BLE and PRoC™ BLE system-on-chip products from Cypress Semiconductor Corp., a leading provider of programmable solutions....

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CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs

CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs Showcasing the latest advances in computer vision, computational photography, audio, voice, sensing, cellular communications, Bluetooth Wi-Fi technologies; Visit CEVA at booth A50, hall 6 MOUNTAIN VIEW, Calif.- – CEVA, Inc. (NASDAQ: CEVA),...

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Xilinx and BEEcube Deliver World's First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications

Xilinx 256QAM millimeter wave modem IP integrated on the BEEcube BEE7 baseband platform provides complete out of the box solution for wideband backhaul prototyping SAN JOSE, Calif. –- Xilinx, Inc. (NASDAQ: XLNX) and BEEcube today announced they have delivered the world's first millimeter wave (mmWave) prototyping platform solution for pioneering development of 5G applications. Xilinx's newest...

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Xilinx and Its Ecosystem Demonstrate All Programmable and Smarter Vision Solutions at ISE 2015

Demonstrations highlight design platforms, IP, and reference designs that provide the fastest way to bring 4K UHD and packet-based video systems to market SAN JOSE, Calif.,- – Xilinx, Inc. (NASDAQ: XLNX) and its ecosystem will demonstrate All Programmable and Smarter Vision Solutions at ISE 2015. Through a series of in-booth demonstrations, Xilinx and its Alliance Members will showcase design...

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CogniVue and NeoLAB Convergence Inc. Announce N2 Smart Pen using CogniVue APEX Image Cognition Processor Technology

CogniVue and NeoLAB Convergence Inc. Announce N2 Smart Pen using CogniVue APEX Image Cognition Processor Technology

LAS VEGAS - International CES - CogniVue Corporation, which licenses its APEX Image Cognition Processing (ICP) technologies to semiconductor vendors for automotive and consumer markets, announced their latest collaboration with NeoLAB Convergence-  to create a-  breakthrough in combining the digital and analog writing experience: the Neo smartpen N2™. The N2 achieves its industry-leading...

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DSP IP Core supports 32-bit audio/voice processing.

Enabling emerging multi-channel object-based audio standards, Tensilica-® HiFi 4 Audio/Voice DSP IP Core is suited for digital TV, set-top box, Blu-ray Disc, and automotive infotainment. Processor supports four 32 x 32-bit multiplier-accumulators per cycle with 72-bit accumulators for computationally intensive functions such as Fast Fourier Transform and finite impulse response. Four very long...

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Broadcom Announces New 5G WiFi Chips and SoCs for Routers, Gateways and Set-top Boxes

World's Fastest 4x4 MU-MIMO Chip Delivers Dramatic Improvement in Wireless Video Streaming LAS VEGAS - CES International 2015 Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced an expanded portfolio of 5G WiFi chips and system-on-chip (SoC) devices for high performance and mass market retail routers,...

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EZchip Advances the NP-5 200-Gigabit Network Processor to Production

YOKNEAM, Israel – EZchip Semiconductor Ltd. (NASDAQ:EZCH), a leader in high-performance data-path processing solutions for carrier and data-center networks, today announced that its latest network processor, the 200-Gigabit NP-5, is now in full production. Following extensive testing and qualification, the NP-5 is now being delivered in quantity to EZchip's customers for deployment in Tier-1...

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Fresh Air Intake Designed to Meet ASHRAE 62.2 standards
Sponsored

Fresh Air Intake Designed to Meet ASHRAE 62.2 standards

Alan Manufacturing has a long history of developing innovative solutions for HVAC applications. With over 1,000 product designs under our belt, we have gained a reputation as the go-to source for HVAC dampers, hardware, duct supports, zone control systems, and much more. Adding to this extensive list of achievements we now announce the release of our new line of Fresh Air Intake products. Designed to meet ASHRAE 62.2 standards, they are the most robust and high-performance product of their kind. See our video to learn more.

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