Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process
Multi-protocol PHY supports PCI Express 2.0, PCI Express 3.0, USB 3.0 and SGMII specifications SAN JOSE, Calif.- – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its multi-protocol Serializer/Deserializer (SerDes) PHY IP for PCI Express-® (PCIe-®) 2.0 and PCIe 3.0 technology for TSMC's 16nm FinFET Plus (16FF+) process have passed PCI-SIG-® compliance testing. The complete...
Read More »EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM® Processor Optimized for High-Performance Networking Applications
Offering Best Application Density, Scalability and Power Efficiency for Data-Center and Carrier Networks YOKNEAM, Israel – Introducing the TILE-Mx, a new family of multicore processors featuring an unmatched combination of high-performance processing, throughput and efficiency: - - - - - - - - One hundred 64bit ARM CPU cores in one chip for highest compute power - - - - - - - -...
Read More »Mindtree Enables Next Generation Bluetooth® Low Energy Chips at Cypress
WARREN, N.J. and BANGALORE Provides High-Performance, Low-Power Connectivity to Programmable SoC Solutions Mindtree , a global technology services company, today announced that its BlueLitE Bluetooth-® intellectual property (IP) has been incorporated into the newPSoC-® 4 BLE and PRoC™ BLE system-on-chip products from Cypress Semiconductor Corp., a leading provider of programmable solutions....
Read More »CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs
CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs Showcasing the latest advances in computer vision, computational photography, audio, voice, sensing, cellular communications, Bluetooth Wi-Fi technologies; Visit CEVA at booth A50, hall 6 MOUNTAIN VIEW, Calif.- – CEVA, Inc. (NASDAQ: CEVA),...
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A Guide to Quality Control of the SMT Process
The printed circuit board (PCB) manufacturing process begins with cutting-edge equipment capable of accurately picking and placing up to 40,000 components per hour. This innovative equipment keeps error rates extremely low, and those defects that do occur are quickly caught by sensitive laser and optical inspection equipment.
Read More »Xilinx and BEEcube Deliver World's First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications
Xilinx 256QAM millimeter wave modem IP integrated on the BEEcube BEE7 baseband platform provides complete out of the box solution for wideband backhaul prototyping SAN JOSE, Calif. –- Xilinx, Inc. (NASDAQ: XLNX) and BEEcube today announced they have delivered the world's first millimeter wave (mmWave) prototyping platform solution for pioneering development of 5G applications. Xilinx's newest...
Read More »Xilinx and Its Ecosystem Demonstrate All Programmable and Smarter Vision Solutions at ISE 2015
Demonstrations highlight design platforms, IP, and reference designs that provide the fastest way to bring 4K UHD and packet-based video systems to market SAN JOSE, Calif.,- – Xilinx, Inc. (NASDAQ: XLNX) and its ecosystem will demonstrate All Programmable and Smarter Vision Solutions at ISE 2015. Through a series of in-booth demonstrations, Xilinx and its Alliance Members will showcase design...
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CogniVue and NeoLAB Convergence Inc. Announce N2 Smart Pen using CogniVue APEX Image Cognition Processor Technology
LAS VEGAS - International CES - CogniVue Corporation, which licenses its APEX Image Cognition Processing (ICP) technologies to semiconductor vendors for automotive and consumer markets, announced their latest collaboration with NeoLAB Convergence- to create a- breakthrough in combining the digital and analog writing experience: the Neo smartpen N2™. The N2 achieves its industry-leading...
Read More »DSP IP Core supports 32-bit audio/voice processing.
Enabling emerging multi-channel object-based audio standards, Tensilica-® HiFi 4 Audio/Voice DSP IP Core is suited for digital TV, set-top box, Blu-ray Disc, and automotive infotainment. Processor supports four 32 x 32-bit multiplier-accumulators per cycle with 72-bit accumulators for computationally intensive functions such as Fast Fourier Transform and finite impulse response. Four very long...
Read More »Broadcom Announces New 5G WiFi Chips and SoCs for Routers, Gateways and Set-top Boxes
World's Fastest 4x4 MU-MIMO Chip Delivers Dramatic Improvement in Wireless Video Streaming LAS VEGAS - CES International 2015 Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced an expanded portfolio of 5G WiFi chips and system-on-chip (SoC) devices for high performance and mass market retail routers,...
Read More »EZchip Advances the NP-5 200-Gigabit Network Processor to Production
YOKNEAM, Israel – EZchip Semiconductor Ltd. (NASDAQ:EZCH), a leader in high-performance data-path processing solutions for carrier and data-center networks, today announced that its latest network processor, the 200-Gigabit NP-5, is now in full production. Following extensive testing and qualification, the NP-5 is now being delivered in quantity to EZchip's customers for deployment in Tier-1...
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TPA Motion Introduces Industry's First Compact Robotic Positioner for Medical Devices
TPA Motion's microplate handling robots are designed specifically for medical instruments and lab automation devices. Check out the video to learn more.
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