Microsemi's SmartFusion2 SoC FPGAs Successfully Adopted by Extreme Engineering Solutions, Enabling Company to Provide Advanced Security Features
Requested by Customers, Unique New Device Leverages Microsemi Technology as Root of Trust in Rugged Single Board Computers ALISO VIEJO, Calif. - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor and system solutions differentiated by power, security, reliability and performance, today announced its customer, Extreme Engineering Solutions, Inc. (X-ES), is offering a...
Read More »Microsemi's SmartFusion2 SoC FPGAs Successfully Adopted by Extreme Engineering Solutions, Enabling Company to Provide Advanced Security Features
Requested by Customers, Unique New Device Leverages Microsemi Technology as Root of Trust in Rugged Single Board Computers ALISO VIEJO, Calif. - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor and system solutions differentiated by power, security, reliability and performance, today announced its customer, Extreme Engineering Solutions, Inc. (X-ES), is offering a...
Read More »Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its DDR4 and LPDDR4 IP products for TSMC's 16nm FinFET Plus (16FF+) process have completed TSMC9000 Silicon Assessment. The Cadence-® Denali® DDR controller IP, and both the Denali DDR4 and LPDDR4 PHY IP, have demonstrated operating speeds of up to 3200 Mbps, and each are in production with several customers....
Read More »Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its DDR4 and LPDDR4 IP products for TSMC's 16nm FinFET Plus (16FF+) process have completed TSMC9000 Silicon Assessment. The CadenceÂ-® Denali® DDR controller IP, and both the Denali DDR4 and LPDDR4 PHY IP, have demonstrated operating speeds of up to 3200 Mbps, and each are in production with several...
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How to Select a Rubber Compounding & Mixing Supplier
To learn more about rubber compounding and mixing, and how experienced manufacturers like AirBoss can meet your needs, download this whitepaper now.
Read More »Qualcomm Announces Vulkan API Support on the Adreno 530 GPU
SAN DIEGO - Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has introduced support for the latest graphics and compute API from Khronos™, Vulkan™, on its Qualcomm-® Adreno™ 530 GPU, which is embedded in its Qualcomm® Snapdragon™ 820 processor. Vulkan is the next-generation open-standard API for high-efficiency access to graphics...
Read More »Xilinx and its Expanded Ecosystem Showcase the Latest 16nm Zynq UltraScale+ MPSoC Technologies at Embedded World 2016
Demonstrations will highlight how Xilinx is enabling differentiated, smarter, and connected applications that are shaping the future of Embedded Vision and Industrial IoT SAN JOSE, Calif. - Xilinx, Inc. (NASDAQ: XLNX) and its expanded ecosystem will showcase the latest 16nm Zynq-® UltraScale+™ MPSoC technologies at Embedded World 2016. Conference presentations and demonstrations will highlight...
Read More »Qualcomm Announces Vulkan API Support on the Adreno 530 GPU
SAN DIEGO - Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has introduced support for the latest graphics and compute API from Khronos™, Vulkan™, on its QualcommÂ-® Adreno™ 530 GPU, which is embedded in its Qualcomm® Snapdragon™ 820 processor. Vulkan is the next-generation open-standard API for high-efficiency access to...
Read More »Xilinx and its Expanded Ecosystem Showcase the Latest 16nm Zynq UltraScale+ MPSoC Technologies at Embedded World 2016
Demonstrations will highlight how Xilinx is enabling differentiated, smarter, and connected applications that are shaping the future of Embedded Vision and Industrial IoT SAN JOSE, Calif. - Xilinx, Inc. (NASDAQ: XLNX) and its expanded ecosystem will showcase the latest 16nm ZynqÂ-® UltraScale+™ MPSoC technologies at Embedded World 2016. Conference presentations and demonstrations will...
Read More »Xilinx Strengthens Embedded Vision and Industrial IoT Portfolio with Expanded Ecosystem and Platforms
Complements new 16nm Zynq UltraScale+ MPSoC and software defined SDSoC development environments, enabling the highest levels of differentiation and flexibility SAN JOSE, Calif. - Xilinx, Inc. (NASDAQ: XLNX) today announced that it has strengthened its portfolio for Embedded Vision and Industrial IoT markets with an expanded ecosystem and hardware platforms. This announcement complements Xilinx's...
Read More »LG Electronics Selects CEVA Imaging and Vision DSP for Mobile Devices
MOUNTAIN VIEW, Calif. – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that LG Electronics has licensed the CEVA imaging and vision DSP for its mobile device product lines. We are delighted to announce LG Electronics as a customer for our imaging and vision DSP," said Gideon Wertheizer, CEO of CEVA. "Their market...
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Simple Connection – MGB with EtherNet/IP
The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.
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