Renesas Electronics Innovative Automotive Chips Adopted by Nissan for its New Skyline ProPILOT 2.0

Renesas Electronics Innovative Automotive Chips Adopted by Nissan for its New Skyline ProPILOT 2.0

Tokyo, Japan, August 7, 2019 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that Nissan Motor Co., Ltd. has adopted Renesas’ innovative and high-peformance automotive technology for the ProPILOT 2.0 system featured in the new Nissan Skyline unveiled on July 16, 2019. The driver assistance system combines navigated highway...

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Get AI Solutions from AAEON Powered by Intel Myriad X

Get AI Solutions from AAEON Powered by Intel Myriad X

(Taipei, Taiwan – Aug 6, 2019) – AAEON, an award winning leader in AI@Edge solutions, presents its AI platforms powered by Intel Movidius Myriad X. As the first company to produce an mPCIe module to feature the Intel Myriad X VPU, AAEON is continuing to lead the industry in offering powerful, flexible AI platforms with Intel solutions. At the heart of AAEON AI solutions is the Intel Movidius...

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New SMC 1000 8x25G Enables Media Independent OMI Interface

New SMC 1000 8x25G Enables Media Independent OMI Interface

Enables CPUs and compute-centric SoCs to memory channels of parallel attached DDR4 DRAM within the same package footprint. Interfaces to CPU via 8-bit OMI-compliant 25 Gbps lanes and bridges to memory via 72-bit DDR4 3200 interface. Delivers less than four ns incremental latency over a traditional integrated DDR controller with LRDIMM.

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New Heavy-duty HI Grip Features up to 10 Switch Functions

New Heavy-duty HI Grip Features up to 10 Switch Functions

Designed from the ground up to offer left and right-handed versions that lean inward and forward. Suitable for use in arduous construction, material handling and agricultural in-cab applications. Features a scalloped shaft and a handed hand rest for optimal operator comfort and operation.

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New RX651 MCUs with 64-pin BGA and 64-pin LQFP Package

New RX651 MCUs with 64-pin BGA and 64-pin LQFP Package

Provides performance with 520 CoreMark® score at 120 MHz and power efficiency with a 35 CoreMark/mA score. Addresses advanced security needs for endpoint devices employing compact sensor and communication modules. Enables data exchange to change production instructions and reprogram MCU memory to update equipment settings.

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