New Bonders Products

Placement and Bonding System covers range of processes.

Suited for R&D laboratories, universities, and pre-production environments, KADETT provides flexible and open platform for assembly and bonding of devices on variety of substrates. Semi-automatic machine performs accurate pick-and-place functions, and accurate alignment is achieved via vision system with 2 independent video microscopes and high-resolution (0.1 Ã-µm) XY alignment stage....

Capillary is suited for fine pitch wire bonding.

Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

Ultrasonic Bonder assembles 50-80 filter bags per hour.

Suited for chemical and industrial liquid applications, Filter Collar Bonder(TM) ultrasonically attaches rigid plastic circular frames to non-woven filter bags using SureWeld 20(TM) technology. Operator loads plastic ring and filter bag onto center fixture. Start button is activated causing welding head to close on part, ultrasonically weld it, and retract. Operator then manually rotates center...

Stud Bumper targets flip chip market.

Using hardware and software technology, ATPremier Stud Bumping Machine bonds 36 standard bumps/sec at 60 Ã-µm pitch. Since stud bumping does not require under bump metallurgy, bonding can be performed in single step. Wafer-Mapping interface bonds only known good die.

Introduction to Optical Replication

To learn more about the optical replication process, and how to avoid complications, download this white paper now.

Portable Hot Bonder utilizes Windows-®-like interface.

Advanced Composite Repair (ACR) 2 Hot Bonder provides users with everything needed to perform composite and metal bond repairs in one suitcase. To facilitate programming, unit is equipped with color touchscreen, software, and USB data port. Product is offered with vacuum venturi pump, or electric vacuum pump for self-contained system.

Capillary Flip-Chip Underfill suits lead-free assemblies.

HysolÃ-® FP4547FC is compatible with clean and no-clean flux residues. It protects lead-free flip-chip devices and allows them to meet JEDEC Level 3/260Ã-

Capillary suits copper wire bonding applications.

CuPRA(TM) handles copper wire from 0.8-3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications.

DVD Bonding System provides 1,000 W/cm-² peak pulse power.

CoolCureXL-DVDÃ-® Bonding System features pulsed UV curing lamps capable of 0.6 sec cure times for DVD-5 formats. Tilt management is achieved using lamps on top and bottom during curing process. Eliminating need for DVD repositioning while curing, system uses spiral-shaped lamps that match DVD profile and expose full disc to 1,000 W/cmÃ-² peak pulse power. Pulsed UV curing lamps provide...

IC Ball Bonder offers 35 -µm fine pitch capability.

MaxÃ-µmplusT Ultra High Speed Ball Bonder incorporates 2.20 x 2.60 in. bonding area, S-Scan imaging technology, Ã-µT-Sonics(TM) transducer, and Precision-Arc(TM) EFO system. Servo control system for X-Y Table reduces wire cycle times to 63.0 msecs, and Precision-touchT bondhead technology delivers optimum bond force control. Teaching and calibration software delivers bond placement...

Heat Vacuum Applicator offers complete temperature control.

AppliPhase HVA enables operators to set control unit for temperature and length of exposure to ensure correct bonding of flexible back-light signage transfers, reflective sheeting, Panaflex signs, backlit awnings, traffic signs, and premask application tape. Features include steel construction and oil-free vacuum pump. Lamp bank and diaphragm may be raised to offer clearance for handling of...

TPA Motion Introduces New Curved Linear Rail Guides: the CR40 Series

For the ultimate in precision open and closed loop guided motion systems, TPA Motion is the leader in curved rail, liner guides. We specialize in engineering excellence, with products that exhibit an elevated level of precision, delivering robust performance, even under the most challenging conditions. See our video to learn more.