Placement and Bonding System covers range of processes.

Press Release Summary:

Suited for R&D laboratories, universities, and pre-production environments, KADETT provides flexible and open platform for assembly and bonding of devices on variety of substrates. Semi-automatic machine performs accurate pick-and-place functions, and accurate alignment is achieved via vision system with 2 independent video microscopes and high-resolution (0.1 µm) XY alignment stage. Various bonding processes are available for forces up to 75 N.

Original Press Release:

SUSS MicroTec Unveils the KADETT; a New High Accuracy Placement and Bonding System for R&D

Saint-Jeoire, France, April 23rd, 2007 - SUSS MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets unveiled the KADETT, a new High Accuracy Placement and Bonding System especially configured for R&D laboratories, universities and pre-production environments.

The new SUSS KADETT Semi-Automatic Device Bonder is a flexible and open platform for accurate assembly and bonding of devices on a large variety of substrates. The machine performs accurate Pick and Place functions. A wide range of bonding processes including In-Situ Reflow, Thermo-Compression, Thermo-Sonic and Adhesive Bonding are available for forces up to 75N.

The KADETT, originally developed by the Paul Scherrer Institute*, has been proven in the field for bonding Ionizing Radiation Detectors and it is also well suited for Advanced Packaging, micro-optics or MEMS assembly.

Accurate alignment is automatically achieved by a vision system which uses two independent high resolution video microscopes (chip and substrate) with a high resolution (0.1µm) XY alignment stage. The robust and simple concept of the system meets the current requirements for high accuracy placement and bonding various components and its open design makes it the ideal platform for future evolution of the advanced packaging applications.

The flexible architecture of the SUSS KADETT enables the integration of many processing modules such as a UV glue curing system, Ultrasonic bonding head and many others. "Its easy and quick changeover between the various process configurations is of primary interest for research environments where adaptability and multi-user compatibility is essential", said Gilbert Lecarpentier, International Product Manager at SUSS MicroTec Device Bonder Division.

SUSS MicroTec will exhibit the SUSS KADETT at the SMT Hybrid Packaging 2007 (booth no. 7-240).

*The Paul Scherrer Institute (PSI) is a Swiss multi-disciplinary research centre for natural sciences and technology. Located in Switzerland, PSI is active in solid state physics, materials sciences, elementary particle physics, life sciences, nuclear and non -nuclear energy research, and energy-related ecology.

For more information, please contact:
Alexandra Leger
Marketing and Communications Manager
SUSS MicroTec Device Bonder Division
131 Impasse Barteudet
F-74490 Saint Jeoire (France)
Phone: +33 450 35 83 92

Louise Jones
SUSS MicroTec Inc.
Sales & Marketing Specialist
800-685-7877, Ext. 218

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