Flip Chip Bonder offers 8 micron placement accuracy.
Mach FC Plus is based on parallel processing, gantry machine platform designed for high-speed bonding. Picking, flipping, fluxing, vision alignment, and controlled die placement are performed with asynchronous parallel motion. Automatic 300 mm wafer changer is compatible with wafer cassette docking carts. Bonder includes closed-loop placement force control, flux dipping station, up to 53...
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Die Bonder suits semiconductor/electronic packaging markets.
Able to provide assembly solutions for epoxy die attach, eutectic, and flip chip bonding, MRSI-605 AP Advanced Packaging Die Bonder is based on MRSI-505 platform. Machine includes 6-head, feather-touch tool turret that rotates through full 360Ã-
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Capillary bonds thicker wires in fine pitch uses.
CIC (Contained Inner Chamfer) capillary contains additional gold generated from free air ball during bonding in its inner chamfer. Device reduces production of large ball diameters and enables use of thicker wire bonding for UFP applications of 50 -µm and below, reducing wire sweeps and short failures. Capillary supports UFP processes with maximized ball-on pad accuracy, higher ball shear, and...
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Bonders cut and seal in one pass without consumables.
SureWeld 20 kHz ultrasonic plunge welders can assemble cylindrical filters from pleated HEPA filter media. In overlapping applications, ultrasonic welders bond and trim edges of pleated filter media in one step to create 10 in. filter tube, which maintains HEPA rating. SureWeld bonders feature rectangular support columns, which eliminate deflection and keep filter unit in perfect alignment during...
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Glass Fabrication for MEMS Applications
Micro-electromechanical systems (MEMS) can be found in nearly every industry, such as the consumer electronics and semiconductor fields. Learn more about the technology and its applications.
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Charging System bonds materials electrostatically.
Model 3000 Autostat(R) uses forces of static electricity for adhering one material to another, such as temporary bonding of protective covering to metal sheets or wood paneling, spot pinning of over-wrapping material prior to heat sealing, edge pinning of web to einsure constant direction, and removal of air pockets during laminating. Power supply has variable output to insure highest degree of...
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Let Our Safety Experts Lower Your Risk
Elite Technical Services provides your company with qualified and experienced safety experts. Specializing in confined space and high-angle technical rescue and jobsite hazard assessment, your workplace safety is the top priority. Check out the video to learn more.
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