Kester, an ITW company
Itasca, IL 60143
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No-Clean Solder Paste offers batch-to-batch repeatability.
Type R905 lead-free solder paste is engineered for high thermal demand of assembling with elevated melting temperatures of lead-free alloys. It provides consistent release from stencil for critical, 0.4 mm fine-pitched applications with anti-slump characteristics and preferred solder deposit definition. Printing characteristics remain constant with print speeds up to 6 ips. Paste is 0201 capable...
Read More »Reflow Encapsulant suits flip chip-on-flex applications.
SE-CUREÃ-® 9110 series consists of single-component materials that perform as epoxy-based flux and underfill encapsulants. Series uses compression-flow technique and enables concurrent processing of typical surface-mount components with flip chips in single reflow profile. Resin system provides eutectic and lead-free assembly solution in one material that offers protection from mechanical...
Read More »Reflow Encapsulant provides single-pass curing.
With blue color to aid visual inspection, SE-CUREÃ-® 9126 single-pass reflow encapsulant is suited for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates. Single-component, liquid, epoxy-based flux and underfill encapsulant may be used in high humidity and temperature environments where dwell time between material dispense and chip...
Read More »Capillary Underfill hastens flip chip device assembly.
Suited for throughput assembly of flip chip devices on rigid and flexible substrates, SE-CUREÃ-® 9208 consists of filled one-component, snap-cure underfill epoxy material. Product eliminates resin bleedout and allows for uniform, void-free encapsulation under die for gaps of 0.001-0.005 in. With operating temperature range of -55 to +150 Ã-
Read More »Solder Spheres suit BGA and CSP components assembly.
Ultra-SpheresÃ-® support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. They resist surface darkening induced by transit tumbling and ball placement equipment. Product is available in solder alloys such as eutectic tin/lead and high lead (typical for ceramic BGA packages), as well as lead-free solder alloys. Sphere diameters are available...
Read More »Solder Paste reduces voiding of bumps on wafer/substrate.
Water-soluble SE-CUREÃ-® 7101 has activator package that is formulated to exhibit uniform wetting to various under-bump metallurgies, reducing bump's voiding level to less than 10%. Residues can be removed, post-reflow, with cool or warm deionized water. It releases cleanly from stencil apertures with area ratios of 1.5 and smaller. Thermally stable flux system is compatible with tin/lead and...
Read More »No-Clean Solder Paste offers batch-to-batch repeatability.
Type R905 lead-free solder paste is engineered for high thermal demand of assembling with elevated melting temperatures of lead-free alloys. It provides consistent release from stencil for critical, 0.4 mm fine-pitched applications with anti-slump characteristics and preferred solder deposit definition. Printing characteristics remain constant with print speeds up to 6 ips. Paste is 0201 capable...
Read More »Reflow Encapsulant suits flip chip-on-flex applications.
SE-CUREÃ-® 9110 series consists of single-component materials that perform as epoxy-based flux and underfill encapsulants. Series uses compression-flow technique and enables concurrent processing of typical surface-mount components with flip chips in single reflow profile. Resin system provides eutectic and lead-free assembly solution in one material that offers protection from mechanical...
Read More »Reflow Encapsulant provides single-pass curing.
With blue color to aid visual inspection, SE-CUREÃ-® 9126 single-pass reflow encapsulant is suited for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates. Single-component, liquid, epoxy-based flux and underfill encapsulant may be used in high humidity and temperature environments where dwell time between material dispense and chip...
Read More »Capillary Underfill hastens flip chip device assembly.
Suited for throughput assembly of flip chip devices on rigid and flexible substrates, SE-CUREÃ-® 9208 consists of filled one-component, snap-cure underfill epoxy material. Product eliminates resin bleedout and allows for uniform, void-free encapsulation under die for gaps of 0.001-0.005 in. With operating temperature range of -55 to +150 Ã-
Read More »Solder Spheres suit BGA and CSP components assembly.
Ultra-SpheresÃ-® support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. They resist surface darkening induced by transit tumbling and ball placement equipment. Product is available in solder alloys such as eutectic tin/lead and high lead (typical for ceramic BGA packages), as well as lead-free solder alloys. Sphere diameters are available...
Read More »Solder Paste reduces voiding of bumps on wafer/substrate.
Water-soluble SE-CUREÃ-® 7101 has activator package that is formulated to exhibit uniform wetting to various under-bump metallurgies, reducing bump's voiding level to less than 10%. Residues can be removed, post-reflow, with cool or warm deionized water. It releases cleanly from stencil apertures with area ratios of 1.5 and smaller. Thermally stable flux system is compatible with tin/lead and...
Read More »