Reflow Encapsulant provides single-pass curing.
Press Release Summary:
With blue color to aid visual inspection, SE-CURE® 9126 single-pass reflow encapsulant is suited for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates. Single-component, liquid, epoxy-based flux and underfill encapsulant may be used in high humidity and temperature environments where dwell time between material dispense and chip placement is critical.
Original Press Release:
Northrop Grumman Introduces Single-Pass Reflow Encapsulant
DES PLAINES, Ill. - July 31, 2003 - Northrop Grumman Corporation (NYSE: NOC) announces that Kester®, a business unit of the company's Component Technologies sector, has introduced SE-CURE® 9126 single-pass reflow encapsulant. The product is intended for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates for both in-package and second-level assembly.
SE-CURE® 9126 reflow encapsulant is a single-component, liquid, epoxy-based flux and underfill encapsulant designed to enhance solder joint reliability during temperature cycling of CSPs and flip chip devices. Single-pass reflow encapsulants eliminate costly process time associated with traditional underfill process methods by using an innovative compression-flow technique. The robust encapsulant specifically allows for use in high-humidity and temperature environments in which the dwell time between material dispense and chip placement is critical.
Kester's product offers the unique advantage of processing normal surface mount component packages concurrently with flip chips in a single reflow profile. This optimizes the production environment by reducing the number of processing steps required for assembly. SE-CURE® 9126 was specifically developed and designed for the assembly of rigid boards. Additional benefits include: single-pass curing in standard surface mount technology (SMT) eutectic reflow profiles; excellent dispense performance and deposit shape retention; excellent solderability to a variety of substrate metallizations; eliminating the need to print paste for fine-pitch CSP mounting; greatly enhanced reliability over non-underfilled CSPs; and 9126's blue color aids in visual inspection.
For more information on SE-CURE® 9126 as well as Kester's full line of products and services, contact Kester® by phone at (847) 297-1600 or 800-2-KESTER ((800) 253-7837), by fax at (847) 699-5548, or by e-mail at customerservice@kester.com. Kester's Web site may be found at www.kester.com.
Founded in 1899, Kester® is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail, and wholesale plumbing markets. Kester® is known for high quality, advanced technology and superior technical support. With headquarters in Des Plaines, Ill., Kester® has additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and Original Equipment Manufacturers.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies is comprised of six business units that include Interconnect Technologies, Kester®, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics. The sector has more than 3,000 employees with technical sales offices in 28 countries and operations in 18 countries.
