Solder Spheres suit BGA and CSP components assembly.
Press Release Summary:
Ultra-Spheres® support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. They resist surface darkening induced by transit tumbling and ball placement equipment. Product is available in solder alloys such as eutectic tin/lead and high lead (typical for ceramic BGA packages), as well as lead-free solder alloys. Sphere diameters are available from 0.012-0.035 in.
Original Press Release:
Northrop Grumman Introduces Innovative Solder Spheres for BGA and CSP Components Assembly
DES PLAINES, Ill., - July 31, 2003 - Northrop Grumman Corporation (NYSE: NOC) announces that Kester®, a business unit of the company's Component Technologies sector, has introduced Ultra-Spheres®. The solder spheres support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components.
Ultra-Spheres® are engineered to resist surface darkening induced by transit tumbling as well as ball placement equipment. This surface-darkening resistance eliminates vision systems' false "missing ball" error readings that may result in the unnecessary scrapping or rework of acceptable product.
Kester's Ultra-Sphere® distribution exceeds industry expectations and eliminates unwanted sphere sizes (undersized or oversized), and they support high-yielding ballattach processes. To ensure homogeneity of the solder alloy, Kester® combines the use of only the highest quality virgin metal with award-winning quality practices for a precisely controlled alloying process.
Ultra-Spheres® are available in many solder alloys, including eutectic tin/lead and high lead typical for ceramic BGA packages as well as many of the industry demanded lead-free solder alloys. A wide range of sphere diameters for BGA and CSP ball attach applications are available from 0.012 to 0.035 inch (0.3 to 0.889 millimeter).
For more information on Ultra-Spheres® for BGA or CSP ball-attach applications and Kester's full line of complimentary products such as Kester's market-leading Tacky Soldering Fluxes and services, contact Kester® by phone at (847)297-1600 or 800-2-KESTER ((800) 253-7837), by fax at (847) 699-5548, or by e-mail at customerservice@kester.com. Kester's Web site may be found at www.kester.com.
Founded in 1899, Kester® is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail, and wholesale plumbing markets. Kester® is known for high quality, advanced technology and superior technical support. With headquarters in Des Plaines, Ill., Kester® has additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and Original Equipment Manufacturers.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies is comprised of six business units that include Interconnect Technologies, Kester®, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics. The sector has more than 3,000 employees with technical sales offices in 28 countries and operations in 18 countries.
