Capillary Underfill hastens flip chip device assembly.
Press Release Summary:
Suited for throughput assembly of flip chip devices on rigid and flexible substrates, SE-CURE® 9208 consists of filled one-component, snap-cure underfill epoxy material. Product eliminates resin bleedout and allows for uniform, void-free encapsulation under die for gaps of 0.001-0.005 in. With operating temperature range of -55 to +150 °C, product cures below glass transition temperature.
Original Press Release:
Northrop Grumman Introduces Capillary Underfill to Speed Flip Chip Device Assembly
DES PLAINES, Ill., - July 31, 2003 - Northrop Grumman Corporation (NYSE: NOC) announces that Kester®, a business unit of the company's Component Technologies sector, has introduced SE-CURE® 9208 capillary underfill targeted for the fast throughput assembly of flip chip devices on rigid and flexible substrates.
SE-CURE® 9208 is a filled one-component, snap-cure underfill epoxy material designed for flip chip applications. It exhibits excellent strength properties with a wide, robust process window that increases the reliability of flip chip interconnections through stress management. The capillary underfill eliminates resin bleedout and allows for a more uniform void-free encapsulation under the die for gaps of 0.001 to 0.005 inch (25 to 150 micron). The uniform flow front allows for a more consistent and higher-yielding process, reducing the chance of voiding that limits reliability.
SE-CURE® 9208 is readily compatible with flexible or rigid printed wiring board surfaces, as well as ceramic substrates and a wide variety of die passivations. It is recommended for use in assemblies with a wide operating temperature range (55 below zero to 150 C). The underfill can be cured under a variety of process conditions to suit multiple application and production requirements.
Amongst SE-CURE® 9208's many benefits is high adhesion enhanced at the die/underfill interface. This is achieved through Kester's innovative, designed-in "resinenrichment" film. The result is enhanced resistance to delamination at this critical interface.
SE-CURE® 9208 provides fast flow times that supports high-volume production lines. Its unique ability to be cured well below glass transition temperature provides a lower stress state after final cure.
For more information on SE-CURE® 9208 underfill and Kester's full line of products and services, contact Kester® by phone at (847) 297-1600 or 800-2-KESTER ((800) 253-7837), by fax at (847) 699-5548, or by e-mail at customerservice@kester.com. Kester's Web site may be found at www.kester.com.
Founded in 1899, Kester® is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail, and wholesale plumbing markets. Kester® is known for high quality, advanced technology and superior technical support. With headquarters in Des Plaines, Ill., Kester® has additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and Original Equipment Manufacturers.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies is comprised of six business units that include Interconnect Technologies, Kester®, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics. The sector has more than 3,000 employees with technical sales offices in 28 countries and operations in 18 countries.
