Reflow Encapsulant suits flip chip-on-flex applications.
Press Release Summary:
SE-CURE® 9110 series consists of single-component materials that perform as epoxy-based flux and underfill encapsulants. Series uses compression-flow technique and enables concurrent processing of typical surface-mount components with flip chips in single reflow profile. Resin system provides eutectic and lead-free assembly solution in one material that offers protection from mechanical shock.
Original Press Release:
Northrop Grumman Introduces Single-Pass Reflow Encapsulant for Flip Chip-On-Flex Applications
DES PLAINES, Ill. - July 31, 2003 - Northrop Grumman Corporation (NYSE: NOC) announced that Kester®, a business unit of the company's Component Technologies sector, has introduced the SE-CURE® 9110 series of Reflow Encapsulant (RE) materials intended for flip chip-on-flex applications.
The SE-CURE 9110 series are single-component materials that perform as an epoxy-based flux and underfill encapsulant. The series eliminates the costly process time associated with traditional capillary underfill processes through an innovative compression-flow technique. The encapsulant's unique advantage is that it enables the concurrent processing of typical surface-mount components with flip chips in a single reflow profile - no lengthy post-cure is required. Production can be improved by reducing the number of processing steps required for assembly.
The SE-CURE® 9110 series provides market-leading performance backed by the technical expertise of Kester®, the originator of reflow encapsulant technology. The series features include: robust resin system providing both a eutectic and lead-free assembly solution in one material; mechanical properties optimized for superior reliability and protection from mechanical shock; proven performance in touch applications; qualifications for stringent internal disc-drive applications that do not allow for particle shedding or out-gassing of the material; and best-in-class solder wetting.
For more information on the SE-CURE® 9110 series of reflow encapsulants and Kester's full line of products and services, contact Kester® by phone at (847) 297-1600 or 800-2-KESTER ((800) 253-7837), by fax at (847) 699-5548, or by e-mail at customerservice@kester.com. Kester's Web site may be found at www.kester.com.
Founded in 1899, Kester® is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail, and wholesale plumbing markets. Kester® is known for high quality, advanced technology and superior technical support. With headquarters in Des Plaines, Ill., Kester® has additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and Original Equipment Manufacturers.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies is comprised of six business units that include Interconnect Technologies, Kester®, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics. The sector has more than 3,000 employees with technical sales offices in 28 countries and operations in 18 countries.
Global Kester® customer service contact information:
GLOBAL HEADQUARTERS
515 East Touhy Avenue
Des Plaines, Illinois, USA 60018-2675
TEL: (+1) 847297-16000
FAX: (+1) 847-390-9338
EMAIL:customerservices@kester.com
INTERNET: www.kester.com
