Electro Scientific Industries, Inc.

Communication Systems & Equipment

Micromachining System optimizes drilling of silicon vias.

Employing 355 nm laser, Model Si5330 is capable of rapidly drilling and routing in most metals, organics, semiconductors, and hybrid-engineered materials. Via drill rates up to 2,000 vps are achievable, depending upon material, thickness, and via's size. System also utilizes digital beam positioner with esiCAM software, and has optical bench flexible enough to enable wide range of process...

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Electronic Components & Devices

Laser Repair System allows for turnkey integration.

Optimized for high g-force gantry operation to 3g, QuikLaze 200 and BDS1000 industrial microscope combine to create optomechanical platform that features bolt-on installation. Along with beam-shaping true color optics, beam delivery system, and camera port, FPD system offers selectable repetition rates from single shot to 50 Hz continuous, Tri-lite beam blending configurations, and rotational X-Y...

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Electronic Components & Devices

Wafer Scribing Systems deliver 12-14 wafers/hr.

Suited for demanding 24/7 production-line environments, semi-automated AccuScribe 2112 features automated alignment, positioning, focus, and partial wafer scribing, while fully automated AccuScribe 2150 includes automated loading and unloading of wafers from and to cassettes, eliminating need for operator. Both systems utilize UV DPSS laser technology and advanced optical and image processing...

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Laboratory and Research Supplies and Equipment

Laser Ablation System features beam homogenizing optics.

As flexible analytical tool for range of materials, UP193-FX 193 nm short-pulse excimer laser ablation system is suited for bulk or micro-feature analysis and includes 13 pre-calibrated spot sizes with constant fluence. Use results in consistently smaller aerosol particles from all materials for optimal ionization and crater quality as well as minimal fractionation. System offers fully...

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Laboratory and Research Supplies and Equipment

Spectrometer provides parts-per-million elemental analysis.

Fully integrated, laser-induced-breakdown LIBS-Elite provides real-time spectral analysis of elements in variety of materials down to 1 ppm. System incorporates Tempest Nd:YAG laser, multiple spectrometers, and 7 linear CCD-array detectors that provide broadband analysis. Sample chamber accommodates samples up to 2 in. dia, while integrated rotometer provides chamber purging when working with...

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Electronic Components & Devices

DPSS Wafer-Scribing System provides 10 wph throughput.

Optimized for 24/7 environments, AccuScribe AS2000FX utilizes UV DPSS laser technology and advanced optical and image-processing technologies. Industrial platform provides 4 in. wafer support and can be customized for various requirements. Wafer-edge detection system enables operator to scribe every inch of wafer as well as partial or broken wafers. With backside alignment capability, users can...

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Agricultural & Farming Products

Laser Cutting Systems utilize accessory kit.

Available in motorized and manual configurations, portable StageLaze Accessory Kit transforms QuickLaze systems into turnkey failure-analysis and micromachining solutions. Laser can be specified in single and multiple wavelength configurations, including IR, green, and UV, providing ability to cut variety of materials. Applications include removing discrete layers of materials, ITO shorts in LCD...

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Laser Cutting System suits laboratory applications.
Agricultural & Farming Products

Laser Cutting System suits laboratory applications.

Based on Nd:YAG resonator, air-cooled EzLaze 3 mounts on most industrial microscopes, delivering laser energy to 2.5 mJ at 1,064 and 532 nm, or up to 0.6 mJ at 355 and 266 nm. Variable spot size and optical attenuator enable precise control of energy, while high-resolution shutter facilitates precise control of cut. Internal spot marker replaces external incandescent spot marker with blue-LED...

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Laser Cutting System cuts on microscopic level.
Agricultural & Farming Products

Laser Cutting System cuts on microscopic level.

Suited for failure analysis and LCD repair, QuikLaze 50ST2 features user-selectable repetition rates from single shot to 50 Hz continuous. Multiple wavelength coverage provides ability to cut variety of materials and selectively remove certain materials while leaving others unaffected. Standard, motorized X-Y aperture or high-resolution X-Y aperture enable accurate cutting control. System can be...

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PIV Laser Systems withstand day-to-day abuse.
Electronic Components & Devices

PIV Laser Systems withstand day-to-day abuse.

Suited for liquid- and air-based Particle Image Velocimetry (PIV) experiments, Solo 120XT and 200XT employ one laser head and one power supply. Dual-laser, flashlamp-pumped, Nd:YAG laser systems have resonator frame machined from single aluminum block and have individual machine covers for IR and harmonic sections of laser. Solo 120XT has 120 mJ output, while Solo 200XT provides up to 200 mJ....

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Company News

ESI Reports Strong Preliminary Third Quarter 2018 Financial Results

PORTLAND, Ore., Jan. 17, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today reported preliminary financial results for the fiscal 2018 third quarter ended December 30, 2017. For the third quarter ESI expects to report revenue of between $106 and $111 million, and adjusted earnings per diluted share...

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Company News

ESI to Present at the 2018 Needham Growth Conference

PORTLAND, Ore., Jan. 05, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced that CEO Michael Burger is scheduled to present at the 20th Annual Needham Growth Conference taking place January 17-18, 2018 at the Lotte New York Palace Hotel in New York City. ESI’s presentation, focusing on...

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Communication Systems & Equipment

Micromachining System optimizes drilling of silicon vias.

Employing 355 nm laser, Model Si5330 is capable of rapidly drilling and routing in most metals, organics, semiconductors, and hybrid-engineered materials. Via drill rates up to 2,000 vps are achievable, depending upon material, thickness, and via's size. System also utilizes digital beam positioner with esiCAM software, and has optical bench flexible enough to enable wide range of process...

Read More »
Electronic Components & Devices

Laser Repair System allows for turnkey integration.

Optimized for high g-force gantry operation to 3g, QuikLaze 200 and BDS1000 industrial microscope combine to create optomechanical platform that features bolt-on installation. Along with beam-shaping true color optics, beam delivery system, and camera port, FPD system offers selectable repetition rates from single shot to 50 Hz continuous, Tri-lite beam blending configurations, and rotational X-Y...

Read More »
Electronic Components & Devices

Wafer Scribing Systems deliver 12-14 wafers/hr.

Suited for demanding 24/7 production-line environments, semi-automated AccuScribe 2112 features automated alignment, positioning, focus, and partial wafer scribing, while fully automated AccuScribe 2150 includes automated loading and unloading of wafers from and to cassettes, eliminating need for operator. Both systems utilize UV DPSS laser technology and advanced optical and image processing...

Read More »
Laboratory and Research Supplies and Equipment

Laser Ablation System features beam homogenizing optics.

As flexible analytical tool for range of materials, UP193-FX 193 nm short-pulse excimer laser ablation system is suited for bulk or micro-feature analysis and includes 13 pre-calibrated spot sizes with constant fluence. Use results in consistently smaller aerosol particles from all materials for optimal ionization and crater quality as well as minimal fractionation. System offers fully...

Read More »
Company News

ESI Wins Company of the Year Award at 23rd Annual Oregon Technology Awards

PORTLAND, Ore.-- Electro Scientific Industries, Inc. (Nasdaq: ESIO), a leading provider of world-class production laser systems for microengineering applications, today announced that it won the award for mid/small cap company of the year at the 2006 Oregon Technology Awards on November 16. In order to be the recipient of this award, a company needed to meet certain criteria that included...

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Laboratory and Research Supplies and Equipment

Spectrometer provides parts-per-million elemental analysis.

Fully integrated, laser-induced-breakdown LIBS-Elite provides real-time spectral analysis of elements in variety of materials down to 1 ppm. System incorporates Tempest Nd:YAG laser, multiple spectrometers, and 7 linear CCD-array detectors that provide broadband analysis. Sample chamber accommodates samples up to 2 in. dia, while integrated rotometer provides chamber purging when working with...

Read More »
Electronic Components & Devices

DPSS Wafer-Scribing System provides 10 wph throughput.

Optimized for 24/7 environments, AccuScribe AS2000FX utilizes UV DPSS laser technology and advanced optical and image-processing technologies. Industrial platform provides 4 in. wafer support and can be customized for various requirements. Wafer-edge detection system enables operator to scribe every inch of wafer as well as partial or broken wafers. With backside alignment capability, users can...

Read More »
Agricultural & Farming Products

Laser Cutting Systems utilize accessory kit.

Available in motorized and manual configurations, portable StageLaze Accessory Kit transforms QuickLaze systems into turnkey failure-analysis and micromachining solutions. Laser can be specified in single and multiple wavelength configurations, including IR, green, and UV, providing ability to cut variety of materials. Applications include removing discrete layers of materials, ITO shorts in LCD...

Read More »

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