Electro Scientific Industries, Inc.
Portland, OR 97229
New CapStone Flexible PCB Laser Processing Solution Features High Throughput Via Drilling
The new CapStone system provides a 2x throughput improvement for processing blind and through hole vias and increases yields. It also enables FPC manufacturers to meet aggressive production deadlines.
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ESI, Inc. Introduces the Allegro LC Test System for Handheld, IoT and Automotive Products
ESI’s new Allegro LC™ test system is designed for high-level testing of larger multilayer ceramic capacitors (MLCCs). It tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The system is capable of MLCC testing and sorting ranging fom 0603 (1608 metric) to 1210 (3225 metric). The Allegro LC system also uses ESI Control Center software to support the...
Read More »ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today announced that they have joined the...
Read More »ESI Receives Order for Flagship Flex PCB Via Drilling System
Multiple-system order for GemStone™ laser processing system will enable customer to meet high-volume flex PCB processing requirements PORTLAND, Ore. - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced receipt of a multi-unit order for its GemStone™ flex PCB laser processing system from a...
Read More »Material Handling System supports flex PCB processing.
Pairing with ESI's legacy FPC laser processing systems, RollMaster™ Roll-to-Roll System enables flex PCB manufacturers to process wide range of materials while maintaining high throughput. Unlike systems utilizing single-purpose designs, which rely on gravity tension to position rolled flex material for processing, Dynamic Tensioning™ continuously adjusts for changes in bi-directional tension...
Read More »Micromachining System optimizes drilling of silicon vias.
Employing 355 nm laser, Model Si5330 is capable of rapidly drilling and routing in most metals, organics, semiconductors, and hybrid-engineered materials. Via drill rates up to 2,000 vps are achievable, depending upon material, thickness, and via's size. System also utilizes digital beam positioner with esiCAM software, and has optical bench flexible enough to enable wide range of process...
Read More »Laser Repair System allows for turnkey integration.
Optimized for high g-force gantry operation to 3g, QuikLaze 200 and BDS1000 industrial microscope combine to create optomechanical platform that features bolt-on installation. Along with beam-shaping true color optics, beam delivery system, and camera port, FPD system offers selectable repetition rates from single shot to 50 Hz continuous, Tri-lite beam blending configurations, and rotational X-Y...
Read More »Wafer Scribing Systems deliver 12-14 wafers/hr.
Suited for demanding 24/7 production-line environments, semi-automated AccuScribe 2112 features automated alignment, positioning, focus, and partial wafer scribing, while fully automated AccuScribe 2150 includes automated loading and unloading of wafers from and to cassettes, eliminating need for operator. Both systems utilize UV DPSS laser technology and advanced optical and image processing...
Read More »Laser Ablation System features beam homogenizing optics.
As flexible analytical tool for range of materials, UP193-FX 193 nm short-pulse excimer laser ablation system is suited for bulk or micro-feature analysis and includes 13 pre-calibrated spot sizes with constant fluence. Use results in consistently smaller aerosol particles from all materials for optimal ionization and crater quality as well as minimal fractionation. System offers fully...
Read More »Spectrometer provides parts-per-million elemental analysis.
Fully integrated, laser-induced-breakdown LIBS-Elite provides real-time spectral analysis of elements in variety of materials down to 1 ppm. System incorporates Tempest Nd:YAG laser, multiple spectrometers, and 7 linear CCD-array detectors that provide broadband analysis. Sample chamber accommodates samples up to 2 in. dia, while integrated rotometer provides chamber purging when working with...
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New CapStone Flexible PCB Laser Processing Solution Features High Throughput Via Drilling
The new CapStone system provides a 2x throughput improvement for processing blind and through hole vias and increases yields. It also enables FPC manufacturers to meet aggressive production deadlines.
Read More »
ESI, Inc. Introduces the Allegro LC Test System for Handheld, IoT and Automotive Products
ESI’s new Allegro LC™ test system is designed for high-level testing of larger multilayer ceramic capacitors (MLCCs). It tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The system is capable of MLCC testing and sorting ranging fom 0603 (1608 metric) to 1210 (3225 metric). The Allegro LC system also uses ESI Control Center software to support the...
Read More »ESI Reports Strong Preliminary Third Quarter 2018 Financial Results
PORTLAND, Ore., Jan. 17, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today reported preliminary financial results for the fiscal 2018 third quarter ended December 30, 2017. For the third quarter ESI expects to report revenue of between $106 and $111 million, and adjusted earnings per diluted share...
Read More »ESI to Present at the 2018 Needham Growth Conference
PORTLAND, Ore., Jan. 05, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced that CEO Michael Burger is scheduled to present at the 20th Annual Needham Growth Conference taking place January 17-18, 2018 at the Lotte New York Palace Hotel in New York City. ESI’s presentation, focusing on...
Read More »ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today announced that they have joined the...
Read More »ESI Receives Order for Flagship Flex PCB Via Drilling System
Multiple-system order for GemStone™ laser processing system will enable customer to meet high-volume flex PCB processing requirements PORTLAND, Ore. - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced receipt of a multi-unit order for its GemStone™ flex PCB laser processing system from a...
Read More »Material Handling System supports flex PCB processing.
Pairing with ESI's legacy FPC laser processing systems, RollMaster™ Roll-to-Roll System enables flex PCB manufacturers to process wide range of materials while maintaining high throughput. Unlike systems utilizing single-purpose designs, which rely on gravity tension to position rolled flex material for processing, Dynamic Tensioning™ continuously adjusts for changes in bi-directional tension...
Read More »Micromachining System optimizes drilling of silicon vias.
Employing 355 nm laser, Model Si5330 is capable of rapidly drilling and routing in most metals, organics, semiconductors, and hybrid-engineered materials. Via drill rates up to 2,000 vps are achievable, depending upon material, thickness, and via's size. System also utilizes digital beam positioner with esiCAM software, and has optical bench flexible enough to enable wide range of process...
Read More »Laser Repair System allows for turnkey integration.
Optimized for high g-force gantry operation to 3g, QuikLaze 200 and BDS1000 industrial microscope combine to create optomechanical platform that features bolt-on installation. Along with beam-shaping true color optics, beam delivery system, and camera port, FPD system offers selectable repetition rates from single shot to 50 Hz continuous, Tri-lite beam blending configurations, and rotational X-Y...
Read More »Wafer Scribing Systems deliver 12-14 wafers/hr.
Suited for demanding 24/7 production-line environments, semi-automated AccuScribe 2112 features automated alignment, positioning, focus, and partial wafer scribing, while fully automated AccuScribe 2150 includes automated loading and unloading of wafers from and to cassettes, eliminating need for operator. Both systems utilize UV DPSS laser technology and advanced optical and image processing...
Read More »