Electro Scientific Industries, Inc.
Portland, OR 97229
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New CapStone Flexible PCB Laser Processing Solution Features High Throughput Via Drilling
The new CapStone system provides a 2x throughput improvement for processing blind and through hole vias and increases yields. It also enables FPC manufacturers to meet aggressive production deadlines.
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New CapStone Flexible PCB Laser Processing Solution Features High Throughput Via Drilling
The new CapStone system provides a 2x throughput improvement for processing blind and through hole vias and increases yields. It also enables FPC manufacturers to meet aggressive production deadlines.
Read More »
ESI, Inc. Introduces the Allegro LC Test System for Handheld, IoT and Automotive Products
ESI’s new Allegro LC™ test system is designed for high-level testing of larger multilayer ceramic capacitors (MLCCs). It tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The system is capable of MLCC testing and sorting ranging fom 0603 (1608 metric) to 1210 (3225 metric). The Allegro LC system also uses ESI Control Center software to support the control...
Read More »
ESI, Inc. Introduces the Allegro LC Test System for Handheld, IoT and Automotive Products
ESI’s new Allegro LC™ test system is designed for high-level testing of larger multilayer ceramic capacitors (MLCCs). It tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The system is capable of MLCC testing and sorting ranging fom 0603 (1608 metric) to 1210 (3225 metric). The Allegro LC system also uses ESI Control Center software to support the control...
Read More »ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today announced that they have joined the...
Read More »ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today announced that they have joined the...
Read More »ESI Receives Order for Flagship Flex PCB Via Drilling System
Multiple-system order for GemStone™ laser processing system will enable customer to meet high-volume flex PCB processing requirements PORTLAND, Ore. - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced receipt of a multi-unit order for its GemStone™ flex PCB laser processing system from a...
Read More »ESI Receives Order for Flagship Flex PCB Via Drilling System
Multiple-system order for GemStone™ laser processing system will enable customer to meet high-volume flex PCB processing requirements PORTLAND, Ore. - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced receipt of a multi-unit order for its GemStone™ flex PCB laser processing system from a...
Read More »Material Handling System supports flex PCB processing.
Pairing with ESI's legacy FPC laser processing systems, RollMaster™ Roll-to-Roll System enables flex PCB manufacturers to process wide range of materials while maintaining high throughput. Unlike systems utilizing single-purpose designs, which rely on gravity tension to position rolled flex material for processing, Dynamic Tensioning™ continuously adjusts for changes in bi-directional tension...
Read More »Material Handling System supports flex PCB processing.
Pairing with ESI's legacy FPC laser processing systems, RollMaster™ Roll-to-Roll System enables flex PCB manufacturers to process wide range of materials while maintaining high throughput. Unlike systems utilizing single-purpose designs, which rely on gravity tension to position rolled flex material for processing, Dynamic Tensioning™ continuously adjusts for changes in bi-directional tension...
Read More »
New CapStone Flexible PCB Laser Processing Solution Features High Throughput Via Drilling
The new CapStone system provides a 2x throughput improvement for processing blind and through hole vias and increases yields. It also enables FPC manufacturers to meet aggressive production deadlines.
Read More »
New CapStone Flexible PCB Laser Processing Solution Features High Throughput Via Drilling
The new CapStone system provides a 2x throughput improvement for processing blind and through hole vias and increases yields. It also enables FPC manufacturers to meet aggressive production deadlines.
Read More »
ESI, Inc. Introduces the Allegro LC Test System for Handheld, IoT and Automotive Products
ESI’s new Allegro LC™ test system is designed for high-level testing of larger multilayer ceramic capacitors (MLCCs). It tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The system is capable of MLCC testing and sorting ranging fom 0603 (1608 metric) to 1210 (3225 metric). The Allegro LC system also uses ESI Control Center software to support the control...
Read More »
ESI, Inc. Introduces the Allegro LC Test System for Handheld, IoT and Automotive Products
ESI’s new Allegro LC™ test system is designed for high-level testing of larger multilayer ceramic capacitors (MLCCs). It tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The system is capable of MLCC testing and sorting ranging fom 0603 (1608 metric) to 1210 (3225 metric). The Allegro LC system also uses ESI Control Center software to support the control...
Read More »ESI Reports Strong Preliminary Third Quarter 2018 Financial Results
PORTLAND, Ore., Jan. 17, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today reported preliminary financial results for the fiscal 2018 third quarter ended December 30, 2017. For the third quarter ESI expects to report revenue of between $106 and $111 million, and adjusted earnings per diluted share...
Read More »ESI Reports Strong Preliminary Third Quarter 2018 Financial Results
PORTLAND, Ore., Jan. 17, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today reported preliminary financial results for the fiscal 2018 third quarter ended December 30, 2017. For the third quarter ESI expects to report revenue of between $106 and $111 million, and adjusted earnings per diluted share...
Read More »ESI to Present at the 2018 Needham Growth Conference
PORTLAND, Ore., Jan. 05, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced that CEO Michael Burger is scheduled to present at the 20th Annual Needham Growth Conference taking place January 17-18, 2018 at the Lotte New York Palace Hotel in New York City. ESI’s presentation, focusing on...
Read More »ESI to Present at the 2018 Needham Growth Conference
PORTLAND, Ore., Jan. 05, 2018 - Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced that CEO Michael Burger is scheduled to present at the 20th Annual Needham Growth Conference taking place January 17-18, 2018 at the Lotte New York Palace Hotel in New York City. ESI’s presentation, focusing on...
Read More »ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today announced that they have joined the...
Read More »ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the micromachining industry, today announced that they have joined the...
Read More »