Samtec, Inc.
New Albany, IN 47150
Interconnects include guidepost and latching mechanism.
Power Mate(TM) IPBS Series .165 in. pitch socket mates with IPBT Series header for isolated connection in parallel or perpendicular board orientations. IPBD Series discrete wire socket mates to IPBT Series header for wire-to-board connection. Units transfer up to 15 A through each contact in board-to-board applications and up to 12 A in wire-to-board situations using 18 AWG wire. Pin counts range...
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Flex-Cable Data Links mate to connectors on .0394 in. pitch.
Series MEJ1 double-sided data links mate with MEC1 Series Mini-Edge Card connectors. Data links are available in 5 in. lengths with 60 conductors and in 10 in. lengths with 40 conductors. Mini-Edge Card connector styles include vertical, right-angle, and edge mount. Pin counts from 10-140 are available for mating with .062 in. thick printed circuit boards. Polarized connectors have board-lock...
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High Speed Interconnects minimize crosstalk.
High Speed Interconnect line includes variety of micro pitch (0.5, 0.635, and 0.8 mm) units with controlled impedance for enhanced signal integrity. Q-Strip(TM) interconnects are rated up to 2.33 GHz while Q-Pairs(TM) interconnects are rated up to 10 GHz. Designs include right-angle and edge-mount for perpendicular and horizontal board mating in single-ended and differential pairs configurations....
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High Speed Interfaces offer guide post option.
Series QTE/QSE-GP .8 mm pitch interfaces use Guide Post to accurately align connector when mating. They are rated for use up to 2.33 GHz, depending on application and interface. Mounting configurations allow for traditional parallel board stacking, and perpendicular mating of boards such as in daughtercard applications and horizontal (coplanar) type applications. Interfaces are suitable for...
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Cages and Connectors suit optical transceiver applications.
OptoCage(TM) SFP (Small Form-factor Pluggable) cages complement 20-pin connectors (MECT series). With one-piece design, EMI suppression characteristics, and rigid materials and construction, OptoCage ensures stability and retention force. SMT connectors and cages (including press-fit, PCI press-fit, and solder lead versions) are designed to exact SFP specification, making them compatible with all...
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Headers, Sockets, and Terminals provide 200 I/O in
Four-row surface mount FourRay(TM) headers and sockets (TOLC/SOLC Series) offer board stack heights of .250, .315, .394, and .472 in. SOLC series socket construction offers tuning fork style Tiger Buy contacts. FOLC Series socket construction offers 3-finger Beryllium Copper Tiger-Eye contacts. MOLC Series connectors are available in pin counts from 20 to 50 positions in multiples of 5 per row...
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Ejector Headers mate with .050 , .100 , and 2 mm cable systems.
EHF Series double row surface mount ejector headers on .050 in. pitch are available in 7 pin counts from 10 through 50 pins. Mated height is .445 in. above board. EJH Series surface mount and through-hole ejector headers on .100 in. pitch come in 6 double-row pin counts from 10 through 50 pins, with mated height of .665 in. EHT Series surface mount, through-hole and right-angle ejector headers...
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Tiny Connectors stack small form factor boards
Micro pitch pin and socket connectors work in micro/miniature applications. Square terminals mate with dual beam Tiger Claw or single beam Tiger Beam contacts. The 0.0315 in. system includes FTE Series headers and AW Series stackers which provide board spacings from 0.0197 to 0.355 in. when mated with CLE Series sockets. The 0.0394 pitch system has FTM Series headers and MW Series stackers with...
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Card Interfaces offer one-piece configuration.
One-piece FSI, SEL, SCC, SIB, OPP and SEI Series interfaces reduce number of components required for board stacking. They have threaded inserts to mount connectors to boards. FSI dual row interfaces on 1 mm pitch provide board spacings from 3 to 10 mm; for low profile applications, SEL and SEI are available with up to 30 contacts in single row; SCC has Smart Card interfaces, OPP is one-piece...
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Interfaces offer high retention contacts.
Micro-Rugged Interfaces have shrouded and keyed insulators, and PCB terminations including press fit, solder locks, and mechanical hold-down options. Board-to-board interfaces are available on .050 in., 2 mm, and .100 in. pitch. Micro Card interfaces for .031 and .062 in. boards have terminations on .8 mm and 1 mm pitch. Standard and high speed IDC cable systems are available on .050 in., 2 mm,...
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