Samtec, Inc.
New Albany, IN 47150
Connectors suit disk drive-to-board applications.
Storage Combo(TM) connectors eliminate need for flat ribbon cables and power wire harnesses that are used when connecting hard drives. They are PCB mountable with straight through-hole, right-angle, reversed right-angle, and edge-mount tail configurations. Interfaces mate to IDE/ATA, SCSI2, and Wide SCSI hard drives.
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Connector eliminates bent pins.
Power-Edge(TM) PEC Series has edge card interface with 3, 7 or 10 contacts. One-piece interface is rated up to 5 A and has contacts on .100 in. pitch. Built-in card latches increase withdrawal force required for removing power board. Optional alignment pins and locking clips can be provided.
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One-piece Interfaces connect to power boards.
OPP Series one-piece power interface, rated up to 5 A, eliminates bent pin problems of multi-component devices. Connectors are soldered to main board and power board is attached by either metric or English mechanical fasteners. Interfaces are available with choice of 3, 7 or 10 contacts on 0.100 in. pitch. Optional alignment pins can be provided on top, bottom or both sides to ease processing,...
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PCB Interfaces provides up to 300 I/Os per connector.
FleXYZ interfaces provide flexibility in X, Y, and Z axes by specifying number of rows, pins per row, and desired board spacing with standard interconnects. YTT Series headers and YTW Series board stackers mate with YTQ and YTS Series sockets to provide board spacings from 0.329 to 1.165 in. By using YTE Series elevated socket, board spacing can be increased to 1.705 in. Interconnects have 4-6...
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Interconnects combine differential and single ended systems.
Q-Pair high speed interconnects in differential pair configurations allow electrical performance at up to 5GHz operating frequencies. Connectors can be partitioned to include both differential pair and single-ended signal pins, allowing board designer to optimize system for high speed where required, while minimizing impact on density.
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Headers and Sockets are available in various heights.
PTT Series press fit 2mm pitch headers and PTF Series sockets provide board-to-board spacing of 8,36mm when mated. Elevated version of PTF socket provides mated height of 11,15mm. Dual row interconnects are available in any number of positions per row up to 50. ESQT Series interconnects meet all PC 104+ specifications by providing 4 rows x 30 positions; 9,35mm socket height; and both...
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Board Stackers offer design flexibility.
On .100 in. pitch, single, double and triple row through-hole headers (MTSW Series) and stackers (ZW Series), surface mount board stackers (HW Series) and shrouded headers (ZSS Series) are available for board stacking. For micro pitch, board stackers are available on .8mm pitch (AW Series), 1mm pitch (MW Series), .050 in. pitch (FW Series), .050 in. x .100 in. pitch (DWM Series) and 2mm pitch (TW...
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Interconnects are available with 10 to 100 I/Os.
TFM and SFM Series .050 in. pitch interconnects are designed for applications requiring blind mating and/or high number of mating cycles. They are available with board spacings from .236 to 1.472 in. Three-finger Tiger-Eye contacts in SFM Series are stamped and formed with soft Beryllium Copper and heat-treated to optimize spring properties. Tiger Eye LITE three-finger contact is also available...
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IDC Systems are available in various sizes.
FFSD Series IDC system features contacts on 0.050 in. x 0.050 in. pitch and is available in double row designs. Assembly measures 0.200 in. tall and includes 4-finger Beryllium Copper contacts with 10 to 25 positons per row. Notch polarization is standard. TCMD Series system features contacts on 0.0787 in. x 0.0787 in. pitch with square Phosphor Bronze pins and 2 to 25 positions per row. TCSD...
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