High Speed Interconnects minimize crosstalk.
Press Release Summary:
High Speed Interconnect line includes variety of micro pitch (0.5, 0.635, and 0.8 mm) units with controlled impedance for enhanced signal integrity. Q-Strip(TM) interconnects are rated up to 2.33 GHz while Q-Pairs(TM) interconnects are rated up to 10 GHz. Designs include right-angle and edge-mount for perpendicular and horizontal board mating in single-ended and differential pairs configurations. Board stacking space ranges from 5 to 30 mm in height.
Original Press Release:
Samtec High Speed Interconnect Variety Provides Multiple Design Solutions
Samtec's expanded High Speed Interconnect product line includes a large variety of new micro pitch (0,5mm, 0.635mm and 0,8mm) interconnects with controlled impedance for enhanced signal integrity. These interconnects are designed to minimize crosstalk and optimize capacitance and inductance. Samtec Q-Strip(TM) interconnects are rated at up to 2.33 GHz while Q-Pairs(TM) interconnects are rated at up to 10 GHz.
New designs include right-angle and edge-mount for perpendicular and horizontal board mating in single-ended and differential pairs configurations. Miniature coax cable and shielded flex cable have been added. Board stacking space ranges have been expanded to include a variety of options from 5mm to 30mm in height.
Samtec also offers a number of high density solutions for achieving high speed interfaces, with designs on 1 mm pitch and (1,27mm) .050" pitch.
For more information on Samtec's High Speed Interfaces, contact: Samtec, Inc. o P.O. Box 1147 o New Albany, IN 47151-1147 o Phone: 1-800-SAMTEC-9. or 812-944-6733 o Fax: 812-948-5047 o Internet: www.samtec.com o E-mail: info@samtec.com.
